Abstract: A maneuvering system for a ship provided with, in the stern, a port-side propulsion system, and a starboard-side propulsion system. For controlling the system, a forward or backward force of the ship 1 is obtained by the difference between the forward and backward propulsion forces of the propulsion systems and a first turning moment in a turning direction of the ship generated by the propulsion forces is offset by a second turning moment in the turning direction of the ship generated by steering a port-side rudder, whereby the ship moves in a transversal manner toward its starboard side while rotation of the ship is avoided. A high degree of maneuverability is thereby achieved with a relatively simple maneuvering operation.

Abstract: A method for manufacturing a semiconductor device according to the present invention includes at least the following four steps: (A) a step of preparing a structure (100) including an adhesive laminate film (50) having a heat-resistant resin layer (10), a flexible resin layer (20) and an adhesive resin layer (30) in this order, and one or two or more semiconductor chips (70) adhered to the adhesive resin layer (30); (B) a step of confirming an operation of the semiconductor chips (70) in a state of being adhered to the adhesive resin layer (30); (C) a step of, after the step (B), peeling the heat-resistant resin layer (10) from the adhesive laminate film (50); and (D) a step of, after the step (C), picking up the semiconductor chips (70) from the adhesive resin layer (30).

Abstract: A railroad rail track pad composition including a particular ethylene·?-olefin·non-conjugated polyene random copolymer (A), clay (B), and a sulfur atom-containing silane coupling agent (C) is used in order to lower the viscosity of a rubber composition that is a raw material for molding while suppressing lowering of the rubber elasticity of a crosslinked and molded product to be obtained. In addition, a molded product obtained by crosslinking the composition, particularly a molded product obtained by crosslinking and foam-molding the composition, is provided with rubber elasticity that is suitable as a railroad rail track pad.

Abstract: The method of producing a laminate of the present invention includes preparing a hard coat solution including an organic dye compound represented by following General Formula (1), a solvent, and a hard coat material; applying the hard coat solution on a primer layer which is provided over at least one surface of a lens substrate; and curing the hard coat solution applied on the primer layer to form a hard coat layer, in which the solvent is at least one type selected from 1-methoxy-2-propanol, butanol, and ethylene glycol monobutyl ether.

Abstract: Provided is a piezoelectric substrate, containing an elongate piezoelectric body that is helically wound, in which the piezoelectric body includes an optically active polypeptide, a length direction of the piezoelectric body and a main orientation direction of the optically active polypeptide included in the piezoelectric body are substantially parallel to each other, and the piezoelectric body has a degree of orientation F of from 0.50 to less than 1.00, as determined from X-ray diffraction measurement by the following Formula (a): Degree of orientation F=(180°??)/180°??(a) in Formula (a), ? represents a half width (°) of a peak derived from orientation.

Abstract: According to the present invention, provided is a polymerizable composition for an optical material including: at least one amine compound (A) selected from a compound (a1) represented by Formula (1) and a compound (a2) represented by Formula (2); an iso(thio)cyanate compound (B) which contains two or more iso(thio) cyanate groups; and a polythiol compound (C) which contains a dithiol compound (c1) containing two mercapto groups and a polythiol compound (c2) containing three or more mercapto groups.

Abstract: A method for manufacturing a semiconductor device of the present invention includes at least following four steps. (A) A step of preparing a structure having an adhesive film having a radiation-curable adhesive resin layer and one or two or more semiconductor chips adhered to the adhesive resin layer ; (B) a step of irradiating the adhesive film with a radiation to crosslink the adhesive resin layer; (C) a step of, after the step (B), confirming the operation of the semiconductor chips in a state of being adhered to the adhesive resin layer; and (D) a step of, after the step (C), picking up the semiconductor chips from the adhesive resin layer.

Abstract: Provided is a photocurable composition including a monomer component including: a monomer (X) containing, within one molecule, two aromatic rings and two (meth)acryloyloxy groups, and having an Mw of from 400 to 580, and a monomer (H) containing, within one molecule, at least one of a hydroxyl group or a carboxy group, and a (meth)acryloyloxy group, and having an Mw of from 100 to 700; and a photopolymerization initiator. The composition has a functional group value (a) of from 0.5×10?3 to 2.0×10?3 mol/g. Functional group value (a)=(nH/MH)×PH??Formula (a) wherein nH represents the total number of hydroxyl groups and carboxy groups contained in one molecule of the (meth)acrylic monomer (H); MH represents the Mw of the (meth)acrylic monomer (H); and PH represents the mass ratio of the (meth)acrylic monomer (H) with respect to the total amount of the (meth)acrylic monomer component.

Abstract: An adhesive includes a modified olefin polymer (A) allowing a polymer of a C2 to C20 ?-olefin having a structural unit derived from a C4 to C20 ?-olefin to be modified with a monomer having a functional group capable of reacting with an isocyanate group and having a heat of fusion measured in accordance with JIS K7122 of 0 J/g or more and 50 J/g or less and a polyisocyanate (B).

Abstract: A body, comprising stacked substrates, wherein: a first substrate, an adhesion layer comprising a reaction product of a compound (A), which has a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom and which has a defined weight average molecular weight, and a crosslinking agent (B), which has three or more —C(?O)OX groups in a molecule, in which from one to six of the three or more —C(?O)OX groups are —C(?O)OH groups and which has a weight average molecular weight of from 200 to 600, X is a hydrogen atom or an alkyl group having from 1 to 6 carbon atoms, and a second substrate, are layered in this order, and the compound (A) comprises at least one selected from the group consisting of a defined aliphatic amine and a defined compound having a siloxane bond and an amino group.

Abstract: There is provided a copper foil provided with a carrier exhibiting a high peeling resistance against the developer in the photoresist developing process and achieving high stability of mechanical peel strength of the carrier. The copper foil provided with a carrier comprises a carrier; an interlayer disposed on the carrier, the interlayer having a first surface adjacent to the carrier and containing 1.0 atom % or more of at least one metal selected from the group consisting of Ti, Cr, Mo, Mn, W and Ni and a second surface remote from the carrier and containing 30 atom % or more of Cu; a release layer disposed on the interlayer; and an extremely-thin copper layer disposed on the release layer.

Abstract: Pyridone compounds of formula (1) and salts thereof: wherein R1, R2, R3, X, Y1, Y2, Y3 and n are defined. The pyridone compounds can control plant diseases.

Abstract: An adhesive film used when sealing an electronic component to temporarily fix the electronic component, the adhesive film including a base material layer, an adhesive resin layer which is provided on a first surface side of the base material layer and which is for temporarily fixing the electronic component, and an adhesive resin layer which is provided on a second surface side of the base material layer and of which the adhesive strength decreases according to an external stimulus, in which the adhesive resin layer includes a polyvalent carboxylic acid ester-based plasticizer and an adhesive resin, and a content of the polyvalent carboxylic acid ester-based plasticizer in the adhesive resin layer is more than or equal to 0.7 parts by mass and less than or equal to 50 parts by mass with respect to 100 parts by mass of the adhesive resin included in the adhesive resin layer.

Abstract: Pyridine compounds of Formula (1) are provided: wherein R1, R2, X, Y and Het are defined. The pyridine compounds can be used to treat or prevent plant diseases.

Abstract: An apparatus for manufacturing a laminated iron core includes a conveyance jig on which a laminated iron core body is placed, a die unit including a lower die and an upper die upwardly and downwardly movable with respect to the lower die, which holds the laminated iron core body placed on the conveyance jig from both sides in a lamination direction of the laminated iron core body between the lower die and the upper die, an injector injecting a resin into a through hole formed through the laminated iron core body held by the die unit from the lower die through the conveyance jig or the upper die, and an upward and downward movement unit capable of upwardly and downwardly moving the conveyance jig with respect to the lower die, and being provided independently from the die unit.

Abstract: A method of manufacturing a metal product comprise forming a base region on a surface of a metal member by repeatedly scanning along a predetermined first direction while irradiating the surface of the metal member with a base laser beam over a first set of rows. The method further comprises forming a marking by repeatedly scanning along a predetermined second direction while irradiating the surface of the metal member with a marking laser beam over a second set of rows. The second direction is different from the first direction. An identification code having a predetermined pattern comprises a combination of the base region and the marking.

Abstract: An opening and closing system includes a first human detection sensor configured to detect a vehicle user who enters a first area defined on a periphery of a vehicle body, a lamp visible by the vehicle user who enters the first area, and a control device configured to control an unlocking operation of the lock device, a closing operation of the striker device, a pop-up operation of the striker device, and switching on and off of the lamp. The control device switches on the lamp when the vehicle user is detected by the first human detection sensor and starts the controlling of the unlocking operation of the lock device and the closing operation and the pop-up operation of the striker device in response to the lamp being switched on.

Abstract: A method of manufacturing a multilayer wiring board is disclosed, the method being capable of separating a substrate without large local warpage of the multilayer wiring layer and thereby improving the reliability of connection in the multilayer wiring layer. This method includes providing a laminated sheet having, in sequence, a substrate, a first release layer and a metal layer; forming a first wiring layer on the metal layer; alternately stacking insulating layers and wiring layers on the laminated sheet on which the first wiring layer is formed to give a laminate provided with a multilayer wiring layer; stacking a reinforcing sheet on the laminate provided with the multilayer wiring layer while interposing a second release layer; separating the substrate from the metal layer; and separating the reinforcing sheet from the laminate provided with the multilayer wiring layer to give the multilayer wiring board.

Abstract: A method of manufacturing a multilayer wiring board is disclosed, the method being capable of reinforcing the multilayer wiring layer and thereby improving the reliability of connection and the flatness on the surface of the multilayer wiring layer. The method includes providing a laminated sheet having a substrate, a first release layer and a metal layer; forming a first wiring layer on the metal layer; alternately stacking insulating layers and wiring layers on the laminated sheet on which the first wiring layer is formed to give a laminate provided with a multilayer wiring layer; stacking a reinforcing sheet on the laminate provided with the multilayer wiring layer at the side opposite to the laminate sheet, while interposing the second release layer; separating the substrate from the metal layer; and separating the reinforcing sheet from the laminate provided with the multilayer wiring layer to give the multilayer wiring board.

Abstract: A metal laminate includes a lamination of a first metal plate and a second metal plate. The first metal plate includes a caulking that exhibits a mountain shape protruding from a back surface side and recessed on a front surface side, and the second metal plate includes an accommodating portion configured to accommodate the caulking such that the caulking is fitted to the accommodating portion. The caulking includes a recessed portion provided on an inner concave surface of the caulking and recessed toward the back surface side of the first metal plate, and an abutting portion provided on an outer convex surface of the caulking and abutted against an inner surface of the accommodating portion at a position corresponding to the recessed portion. The abutting portion expands laterally from the outer convex surface toward the inner surface of the accommodating portion.