Abstract: There is provided an electronic circuit apparatus in which the heat generated at an electronic component can be transferred to a heat spreader efficiently. An electronic circuit apparatus includes a dielectric substrate, an electronic component, a heat spreader, and a conductive via. The conductive via electrically and thermally connects the electronic component and the heat spreader. The conductive via extends from the first surface to at least an interior of the heat spreader and is in surface-contact with the heat spreader.

Abstract: A semiconductor module includes a semiconductor chip, base frame, a circuit board, and a screw. The base frame has a main surface having a concave portion in which the semiconductor chip is mounted. The base frame is thermally and electrically connected with the semiconductor chip through a die bonding material. The circuit board has a grounding pattern and is arranged above the main surface of the base frame. The screw electrically connects the main surface of the base frame and the outer peripheral portion of the concave portion to the grounding pattern of the circuit board and mechanically connects the base frame to the circuit board.

Abstract: A semiconductor module includes a semiconductor chip, a semiconductor frame, a circuit board, and a screw. The semiconductor frame has a main surface having a concave portion in which the semiconductor chip is mounted. The semiconductor frame is thermally and electrically connected with the semiconductor chip through a die bonding material. The circuit board has a grounding pattern and is arranged above the main surface of the semiconductor frame. The screw electrically connects the main surface of the semiconductor frame and the outer peripheral portion of the concave portion to the grounding pattern of the circuit board and mechanically connects the semiconductor frame to the circuit board.