Semiconductor device

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Description

FIG. 1 is a front view of a semiconductor device of a first embodiment showing my new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof,

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a view showing front, left side and top plan thereof;

FIG. 8 is a view showing front, right side and bottom plan thereof;

FIG. 9 is a front view of a semiconductor device of a second embodiment showing my new design;

FIG. 10 is a rear view thereof;

FIG. 11 is a top plan view thereof;

FIG. 12 is a bottom plan view thereof;

FIG. 13 is a right side view thereof;

FIG. 14 is a left side view thereof;

FIG. 15 is a view showing front, left side and top plan thereof; and,

FIG. 16 is a view showing front, right side and bottom plan thereof.

Claims

The ornamental design for a semiconductor device, as shown.

Referenced Cited
U.S. Patent Documents
4047197 September 6, 1977 Schierz
D288557 March 3, 1987 Du Bois
D396847 August 11, 1998 Nakayama et al.
6072211 June 6, 2000 Miller et al.
D444132 June 26, 2001 Iwanishi et al.
6433418 August 13, 2002 Fujisawa et al.
D475982 June 17, 2003 Hori et al.
D476962 July 8, 2003 Yoshihira et al.
6731002 May 4, 2004 Choi
6933593 August 23, 2005 Fissore et al.
6992386 January 31, 2006 Hata et al.
Patent History
Patent number: D648290
Type: Grant
Filed: Dec 7, 2010
Date of Patent: Nov 8, 2011
Assignee: Miyoshi Electronics Corporation (Hiroshima)
Inventor: Kazuhito Mori (Kawanishi)
Primary Examiner: Selina Sikder
Attorney: Birch, Stewart, Kolasch & Birch, LLP
Application Number: 29/380,499