Abstract: A three-dimensional integrated circuit non-volatile memory array includes a memory array with multiple vertical gate NAND memory cell strings formed in a different vertical layers over a substrate which share a common set of word lines, where different groupings of NAND memory cell strings formed between dedicated pairings of source line structures and bit line structures form separately erasable blocks which are addressed and erased by applying an erase voltage to the source line structure of the erase block being erased while applying a ground voltage to the other source line structures in the array and a high pass voltage to the bit line structures in the array.
Abstract: A flash device comprising a well and a U-shaped flash cell string, the U-shaped flash cell string built directly on a substrate adjacent the well. The U-shaped flash cell string comprises one portion parallel to a surface of the substrate, comprising a junctionless bottom pass transistor, and two portions perpendicular to the surface of the substrate that comprise a string select transistor at a first top of the cell string, a ground select transistor at a second top of the cell string, a string select transistor drain, and a ground select transistor source.
Abstract: A flash memory device comprising a local sensing circuitry is provided in a hierarchical structure with local and global bit lines. The local sensing circuitry comprise read and pass circuits configured to sense and amplify read currents during read operations, wherein the amplified read signals may be passed to a global circuit via the local and global bit lines.
Abstract: An arrangement of memory devices and a controller is based on an interface with a reduced pin count relative to a known memory device and controller arrangement. Facilitating the reduced pin count interface are some operations performed by the controller. The controller determines a width for a Data bus while assigning a target device address to each of the memory devices.
Abstract: A memory system architecture is provided in which a memory controller controls memory devices in a serial interconnection configuration. The memory controller has an output port for sending memory commands and an input port for receiving memory responses for those memory commands requisitioning such responses. Each memory device includes a memory, such as, for example, NAND-type flash memory, NOR-type flash memory, random access memory and static random access memory. Each memory command is specific to the memory type of a target memory device. A data path for the memory commands and the memory responses is provided by the interconnection. A given memory command traverses memory devices in order to reach its intended memory device of the serial interconnection configuration. Upon its receipt, the intended memory device executes the given memory command and, if appropriate, sends a memory response to a next memory device. The memory response is transferred to the memory controller.
March 2, 2011
Date of Patent:
August 26, 2014
MOSAID Technologies Incorporated
HakJune Oh, Hong Beom Pyeon, Jin-Ki Kim
Abstract: An optical communication system and method of use are described. The system comprises an optical source adapted to receive a digitally encoded data signal comprising sequences of data at a data rate (B) and comprising two signal levels representing a first state and a second state of the data signal, the optical source being adapted to produce an optical signal substantially frequency modulated with frequency excursion ?? comprising a first instantaneous frequency (?0) associated to the first state and a second instantaneous frequency (?1) associated to the second state; an optical converter adapted to receive the substantially frequency modulated optical signal, the optical converter having an optical transfer function varying with frequency and including at least one pass band, the at least one pass band having a peak transmittance and at least a low-transmittance region.
Abstract: Generally, the present disclosure provides a non-volatile memory device having a hierarchical bitline structure for preventing erase voltages applied to one group of memory cells of the memory array from leaking to other groups in which erasure is not required. Local bitlines are coupled to the memory cells of each group of memory cells. Each local bitline can be selectively connected to a global bitline during read operations for the selected group, and all the local bitlines can be disconnected from the global bitline during an erase operation when a specific group is selected for erasure. Select devices for electrically connecting each bitline of a specific group of memory cells to the global bitline have device bodies that are electrically isolated from the bodies of those memory cells.
Abstract: A threshold voltage distribution scheme for multi-level Flash cells where an erase threshold voltage and at least one programmed threshold voltage lie in an erase voltage domain. Having at least one programmed threshold voltage in the erase voltage domain reduces the Vread voltage level to minimize read disturb effects, while extending the life span of the multi-level Flash cells as the threshold voltage distance between programmed states is maximized. The erase voltage domain can be less than 0V while a program voltage domain is greater than 0V. Accordingly, circuits for program verifying and reading multi-level Flash cells having a programmed threshold voltage in the erase voltage domain and the program voltage domain use negative and positive high voltages.
Abstract: A memory system architecture has serially connected memory devices. The memory system is scalable to include any number of memory devices without any performance degradation or complex redesign. Each memory device has a serial input/output interface for communicating between other memory devices and a memory controller. The memory controller issues commands in at least one bitstream, where the bitstream follows a modular command protocol. The command includes an operation code with optional address information and a device address, so that only the addressed memory device acts upon the command. Separate data output strobe and command input strobe signals are provided in parallel with each output data stream and input command data stream, respectively, for identifying the type of data and the length of the data. The modular command protocol is used for executing concurrent operations in each memory device to further improve performance.
February 5, 2014
July 10, 2014
MOSAID TECHNOLOGIES INCORPORATED
Jin-Ki KIM, HakJune OH, Hong Beom PYEON, Steven PRZYBYLSKI
Abstract: A hybrid solid-state memory system is provided for storing data. The solid-state memory system comprises a volatile solid-state memory, a non-volatile solid-state memory, and a memory controller. Further, a method is provided for storing data in the solid-state memory system. The method comprises the following steps. A write command is received by the memory controller. Write data is stored in the volatile memory in response to the write command. Data is transferred from the volatile memory to the non-volatile memory in response to a data transfer request.
Abstract: An integrated circuit method is provided with package-level connectivity, between internal electronic circuitry thereof and contact points on a package substrate thereof, without requiring top metal pads or bonding wires.
Abstract: In conjunction with a wiring in a house carrying data network signal, a modular outlet includes a base module and interface module. The base module connects to the wiring and is attached to the surface of a building. The interface module provides a data unit connection. The interface module is mechanically attached to the base module and electrically connected thereto. The wiring may also carry basic service signal such as telephone, electrical power and cable television (CATV). In such a case, the outlet provides the relevant connectivity either as part of the base module or as part of the interface module. Both proprietary and industry standard interfaces can be used to interconnect the module. Furthermore, a standard computer expansion card (such as PCI, PCMCIA and alike) may be used as interface module.
Abstract: Various memory devices (e.g., DRAMs, flash memories) are serially interconnected. The memory devices need their identifiers (IDs). Each of the memory devices generates IDs for neighboring memory devices. The IDs are generated synchronously with clock. Command data and previously generated ID data are synchronously registered. The registered data is synchronously output and provided as parallel data for calculation of a new ID for the neighboring device. The calculation is an addition or subtraction by one. The IDs are generated in a packet basis by interpreting serial packet-basis commands received at the serial input in response to clocks. A clock latency is controlled in response to the interpreted ID and the clock. In accordance with the controlled clock latency, a new ID is provided in a packet basis. In high frequency generation applications (e.g., 1 GHz), two adjacent devices connected in daisy chain fashion are guaranteed enough time margin to perform the interpretation of packet commands.
Abstract: The present invention generally provides a packet buffer random access memory (PBRAM) device including a memory array, a plurality of input ports, and a plurality of serial registers associated with the input ports. The plurality of input ports permit multiple devices to concurrently access the memory in a non-blocking manner. The serial registers enable receiving data from the input ports and concurrently packet data to the memory array. The memory performs all management of network data queues so that all port requests can be satisfied within the real-time constraints of network packet switching.
Abstract: Disclosed is a method of manufacturing flash memory with a vertical cell stack structure. The method includes forming source lines in a cell area of a substrate having an ion-implanted well and forming an alignment mark relative to the source lines. The alignment mark is formed in the substrate outside the cell area of the substrate. After formation of the source lines, cell stacking layers are formed. After forming the cell stacking layers, cell pillars in the cell stacking layers are formed at locations relative to the previously formed source lines using the alignment mark to correctly locate the cell pillars.
Abstract: A semiconductor device has a substrate having a first plurality of substrate bonding pads disposed on a bonding surface thereof. A plurality of semiconductor dice is disposed on the substrate. Each die of the plurality of dice has a first plurality of die bonding pads arranged along at least one first edge thereof. A plurality of bonding pillars extends substantially vertically from the substrate bonding pads. Each bonding pillar electrically connects one of the first plurality of substrate bonding pads to a corresponding one of the first plurality of die bonding pads. A method of assembling a semiconductor device is also described.
Abstract: A method, system and apparatus to provide a solution of PLL locking issue in the daisy chained memory system. A first embodiment uses consecutive PLL on based on locking status of backward device on the daisy chained memory system with no requirement of PLL locking status checking pin. A second embodiment uses Flow through PLL control with a locking status pin either using an existing pin or a separated pin. A third embodiment uses a relocking control mechanism to detect PLL relocking from the device. A fourth variation uses flag signal generation to send to the controller.
Abstract: Each memory cell string in a generic NAND flash cell block connects to a Common Source Line (CLS). A value for applying to the CSL is centrally generated and distributed to a local switch logic unit corresponding to each NAND flash cell block. For source-line page programming, the distribution line may be called a Global Common Source Line (GCSL). In an array of NAND flash cell blocks, only one NAND flash cell block is selected at a time for programming. To reduce power consumption, only the selected NAND flash cell block receives a value on the CSL that is indicative of the value on the GCSL. Additionally, the CSLs of non-selected NAND flash cell blocks may be disabled through an active connection to ground.
Abstract: An OFDM system uses a normal mode which has a symbol length T, a guard time TG and a set of N sub-carriers, which are orthogonal over the time T, and one or more fallback modes which have symbol lengths KT and guard times KTG where K is an integer greater than unity. The same set of N sub-carriers is used for the fallback modes as for the normal mode. Since the same set of sub-carriers is used, the overall bandwidth is substantially constant, so alias filtering does not need to be adaptive. The Fourier transform operations are the same as for the normal mode. Thus fallback modes are provided with little hardware cost. In the fallback modes the increased guard time provides better delay spread tolerance and the increased symbol length provides improved signal to noise performance, and thus increased range, at the cost of reduced data rate.
Abstract: Applying an adapted block isolation method to serial-connected memory components may mitigate the effects of leakage current in serial-connected non-volatile memory devices. Responsive to determining that a given memory component is not an intended destination of a command, a plurality of core components of the given memory component may be placed in a low power consumption mode, while maintaining input/output components in an active operational mode. Conveniently, aspects of the disclosed system reduce off current without adding many logic blocks into the memory devices.