Abstract: The electric actuator comprises an electric brushless motor having a rotor and a stator, and the control board has a plurality of electric components and controls operation of the brushless motor. The control board comprises a main board and a small board that has a smaller planar shape than the main board and that is connected to the main board via a connecting member. The small board has one or more electric components, faces the rotor, and is arranged at a position closer to the rotor than is the main board in the rotation axis direction of the rotor.

Abstract: A vehicular door lock device includes: a housing; an electrical component that is arranged on the housing; a terminal that is electrically connected to the electrical component and made of a conductive thin plate including a connecting portion configured to connect adjacent conductive portions; and an electrical circuit related to the electrical component, the electrical circuit being formed by dividing the conductive portions from each other by shearing off the connecting portion, wherein the housing includes engagement grooves that are opened at right angles with respect to mounting portions on which the conductive portions of the terminal are mounted, the terminal includes the conductive portions and pins that are arranged at end portions of the conductive portions, bent at right angles, and configured to engage with the engagement grooves, and the pins are formed by folded portions that are obtained by folding end portions of the terminal at 180 degrees.

Abstract: Provided is a beta zeolite satisfying P>76.79Q?29.514 in a range in which Q is less than 0.4011 nm, wherein, P represents an AB value that is an intensity ratio of A to B, A represents a diffraction intensity of a main peak of the beta zeolite observed by X-ray diffraction measurement, B represents a diffraction intensity of the (116) plane of ?-alumina obtained by X-ray diffraction measurement under the same conditions as those for the X-ray diffraction measurement on the beta zeolite, the ?-alumina being the standard substance 674a distributed by the American National Institute of Standards and Technology, and Q represents a lattice interplanar spacing of the main peak of the beta zeolite observed by X-ray diffraction measurement. It is preferable that the formula (1) above is satisfied in a range in which Q is from 0.3940 to 0.4000 nm.

Abstract: The polyisocyanate composition contains a polyisocyanate having an isocyanatomethyl group, and a 1-nylon type polymer. The ratio of the mass of the amide bond in the polyisocyanate composition with respect to the mass of the isocyanate group in the polyisocyanate composition is 8000 ppm or less.

Abstract: The present invention provides a pellicle frame (excluding a pellicle frame containing quartz glass) having a rectangular shape, which has: one end face to be provided with an adhesive layer capable of adhering to a photomask; and the other end face for supporting a pellicle film. The one end face has an amount of twist ?d of 10 ?m or less. The amount of twist ?d of the one end face indicates the maximum value of the distance between a virtual plane that passes through three points, of four points at four corners of the one end face, and one remaining point.

Abstract: Provided is a coating composition capable of forming a coating film capable of maintaining excellent tack-free properties (releasability) for a long period of time on a plastic substrate or a rubber substrate, and particularly an elastic substrate made of rubber. The coating composition contains a rubber and an oil that is a liquid at 25° C., wherein the oil is dispersed at an average particle diameter of 50 ?m or less.

Abstract: A method for manufacturing a wiring substrate that includes: providing a laminated sheet that includes a release layer and a metal layer in order on a carrier; forming a cut from a surface of the laminated sheet opposite to the carrier so that the cut passes through the inside of an outer edge portion of the laminated sheet and so that the cut penetrates the metal layer and the release layer, and dividing the metal layer and the release layer into a central portion and a peripheral portion with the cut as a boundary; and inserting a thin piece from the cut toward the central portion side of the metal layer or the release layer to form a gap between the metal layer and the carrier in which an insertion angle of the thin piece is greater than 0°.

Abstract: Disclosed is a pellicle including a pellicle membrane including a carbon-based membrane having a carbon content of 40% by mass or more and a support frame that supports the pellicle membrane, in which the pellicle membrane and the support frame are in contact with each other, and at least one of the following conditions 1 and 2 is satisfied. [Condition 1] In the support frame, a surface in contact with the pellicle membrane has a roughness Ra of 1.0 ?m or less. [Condition 2] The support frame has a width of unevenness of 10 ?m or less at an edge portion on a surface side in contact with the pellicle membrane and on an inner side of the pellicle.

Abstract: A back grinding adhesive film used to protect a surface of a wafer. This adhesive film includes a base material layer, and an adhesive resin layer which is provided on one surface side of the base material layer and configured with an ultraviolet curable adhesive resin material. The ultraviolet curable adhesive resin material has a loss tangent tan ? at ?5° C. of 0.25 to 0.85.

Abstract: A door latch device includes: a first position switch and a second position switch, each including a first contact hole, a second contact hole, and a common contact hole; a common pin configured to be electrically conducted to the common contact hole of the first position switch and the first contact hole of the second position switch by being inserted therein; a first signal pin configured to be electrically conducted to the first contact hole of the first position switch by being inserted therein; and a second signal pin configured to be electrically conducted to the common contact of the second position switch by being inserted therein, wherein the first position switch and the second position switch are configured to perform a switch operation at a same timing of an operation of a predetermined operation detection target.

Abstract: A bonding material includes: a copper foil; and a sinterable bonding film formed on one surface of the copper foil. The bonding film contains a copper powder and a solid reducing agent. The bonding material is used for bonding to a bonding target having, on its surface, at least one metal selected from the group consisting of gold, silver, copper, nickel, and aluminum. The bonding material is also used as a material for wire bonding. A bonded structure is also provided in which a bonding target having a metal layer formed on its surface and a copper foil are electrically connected to each other via a bonding layer formed of a sintered structure of a copper powder, wherein the metal layer contains at least one metal selected from the group consisting of gold, silver, copper, nickel, and aluminum.

Abstract: A component manufacturing method includes a step of obtaining a holding tool. The holding tool includes: a frame body having an opening; and a holding film placed on the frame body. The step is a step of placing the holding film on the frame body while stretching the holding film in at least three different directions or in all directions to the frame body. The holding film includes a base layer and a holding layer. The holding tool forming device includes: a mechanism that pushes a plain film from a base layer side to bring about a stretched state; a mechanism that fixes the plain film to the frame body such that the stretched state is maintained; and a mechanism that isolates an unnecessary portion from the plain film to obtain the holding film.

Abstract: Provided are a method for affixing a protective film, a method for manufacturing a semiconductor component, and a protective film for use in the affixing method, which are capable of suppressing occurrence of a failure caused by a step on a main surface of a semiconductor wafer. The affixing method includes: an arrangement step of arranging a protective film so as to cover a main surface A of a semiconductor wafer; and an affixing step of pressing the protective film against the main surface to affix the protective film to the main surface. The affixing step includes a compression step of compressing the protective film in a thickness direction thereof.

Abstract: An aqueous suspension-form pesticidal composition comprising: at least one pesticidal active ingredient selected from the group consisting of amine derivatives represented by the following general formula (1) and salts thereof; a highly-purified and partially-desulfonated lignosulfonate; and an aqueous dispersion medium

Abstract: An injection molding apparatus includes a substantially circular first substrate, a substantially circular second substrate disposed to face a surface of the first substrate, a fixing member which fixes a peripheral end portion of the first substrate and a peripheral end portion of the second substrate, and an injection portion which is provided in the fixing member and from which a composition is injected into a gap between the first substrate and the second substrate, in which a space connecting with the injection portion and the gap is provided in at least a part of a periphery of the gap, and a width of the space in a thickness direction is larger than a width of the gap in the thickness direction.

Abstract: A back grinding adhesive film used to protect a surface of a wafer, the back grinding adhesive film including a base material layer, and an adhesive resin layer which is provided on one surface side of the base material layer and configured with an ultraviolet curable adhesive resin material. Here, regarding the ultraviolet curable adhesive resin material, when a storage elastic modulus at ?15° C. is defined as E? (?15° C.) and a storage elastic modulus at 100° C. is defined as E? (100° C.) in a case where a viscoelastic characteristic is measured, E? (100° C.) is 1.0×106 to 3.5×107 Pa, and E?) (100° C./E? (?15° C.) is 2.0×10?3 to 1.5×10?2.

Abstract: A vehicle door operation device includes an inside handle, a full open unlocking lever for transmitting a closing operation of the inside handle to a full open door latch device, and a full closure unlocking lever for transmitting an opening operation of the inside handle to a full closure door latch device. The inside handle has first and projecting portions, and when the inside handle rotates in a first direction by the closing operation, the first projecting portion is brought into abutment with the full open unlocking lever to enable the full open unlocking lever to operate, whereas when the inside handle rotates in a second direction by the opening operation, the second projecting portion is brought into abutment with the full closure unlocking lever to enable the full closure unlocking lever to operate.

Abstract: A model generating method causing a computer to execute processing of acquiring electroencephalographic data of subjects based on outputs of an electroencephalograph, acquiring sensitivity information of the subjects by inputting the acquired electroencephalographic data to a first learning model trained to output the sensitivity information in accordance with input of the electroencephalographic data, acquiring biological data of the subjects based on outputs of a piezoelectric element, and generating a second learning model for outputting the sensitivity information of a person being tested by using a data set including the acquired biological data and the sensitivity information of the subjects acquired from the first learning model as training data when the biological data of the person measured by the piezoelectric element is input.

Abstract: A method for manufacturing an electronic device at least includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side, and a step (C) of irradiating the adhesive film with an ultraviolet ray and then removing the adhesive film from the wafer. The adhesive film includes a base material layer, and an adhesive resin layer configured with an ultraviolet curable adhesive resin material. The adhesive resin layer of the adhesive film after being irradiated with an ultraviolet ray has a storage elastic modulus at 5° C. of 2.0×106 to 2.0×109 Pa, and a storage elastic modulus at 100° C. of 1.0×106 to 3.0×107 Pa.

Abstract: The resin composition contains at least one resin (S) selected from the group consisting of an ethylene??-olefin copolymer (A) including a structural unit derived from an ?-olefin having 3 or more carbon atoms and satisfying the following requirements (a-1) to (a-3), and an acid-modified product (B) of the ethylene??-olefin copolymer (A): (a-1) a kinematic viscosity at 100° C. is 10 to 5,000 mm2/s, (a-2) a content rate of a structural unit derived from an ?-olefin having 3 or more carbon atoms is 60 to 85 mol %, and (a-3) a molecular weight distribution (Mw/Mn) is 2.5 or less.