Patents Assigned to Mitsui
-
Patent number: 12195896Abstract: Provided are a non-woven cloth and a layered non-woven cloth that are preferred as a skin material for a composite sound-absorbing material, which has excellent moldability and exceptional shape stability, and with which it is possible to achieve an adequate sound-absorption effect even in thin low-weight regions.Type: GrantFiled: December 12, 2019Date of Patent: January 14, 2025Assignee: Mitsui Chemicals Asahi Life Materials Co., Ltd.Inventors: Shinya Yamamuro, Chie Okamura, Rumina Obi, Eiji Shiota, Kazufumi Kato, Yasuo Nakanishi
-
Patent number: 12195098Abstract: An opening/closing mechanism for a tail gate includes a hinge device configured to rotate the tail gate relative to side walls, and a latch device configured for engagement with a striker provided on the side wall to hold the tail gate in a closed state. The hinge device includes an electric driving device provided on the tail gate and configured to rotate the tail gate by means of a motor, and a coupling configured to couple a body-side engagement portion provided on the side wall and an output shaft of the electric driving device together. The output shaft of the electric driving device fits in a fitting hole portion in a first cylindrical portion formed at one end side of the coupling, and the body-side engagement portion fits in a fitting recessed portion in a second cylindrical portion formed at the other end side of the coupling.Type: GrantFiled: July 29, 2020Date of Patent: January 14, 2025Assignee: MITSUI KINZOKU ACT CORPORATIONInventors: Yoshiaki Yokota, Kohei Yamashita
-
Patent number: 12193153Abstract: There is provided a laminate that can suppress the warpage of a laminated product when used for the manufacture of the laminated product. This laminate includes a float glass substrate having a top surface and a bottom surface; and a metal layer provided on the top surface side of the float glass substrate.Type: GrantFiled: May 11, 2021Date of Patent: January 7, 2025Assignee: MITSUI MINING & SMELTING CO., LTD.Inventors: Rintaro Ishii, Toshimi Nakamura, Yoshinori Matsuura
-
Publication number: 20250002653Abstract: An episulfide composition, including: an episulfide compound (A) that comprises an episulfide ring, and a polysulfide bond in which three or more sulfide bonds represented by —S— are linked together; and an episulfide compound (B) that comprises an episulfide ring and a (di)sulfide bond but not the polysulfide bond, wherein the content of the episulfide compound (A) is 100 ppm by mass or more with respect to a total amount of the episulfide composition.Type: ApplicationFiled: August 5, 2022Publication date: January 2, 2025Applicant: MITSUI CHEMICALS, INC.Inventors: Koichi TOKUNAGA, Masayuki FURUYA
-
Publication number: 20250002724Abstract: The present invention relates to a method for manufacturing an optical material comprising the following steps: i) mixing: A. at least one polymerizable component comprising at least one diallyl compound, B. at least one UV and/or HEV light-absorbing agent, C. at least one tetraazaporphyrin dye, D. at least one peroxydicarbonate esters as radical polymerization initiator, to obtain a polymerizable composition; ii) casting the polymerizable composition in at least one mould; iii) curing the polymerizable composition to obtain a solid polymerized molded element and extracting the solid polymerized molded element from the mould; iv) heat treating the solid polymerized molded element at a temperature within the range of from 50 degree C. to 150 degree C. to obtain the optical material.Type: ApplicationFiled: April 18, 2022Publication date: January 2, 2025Applicant: MITSUI CHEMICALS, INC.Inventors: Andrea VECCHIONE, Roberto FORESTIERI, Francesco MARIANI
-
Publication number: 20250002137Abstract: The present invention provides a blade in which the specific rigidity of a flap part is further increased. This blade has a thick body part and a thin flap part integrally formed in the rear end of the body part. The flap part has a skin material containing a fiber-reinforced thermoplastic resin, and a core material containing a thermoplastic resin foam filled inside the skin material.Type: ApplicationFiled: November 4, 2022Publication date: January 2, 2025Applicant: Mitsui Chemicals, Inc.Inventors: Kazuya MIZUMOTO, Yoshihiko KANDA
-
Patent number: 12179467Abstract: Provided is a composite sound-absorbing material that can exhibit sound absorption properties in a broad range of low frequencies, intermediate frequencies, and high frequencies even in a low-basis-weight region having low thickness. The composite sound-absorbing material according to the present invention is configured from two or more layers including a base material and a skin material, the skin material being positioned on the outermost layer, wherein the composite sound-absorbing material is characterized in that the ratio (skin material:base material) of the surface area (m2/m2) per unit area of the skin material and the surface area (m2/m2) per unit area of the base material is at least 1:5 and less than 1:40.Type: GrantFiled: May 18, 2021Date of Patent: December 31, 2024Assignee: Mitsui Chemicals Asahi Life Materials Co., Ltd.Inventors: Shinya Yamamuro, Chie Okamura, Yasuo Nakanishi, Takashi Komatsu, Eiji Shiota
-
Patent number: 12180756Abstract: A vehicle door operating device including: a closing latch unit holding a door in a closed position, wherein the door is supported on a vehicle body to open and close; a fully opening latch unit holding the door in a fully open position; an actuator having a motor; an emergency handle operated manually from a vehicle interior side; and an operation relay unit which operates the closing latch unit and the fully opening latch unit to be unlatched respectively when driven by the actuator, and operates the closing latch unit to be unlatched when manually operated by the emergency handle such that the closing latch unit is held in an unlatched state.Type: GrantFiled: August 16, 2022Date of Patent: December 31, 2024Assignee: MITSUI KINZOKU ACT CORPORATIONInventors: Kosuke Ando, Fuyuki Nakatsuka, Jain Anil, Ahmed Tanveer
-
Publication number: 20240424452Abstract: The present invention provides: a porous membrane comprising polytetrafluoroethylene and/or modified polytetrafluoroethylene, which has a small pore diameter, is difficult to break, and is resistant to an external force such as penetration and the like; and a manufacturing method of same. Further provided is a porous membrane comprising polytetrafluoroethylene and/or modified polytetrafluoroethylene, where the bubble point due to isopropyl alcohol in accordance with JIS K3832 is 500 kPa or more, a numerical value obtained by dividing the maximum force until a needle penetrates by the thickness of a test piece is 200 mN/?m or more, based on a needle penetration strength test in accordance with JIS Z1707, the percentage of pore opening portions in a surface image by electron microscopy is 10 to 30%, and the fiber thickness is 250 nm or more.Type: ApplicationFiled: January 31, 2022Publication date: December 26, 2024Applicant: CHEMOURS-MITSUI FLUOROPRODUCTS CO., LTD.Inventors: KEN MIURA, SHUNNOSUKE FUKAZAWA, KOHEI MIYAMAE, HARUKA ONO, SHUNICHI SHIMATANI, KAZUO KONABE
-
Patent number: 12173203Abstract: An adhesive resin composition contains an ethylene-vinyl acetate copolymer (A) in which a content of a structural unit derived from vinyl acetate is 3% by mass or more and 18% by mass or less, and a melt mass flow rate (MFR, JIS K 7210:1999, 190° C., 2160 g load) is 5 g/10 min or more and 40 g/10 min or less, a tackifier resin (B), and an ethylene-vinyl acetate copolymer (C) having a viscosity of 15,000 mPa·s or more and 300,000 mPa·s or less measured at 18° C. using a Brookfield viscometer.Type: GrantFiled: March 11, 2020Date of Patent: December 24, 2024Assignee: DOW-MITSUI POLYCHEMICALS CO., LTD.Inventors: Hidenori Hashimoto, Takuya Ogata
-
Patent number: 12172816Abstract: A packaging body configured with a packaging film, in which the outermost layer is a polyethylene-based resin layer and the polyethylene-based resin layer is uniaxially or biaxially stretched.Type: GrantFiled: September 16, 2020Date of Patent: December 24, 2024Assignee: MITSUI CHEMICALS TOHCELLO, INC.Inventors: Masayuki Sakurai, Tsutomu Kubota, Hiroyuki Wakaki, Tatsuya Toyama
-
Patent number: 12176150Abstract: A double-sided copper-clad laminate that includes an adhesive layer and a copper foil in order on each of both surfaces of a resin film, the resin film is in a cured state at 25° C., and each of the copper foils has a maximum peak height Sp of 0.05 ?m or more and 3.3 ?m or less as measured in accordance with ISO 25178 on a surface on a side being in contact with the adhesive layer.Type: GrantFiled: April 4, 2023Date of Patent: December 24, 2024Assignee: MITSUI MINING & SMELTING CO., LTD.Inventors: Ryuji Ishizuka, Yoshihiro Yoneda, Toshihiro Hosoi, Yuji Kageyama
-
Publication number: 20240415384Abstract: Provided is an information processing device including: a measurement data acquisition unit that acquires gradation characteristics which are a data set obtained by measuring the spectral radiance of an optotype presentation device that presents an optotype to a subject, at plural gradation values of plural primary colors; a stimulus value calculation unit that calculates a stimulus value at each gradation value based on the gradation characteristics; and a function generation unit that fits a predetermined function related to the gradation characteristics to a relationship between the stimulus value and the gradation value.Type: ApplicationFiled: October 20, 2022Publication date: December 19, 2024Applicant: MITSUI CHEMICALS, INC.Inventors: Kenji SUZUKI, Shoko MATSUMURA
-
Publication number: 20240418504Abstract: A measurement method capable of acquiring, in a simple manner, a surface parameter of copper foil exhibiting high correlation with high frequency characteristics, the method including: (a) acquiring a surface profile of surface-treated copper foil as a reference; (b) setting a cutoff value for an L filter, the cutoff value satisfies: (i) an arithmetical mean height Sa after processing with the L filter, being 0.5 ?m or less, and (ii) a percent change of Sdr or ? value after processing with the L filter being 80% or less; (c) acquiring a surface profile of surface-treated copper foil as a measurement object; (d) subjecting the acquired surface profile of the copper foil as the measurement object to filter processing; and (e) calculating at least one of surface parameters defined in ISO25178 on the copper foil as the measurement object based on the surface profile after the filter processing.Type: ApplicationFiled: December 14, 2022Publication date: December 19, 2024Applicant: MITSUI MINING & SMELTING CO., LTD.Inventors: Hiroaki KURIHARA, Takeshi IWASE
-
Patent number: 12168838Abstract: Provided is an electrodeposited copper foil having high smoothness and exhibiting high flexibility (particularly, high flexibility after annealing at 180° C. for 1 hour) suitable for a flexible substrate. This electrodeposited copper foil has an Rz of 0.1 to 2.0 ?m on at least one surface. In cross-sectional analysis by EBSD, a proportion of an area occupied by copper crystal grains satisfying the following conditions relative to an area of an observation field occupied by copper crystal grains is 63% or more. The conditions are as follows: i) (101) orientation; ii) an aspect ratio of 0.500 or less; iii) |sin ?| of 0.001 to 0.707, where ? (°) is an angle between a normal line of an electrode surface of the electrodeposited copper foil and a major axis of the copper crystal grain; and iv) when the crystal is elliptically approximated, a length of a minor axis of 0.38 ?m or smaller.Type: GrantFiled: January 14, 2021Date of Patent: December 17, 2024Assignee: MITSUI MINING & SMELTING CO., LTD.Inventors: Daisuke Nakajima, Mitsuyoshi Matsuda, Yasuji Hara, Mitsuhiro Wada
-
Patent number: 12171067Abstract: There is provided a method for manufacturing a printed wiring board that effectively suppresses pattern failure and is also excellent in fine circuit forming properties. This method includes: providing an insulating substrate including a roughened surface; performing electroless plating on the roughened surface of the insulating substrate to form an electroless plating layer less than 1.0 ?m thick having a surface having an arithmetic mean waviness Wa of 0.10 ?m or more and 0.25 ?m or less and a valley portion void volume Vvv of 0.010 ?m3/?m2 or more and 0.028 ?m3/?m2 or less; laminating a photoresist on the surface of the electroless plating layer; performing exposure and development to form a resist pattern; applying electroplating to the electroless plating layer; stripping the resist pattern; and etching away an unnecessary portion of the electroless plating layer to form a wiring pattern.Type: GrantFiled: March 17, 2020Date of Patent: December 17, 2024Assignee: MITSUI MINING & SMELTING CO., LTD.Inventors: Yoshinori Shimizu, Hiroto Iida, Misato Mizoguchi, Akitoshi Takanashi, Makoto Hosokawa
-
Patent number: 12168738Abstract: An adhesive resin composition including a propylene polymer (A), an ethylene polymer (B), and a thermoplastic resin (C) including a copolymer containing not less than 60 mol % and not more than 99 mol % of structural units derived from 4-methyl-1-pentene, and not less than 1 mol % and not more than 40 mol % of structural units derived from a C2-C20 ?-olefin other than 4-methyl-1-pentene, these structural units representing total 100 mol % of the copolymer, the thermoplastic resin (C) showing a melting point Tm of not more than 199° C. or showing substantially no melting point as analyzed with a differential scanning calorimeter (DSC). The total of the components (A), (B) and (C) includes 45 to 75 parts by mass of the component (A), 5 to 20 parts by mass of the component (B), and 15 to 45 parts by mass of the component (C).Type: GrantFiled: January 6, 2020Date of Patent: December 17, 2024Assignee: Mitsui Chemicals, Inc.Inventors: Akihiko Iwashita, Ryohei Shiga, Motoyasu Yasui, Yoshisada Fukagawa, Kyoko Kobayashi, Masahiko Okamoto
-
Patent number: 12165904Abstract: In order to provide a component manufacturing apparatus and a component manufacturing method that can normally chuck and fix a component holding film to a chuck table in a heated state, the present component manufacturing apparatus 1 includes a chucking and fixing means 20 that chucks and fixes a component holding film to a heated chucking surface 21a, and a preventing means 30 that prevents heat convection, occurring on the chucking surface 21a, from contacting the film. The present component manufacturing method includes a setting step of chucking and fixing the film to the heated chucking surface 21a, and the setting step includes a preventing step of preventing heat convection, occurring on the chucking surface 21a, from contacting the film.Type: GrantFiled: May 30, 2018Date of Patent: December 10, 2024Assignee: MITSUI CHEMICALS TOHCELLO, INC.Inventor: Eiji Hayashishita
-
Publication number: 20240400748Abstract: A monomer composition contains: a tin-free catalyst (A); and a (meth)acrylate monomer (D) that is a reaction product of an iso(thio)cyanate compound (B) and an alcohol compound (C). In this monomer composition, a content of an amide compound containing at least one of a carboxylic acid amide group or a sulfonamide group is less than 1 ppm by mass with respect to a total amount of the monomer composition.Type: ApplicationFiled: January 14, 2022Publication date: December 5, 2024Applicant: MITSUI CHEMICALS, INC.Inventor: Naoyuki KAKINUMA
-
Publication number: 20240402590Abstract: A pellicle includes an adhesive layer. At least one of an inner wall surface or an outer wall surface of the adhesive layer satisfies Formula (1) below. ( [ A 2 ? s ] ? / [ A 5 ? 0 ? s ] ) ? 0 . 9 ? 7 Formula ? ( 1 ) In Formula (1), A2 s represents a normalized intensity of a partial structure contained in a main agent component obtained by analyzing a first deep portion having a first depth from a surface of the adhesive layer by TOF-SIMS. The first depth is formed by irradiating a 600 ?m square area of the surface with a sputter ion gun for a total of 2 seconds. A50 s represents a normalized intensity of a partial structure contained in a main agent component obtained by analyzing a second deep portion where the depth is a second depth by TOF-SIMS. The second depth is formed by irradiating the area with the sputter ion gun for a total of 50 seconds.Type: ApplicationFiled: September 12, 2022Publication date: December 5, 2024Applicant: MITSUI CHEMICALS, INC.Inventors: Hirofumi TANAKA, Yosuke ONO, Akira ISHIKAWA, Yasushi SATOH, Hisako ISHIKAWA, Masashi FUJIMURA, Atsushi OKUBO, Kazuo KOHMURA