Abstract: An integrated circuit (IC) chip for transparent and in-service or production repair of single to multiple memory cell defects in a word during the datapath transit of the word between core memory to the interface of the IC via capturing an accurate bit from a word during a write access to a known defective memory address, and by substituting in a non-defective bit into the word during a read access from a known defective memory address. The IC includes: address matching circuit (CAM), a random access memory (RAM) of substitute memory cells containing accurate associated bit data and bit location in word of defect, and data selection circuitry (MUXs) coupled together.

Abstract: An integrated circuit chip comprising at least one programmable built-in self-repair (PBISR) for repairing memory is described. The PBISR comprises an interface that receives signals external to the integrated chip. The PBISR further includes a port slave module that programs MBISR registers, program and instruction memory. The PBISR further comprises a programmable transaction engine and a programmable checker. Further, the MBISR comprises an eFUSE cache that implements logic to denote defective elements.

Abstract: A system includes a host device that may be configured to initiate memory requests to a system memory. The system also includes a memory controller that may be configured receive the memory requests and to format the memory requests into memory transactions that are conveyed to the memory device via a memory interface. The memory transactions include a plurality of memory write command types. Each memory write command type corresponds to a different respective schedule for conveying a corresponding data payload.

Abstract: A hybrid output driver includes a voltage mode main driver having an adjustable differential output voltage swing, and a current mode emphasis driver. Differential output voltage swing is adjusted by controlling the resistance of a first adjustable resistor coupled to a first voltage supply terminal, and the resistance of a second adjustable resistor coupled to a second voltage supply terminal. Resistances of the first and second adjustable resistors are adjusted by modifying a number of resistors connected in parallel. A calibration process measures the actual resistance of a similar resistor, and uses this resistance measurement to determine the number of resistors to be connected in parallel to provide the desired resistance. The current mode emphasis driver sources/sinks currents to/from differential output terminals of the hybrid output driver in response to an emphasis signal. These currents are selected in view of the selected differential output voltage swing and selected emphasis level.

Abstract: A memory system includes multiple (N) memory banks and multiple (M) ports, wherein N is greater than or equal to M. Each of the memory banks is coupled to each of the ports. Access requests are transmitted simultaneously on each of the ports. However, each of the simultaneous access requests specifies a different memory bank. Each memory bank monitors the access requests on the ports, and determines whether any of the access requests specify the memory bank. Upon determining that an access request specifies the memory bank, the memory bank performs an access to an array of single-port memory cells. Simultaneous accesses are performed in multiple memory banks, providing a bandwidth equal to the bandwidth of one memory bank times the number of ports. An additional level of hierarchy may be provided, which allows further multiplication of the number of simultaneously accessed ports, with minimal area overhead.

Abstract: A memory device includes a block of memory cells and a cache. The block of memory cells is not a random access memory with multiple ports. The block of memory cells is partitioned into subunits that have only a single port. The cache is coupled to the block of memory cells adapted to handle a plurality of accesses to a same subunit of memory cells without a conflict such that the memory appears to be a random access memory to said plurality of accesses. A method of operating the memory, and a memory with bank-conflict-resolution (BCR) module including cache are also provided.

Abstract: A chip layout for a high speed semiconductor device is disclosed. The chip layout isolates Rx terminals and Rx ports from Tx terminals and Tx ports. A serial interface is centrally located to reduce latency, power and propagation delays. Stacked die that contain one or more devices with the chip layout are characterized by having improved latency, bandwidth, power consumption, and propagation delays.

Abstract: An embedded memory system includes an array of random access memory (RAM) cells, on the same substrate as an array of logic transistors. Each RAM cell includes an access transistor and a capacitor structure. The capacitor structure is fabricated by forming a metal-insulator-metal capacitor in a dielectric layer. The embedded RAM system includes fewer metal layers in the memory region than in the logic region.

Abstract: A memory system includes multiple (N) memory banks and multiple (M) ports, wherein N is greater than or equal to M. Each of the memory banks is coupled to each of the ports. Access requests are transmitted simultaneously on each of the ports. However, each of the simultaneous access requests specifies a different memory bank. Each memory bank monitors the access requests on the ports, and determines whether any of the access requests specify the memory bank. Upon determining that an access request specifies the memory bank, the memory bank performs an access to an array of single-port memory cells. Simultaneous accesses are performed in multiple memory banks, providing a bandwidth equal to the bandwidth of one memory bank times the number of ports. An additional level of hierarchy may be provided, which allows further multiplication of the number of simultaneously accessed ports, with minimal area overhead.

Abstract: A multi-bank memory system includes one or more levels of logical memory hierarchy to increase the available random cyclic transaction rate of the memory system. The memory system includes a plurality of multi-bank partitions, each having a corresponding partition interface. Each partition interface accesses the corresponding multi-bank partition at a first frequency. A global interface may access the partition interfaces at a second frequency, which is equal to the first frequency times the number of partition interfaces. Alternately, a plurality of cluster interfaces may access corresponding groups of the partition interfaces, wherein each cluster interface accesses the corresponding group of partition interfaces at a second frequency that is faster than the first frequency. A global interface accesses the cluster interfaces at a third frequency that is greater than the second frequency.

Abstract: A memory bank includes an array of memory cells, word lines for accessing the memory cells, and word line drivers coupled to the word lines. When the memory bank is being accessed, the word line drivers are coupled to receive a first supply voltage, which is applied to the non-selected word lines of the memory bank. The first supply voltage turns off access transistors of the memory cells coupled to the non-selected word lines. When the memory bank is not being accessed, the word line drivers are coupled to receive a second supply voltage, which is applied to each of the word lines of the memory bank. The second supply voltage turns off the access transistors of the memory cells coupled of the word lines. The first and second supply voltages are selected such that the first supply voltage turns off the access transistors harder than the second supply voltage.

Abstract: A system for increasing the efficiency of data transfer through a serializer-deserializer (SerDes) link, and for reducing data latency caused by differences between arrival times of the data on the SerDes link and the system clock with which the device operates.

Abstract: A memory device with background built-in self-testing (BBIST) includes a plurality of memory blocks; a memory buffer to offload data from one of the plurality of memory blocks temporarily; and a memory block stress controller to control a stress test applied to the one of the memory blocks when the data is temporarily offloaded on the memory buffer. The stress test tests for errors in the one of the plurality of the memory blocks.

Abstract: Methods and circuits for analyzing a signal and adjusting parameters of an equalizer for a signal. The signal is received at a receiver over a channel wherein the signal has a wave form. The signal is equalized at an equalizer using an adjustable parameter for the equalization. Data points from the signal are sampled between upper and lower limits of a threshold at an error sampler. A performance metric of the signal is computed based on a statistical density of the data points from the signal between the upper and lower limits of the threshold.

Abstract: A system includes a host device that may be configured to initiate memory requests to a system memory. The system also includes a memory controller that may be configured receive the memory requests and to format the memory requests into memory transactions that are conveyed to the memory device via a memory interface. The memory transactions include a plurality of memory write command types. Each memory write command type corresponds to a different respective schedule for conveying a corresponding data payload.

Abstract: A delay-lock loop includes two feedback loops for controlling delay elements in the delay-lock loop. The first feedback loop includes a feedback circuit for generating a feedback signal indicating a delay adjustment based on a phase difference between an input clock signal to the delay-locked loop and an output clock signal generated by the delay-locked loop. The second feedback loop includes a power regulator that generates a regulated signal by regulating a power supply using the feedback signal as a reference. The delay-lock loop further includes a variable delay circuit including a resistor-capacitor network. The variable delay circuit controls a capacitance in the resistor-capacitor network based on the feedback signal and controls a resistance of the resistor-capacitor network based on the regulated signal. In this way, variable delay circuit generates the output clock signal by delaying the input clock signal based on both the feedback signal and the regulated signal.

Abstract: An embedded memory system includes an array of random access memory (RAM) cells, on the same substrate as an array of logic transistors. Each RAM cell includes an access transistor and a capacitor structure. The capacitor structure is fabricated by forming a metal-insulator-metal capacitor in a dielectric layer. The embedded RAM system includes fewer metal layers in the memory region than in the logic region.

Abstract: A memory system that includes a first bit line coupled to a first set of dynamic random access memory (DRAM) cells, a second (complementary) bit line coupled to a second set of DRAM cells, and a sense amplifier coupled to the first and second bit lines. The sense amplifier includes a pair of cross-coupled inverters (or a similar latching circuit) coupled between the first and second bit lines, as well as a first select transistor coupling the first bit line to a first global bit line, and a second select transistor coupling the second bit line to a second global bit line. The first and second select transistors are independently controlled, thereby enabling improved read and write access sequences to be implemented, whereby signal loss associated with bit line coupling is eliminated, ‘read bump’ conditions are eliminated, and late write conditions are eliminated.

Abstract: A memory system that reduces the memory cycle time of a memory cell by performing an incomplete write operation. The voltage on a storage node of the memory cell does not reach a full supply voltage during the incomplete write operation. The incomplete write operation is subsequently completed by one or more additional accesses, wherein the voltage on the storage node is pulled to a full supply voltage. The incomplete write operation may be completed by: subsequently writing the same data to the memory cell during an idle cycle; subsequently writing data to other memory cells in the same row as the memory cell; subsequently reading data from the row that includes the memory cell; or refreshing the row that includes the memory cell during an idle cycle. One or more idle cycles may be forced to cause the incomplete write operation to be completed in a timely manner.

Abstract: A voltage-mode differential driver may include a first nominal path that selectively couples a first supply or a second supply to a first output terminal in response to an input data. The voltage-mode differential driver may further include a first capacitive boost path that selectively couples the first supply or the second supply to the first output terminal responsive to the input data. The first capacitive boost path may be selectively enabled to provide a boost current to be added to a current from the first nominal path resulting in an output current to be provided to the first output terminal.