Patents Assigned to Mori Seiki Co., LTD
  • Patent number: 9682455
    Abstract: A system, method, and computer-readable medium for providing a user interface. The system includes circuitry configured to generate chatter information based on sensor data collected from a machining operation of a machine performed at a previously selected tool speed setting. The chatter information includes a chatter level value and a chatter frequency value. A plurality of different candidate tool speed settings is determined based on the generated chatter frequency value from the machining operation. The circuitry generates the user interface that includes a plurality of different tool speed settings, including the previously selected tool speed setting and the plurality of different candidate tool speed settings for selection by a user. The user interface is configured to indicate the chatter level value for the previously selected.
    Type: Grant
    Filed: October 28, 2014
    Date of Patent: June 20, 2017
    Assignee: DMG MORI SEIKI CO., LTD.
    Inventors: Zachary Piner, Ke Ding, Mehdi Namazi, Kyle Konishi
  • Patent number: 9678500
    Abstract: A numerical control device reads a machining program and causes a machine tool to operate based on the machining program. The numerical control device includes: an acceleration-deceleration determining unit; and a position-command generating unit. The numerical control device is configured to set the acceleration and the deceleration as acceleration-deceleration data when the acceleration and the deceleration satisfy tolerances decided based on actual mechanical dynamic characteristics, and set the tolerances as acceleration-deceleration data when the acceleration and deceleration do not satisfy the tolerances. The position-command generating unit is configured to generate a position command based on the moving command, the acceleration-deceleration data, and the speed at the end of the command route and the superimposition amount subjected to processing by the acceleration-deceleration determining unit.
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: June 13, 2017
    Assignees: Mitsubishi Electric Corporation, DMG MORI SEIKI CO., LTD.
    Inventors: Takeshi Tsuda, Tsuyoshi Kumazawa, Munetaka Wakizaka
  • Patent number: 9652079
    Abstract: An operating device includes a touch panel 21 having a display 22 on which a screen is displayed and an input element 23 having a plurality of electrodes and outputting a signal corresponding to capacitance generated between a ground potential and each of the electrodes, an input signal processor 14 receiving the signals output from the electrodes of the input element 23, recognizing a touched position touched by an operator, and generating an operation signal corresponding to the recognized touched position and transmitting the generated operation signal to a controller 3, and determiner 16 determining whether the input element 23 is electrically stable or not. When the input element 23 is determined to be electrically unstable, the determiner 16 displays a warning screen or warning window on the display 22.
    Type: Grant
    Filed: May 20, 2015
    Date of Patent: May 16, 2017
    Assignee: DMG MORI SEIKI CO., LTD.
    Inventors: Masahiro Komatsu, Tsutomu Kuramoto
  • Patent number: 9651938
    Abstract: An interference checking device 1 checks, during machining using an NC machine tool 20, interference between structures of the NC machine tool 20, a tool and a workpiece, and includes an interference check processing unit 2 virtually moving models and checking the occurrence of interference based on a position control signal from a numerical controller 30, and an operation effect degree evaluating unit 6 evaluating the degree of an effect of an operation on a possibility of the occurrence of interference. When a predetermined operation is performed during machining of a workpiece following a first workpiece, the interference check processing unit 2 moves the models at intervals determined based on the degree of the effect evaluated by the operation effect degree evaluating unit 6.
    Type: Grant
    Filed: August 4, 2014
    Date of Patent: May 16, 2017
    Assignee: DMG MORI SEIKI CO., LTD.
    Inventors: Susumu Mitsuhashi, Takayuki Nakamura, Tetsushi Asada, Tetsuo Ogawa, Yuzuru Sakuta
  • Patent number: 9651936
    Abstract: Using a machine tool, a workpiece is machined while periodically varying the rotational speed of a spindle thereof. Correlation data on correlation between a speed variation rate RVA of the spindle rotational speed, a speed variation period ratio RVF thereof, and vibration of a tool when machining the workpiece while periodically varying the spindle rotational speed is previously obtained. Based on the correlation data, the speed variation rate RVA and the speed variation period ratio RVF are set so that the vibration of the tool and machining accuracy are within their respective allowable ranges, and based on the set speed variation rate RVA and speed variation period ratio RVF, a variation amplitude and a variation period of the spindle rotational speed are determined. The spindle is rotated at the rotational speed varying at the determined amplitude and period with respect to a target rotational speed, thereby machining the workpiece.
    Type: Grant
    Filed: September 2, 2014
    Date of Patent: May 16, 2017
    Assignee: DMG MORI SEIKI CO., LTD.
    Inventors: Hiroshi Fujimoto, Teruaki Ishibashi, Shinji Ishii, Koji Yamamoto, Yuki Terada
  • Patent number: 9643256
    Abstract: A machine tool includes a spindle equipped with a workpiece gripping portion arranged so as to face an operator side, the spindle being configured to rotatably drive a workpiece gripped by the workpiece gripping portion, and a tool mount equipped with a rotary member supporting a plurality of tools in a rotatably indexable manner about an axis parallel to an axis of the spindle. The tool mount is arranged at a tool mount installation portion formed to be positioned on the operator side in a manner such that the rotary member faces a workpiece gripping portion side.
    Type: Grant
    Filed: March 30, 2015
    Date of Patent: May 9, 2017
    Assignee: DMG MORI SEIKI CO., LTD.
    Inventors: Takayuki Akai, Yoshihiro Matsumoto, Masashi Yakoyama, Toshiaki Tanaka, Masao Fukumori
  • Publication number: 20170123408
    Abstract: A method of machining a workpiece may include continuously rotating the workpiece, continuously rotating a tool having at least one cutting surface, and positioning the tool relative to the workpiece so that the at least one cutting surface engages the workpiece at a first discrete location at a periphery of the workpiece. The method may further include continuing to rotate the workpiece and the tool so that the at least one cutting surface engages a second discrete location at the periphery of the workpiece, and controlling a tool surface velocity VT relative to the workpiece surface velocity VW so that the first and second discrete locations are discontinuous. The tool may make multiple iterative passes over the workpiece to engage subsequent discrete locations, wherein the first discrete location, second discrete location, and multiple subsequent discrete locations may form a machined surface that extends continuously around the workpiece.
    Type: Application
    Filed: January 11, 2017
    Publication date: May 4, 2017
    Applicant: Mori Seiki Co., LTD.
    Inventors: Gregory A. Hyatt, Nitin Chaphalkar
  • Patent number: 9612104
    Abstract: A displacement detecting device includes a light source that performs irradiation with light, a light-beam splitting section, a reflection/transmission section, a phase plate, a transmission-type diffraction grating, a light-beam combining section, a light-receiving section, and a relative position information output unit. The reflection/transmission section transmits or reflects a first light beam, and causes the beam to enter a member to be measured. Furthermore, the reflection/transmission section guides the first light beam to a specific position of the member to be measured in the case where the member to be measured is in a reference position. Moreover, an optical path of the first light beam reflected by the member to be measured again overlaps with an optical path of the first light beam reflected at a specific position of the member to be measured.
    Type: Grant
    Filed: April 14, 2015
    Date of Patent: April 4, 2017
    Assignee: DMG MORI SEIKI CO., LTD.
    Inventor: Hideaki Tamiya
  • Patent number: 9575485
    Abstract: A method of machining a workpiece may include continuously rotating the workpiece, continuously rotating a tool having at least one cutting surface, and positioning the tool relative to the workpiece so that the at least one cutting surface engages the workpiece at a first discrete location at a periphery of the workpiece. The method may further include continuing to rotate the workpiece and the tool so that the at least one cutting surface engages a second discrete location at the periphery of the workpiece, and controlling a tool surface velocity VT relative to the workpiece surface velocity VW so that the first and second discrete locations are discontinuous. The tool may make multiple iterative passes over the workpiece to engage subsequent discrete locations, wherein the first discrete location, second discrete location, and multiple subsequent discrete locations may form a machined surface that extends continuously around the workpiece.
    Type: Grant
    Filed: November 7, 2011
    Date of Patent: February 21, 2017
    Assignee: MORI SEIKI CO., LTD.
    Inventors: Gregory A. Hyatt, Nitin Chaphalkar
  • Patent number: 9539687
    Abstract: A connection portion between a holder side part of a chip suction path and a main body side part of the chip suction path 12 is formed to have a non-contact structure, resulting in that not only a chip generated at a machining point but also a chip remained so as to be suspended in a machining atmosphere can be sucked and discharged.
    Type: Grant
    Filed: July 24, 2013
    Date of Patent: January 10, 2017
    Assignees: DMG MORI SEIKI CO., LTD., FUJI JUKOGYO KABUSHIKI KAISHA
    Inventors: Morihiro Hideta, Koji Sato, Hisayuki Oide, Shinya Matsuo, Tatsuo Nakahata
  • Patent number: 9539698
    Abstract: A method of grind hardening a workpiece is provided. The method may include securing the workpiece in a workpiece retainer and a grind tool in a tool retainer, rotating the grind tool in a first angular direction at a first angular speed, controlling the workpiece and tool retainers such that the grind tool engages the workpiece, and controlling the workpiece and tool retainers such that the grind tool is guided along a grinding track of the workpiece. The grind tool may engage and/or disengage the workpiece at portions of sacrificial material disposed thereon. Coolant and cleaning nozzles may be provided and controlled such that at least a portion of the coolant from the coolant nozzle is diverted to the cleaning nozzle in a manner which reduces heat dissipation, improves thermal efficiency of the grind hardening and reduces loading of the grind tool.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: January 10, 2017
    Assignee: MORI SEIKI CO., LTD.
    Inventors: Nils Niemeyer, Tobias Foeckerer, Nitin Chaphalkar, Gregory A. Hyatt
  • Patent number: 9527175
    Abstract: A moving body guide mechanism of a machine tool includes at least two bar-shaped guide members, and sliders engaged with the two guide members, respectively, movably with respect to the guide members so that a moving body is guided along an axis parallel to a moving axis extending in a longitudinal direction of the guide members. Attaching surfaces of the two guide members or the sliders to the moving body are provided symmetrically across a plane including the axis parallel to the moving axis in such a manner that an angle formed by the attaching surfaces becomes smaller than 180°.
    Type: Grant
    Filed: February 4, 2015
    Date of Patent: December 27, 2016
    Assignee: DMG MORI SEIKI CO., LTD.
    Inventors: Takashi Hoshi, Hajime Kimura, Ryosuke Yasumura
  • Patent number: 9527181
    Abstract: An attachment for dust collection for cutting machining includes a rotation mechanism and a dust collection enclosure for enclosing at least part of a tool. The dust collection enclosure is rotatably configured by being fixed to the rotation mechanism. A gap for checking a machining state is provided in the dust collection enclosure.
    Type: Grant
    Filed: May 13, 2013
    Date of Patent: December 27, 2016
    Assignees: FUJI JUKOGYO KABUSHIKI KAISHA, DMG MORI SEIKI CO., LTD.
    Inventors: Morihiro Hideta, Koji Sato, Hisayuki Oode, Shinya Matsuo, Tatsuo Nakahata
  • Publication number: 20160288285
    Abstract: A system, method and computer-readable medium for fine-tuning speed selection for reducing machine chatter. The system includes circuitry configured to determine a predetermined speed of the machine. The circuitry identifies a stability lobe based on the predetermined speed of the machine and selects a first set of fine-tuning speeds from a range of machine speeds corresponding to the determined stability lobe. Further, the circuitry causes the machine to operate at one or more of the first set of fine-tuning speeds.
    Type: Application
    Filed: March 31, 2015
    Publication date: October 6, 2016
    Applicant: DMG Mori Seiki Co., Ltd.
    Inventors: Zachary PINER, Ke Ding, Mehdi Namazi, Kyle Konishi
  • Publication number: 20160282839
    Abstract: A method, non-transitory computer-readable medium, and controller for manufacturing a predetermined object. The method includes machining a plurality of separate components of a work piece based on a final geometry of the predetermined object. The plurality of separate components is selected based on the final geometry of the predetermined object. A first material is added to the work piece such that a first single continuous surface is formed over, or together with, the machined surfaces of the plurality of separate components which is selected based on the final geometry of the predetermined object.
    Type: Application
    Filed: March 27, 2015
    Publication date: September 29, 2016
    Applicants: Advanced Research for Manufacturing Systems, LLC, DMG Mori Seiki Co., Ltd.
    Inventor: Masakazu SOSHI
  • Patent number: 9436365
    Abstract: An operating device includes a touch panel, a display screen data storage unit storing display screen data to be displayed on a display unit of the touch panel, an operation information storage unit storing operation information corresponding to positions on the display screens, an attribute information storage unit storing attribute information set for operation screens of each operation mode, a display control unit displaying the screens on the display unit, an input signal processing unit processing a signal from an input unit of the touch panel and transmitting an operation signal to an operation controller, and further transmitting a display screen changing signal to the display control unit, and an automatic mode switching unit monitoring display of the operation screens by the display control unit, and in the case where the attribute information is set for the operation screens displayed, outputting a mode switching signal to the operation controller.
    Type: Grant
    Filed: September 11, 2014
    Date of Patent: September 6, 2016
    Assignee: DMG MORI SEIKI CO., LTD.
    Inventors: Sumihiro Kiyota, Takaaki Soga, Masakazu Takayama, Kentaro Miyakawa
  • Patent number: 9427843
    Abstract: An apparatus for obtaining information about a workpiece may include a measuring device having a nozzle defining an orifice in fluid communication with a source of incompressible fluid. A fluid monitoring apparatus may monitor a parameter of the substantially incompressible fluid, and a pump may be fluidly coupled to the source and configured to supply incompressible fluid to the orifice. The pump may have a pump chamber with a first displacement setting having a first fixed volume, so that operation of the pump at a first pump speed with the pump chamber in the first displacement setting generates a first fluid flow having a substantially constant first volumetric rate. The pump may have more than one displacement setting, or the pump may be operated at different speeds to change the volumetric flow rate. The nozzle may include multiple, independent orifice sets that may be selectively provided fluid, thereby to obtain information on different parts of the workpiece with a single placement of the nozzle.
    Type: Grant
    Filed: March 1, 2011
    Date of Patent: August 30, 2016
    Assignee: Mori Seiki Co., LTD
    Inventors: Gregory A. Hyatt, Nitin Chaphalkar
  • Publication number: 20160238366
    Abstract: This invention reliably returns a measurement surface to a reference position while weakening the elastic force of a spring. A tool length measurement apparatus of this invention includes a supporter that supports the measurement surface that the tip of a tool contacts while translating in accordance with a biasing force received from the tool. The tool length measurement apparatus of this invention also includes a detector that detects the position of the measurement surface in a translation direction. The tool length measurement apparatus of this invention also includes a biasing unit that biases the measurement surface by a gas in a direction against the biasing force received from the tool.
    Type: Application
    Filed: February 16, 2016
    Publication date: August 18, 2016
    Applicant: DMG Mori Seiki Co., Ltd.
    Inventors: Ken Onoe, Akira Kimura
  • Patent number: 9417622
    Abstract: A controller has a control unit generating a control signal to control a drive motor and a friction compensation unit adding a friction compensation signal to the control signal for compensating for a positioning error caused by friction in a guide unit. When reversing the direction of movement of the movable body, the friction compensation unit generates a friction compensation signal in accordance with a function f(?) representing a friction compensation value uf by a relationship with a variable ? and asymptotically approaching the maximum value and the minimum value of the friction compensation value uf and having an inflection point therebetween, and adds the generated friction compensation signal to the control signal generated by the control unit during movement of the movable body a predetermined movement distance from before to after the reversing.
    Type: Grant
    Filed: September 2, 2014
    Date of Patent: August 16, 2016
    Assignees: DMG MORI SEIKI CO., LTD., THE UNIVERSITY OF TOKYO
    Inventors: Hiroshi Fujimoto, Hongzhong Zhu, Koji Yamamoto, Shinji Ishii
  • Patent number: D770531
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: November 1, 2016
    Assignees: DMG MORI SEIKI CO., LTD., DMG MORI SEIKI AKTIENGESELLSCHAFT
    Inventor: Dominic Schindler