Abstract: A plunger for holding and moving electronic components in particular for introduction and removal of IC's to and from a contacting device connected to a test bed comprises a plunger head with at least one suction head for sectional contact with a component. A heat-conducting body, temperature-controlled by means of a fluid, is arranged such that the suction-contacted component is in contact with the heat-conducting body. The suction head passes through the heat-conducting body.

Abstract: The invention relates to a handler for electronic components, in particular IC's, having a plurality of circulating carriages (10) that are guided along their circulating track by means of a stationary, annular guide device (9) consisting of at least one circulating guide rail. Retaining units (12) are provided on the circulating carriages (10), said units retaining the components (43) to be tested.

Abstract: An align fixture for aligning an electronic component having a receptacle adapted to receive the electronic component, the receptacle having a first abutting section and a second abutting section, the align fixture further having an elastic unit, one of the first abutting section and the second abutting section is flexibly mounted via the elastic unit, and the other one of the first abutting section and the second abutting section is fixedly mounted; the first abutting section and the second abutting section each form a stiff member and are adapted to engage the electronic component, the elastic unit is adapted to exert two force components on one of the first abutting section and the second abutting section, the force components being angled relatively to one another.

Abstract: In a contact base with a plurality of contact springs for making contact with electronic components, in particular ICs, the contact springs each have an elongate contact blade, the longitudinal center plane of said contact blade being situated parallel to the bending plane of the spring arm of the contact spring. Furthermore, the spring arm is formed in such a way that, when a pin is pressed, the contact blade moves in a direction which differs from the feed direction of the component in such a way that the contact blade moves along the pin.

Abstract: A plunger for holding and moving electrical components in particular IC's to and from a contacting device connected to a test bed, comprises a head piece with a fluid distribution chamber through which temperature-controlled fluid flows. A suction head is arranged such that the temperature-controlled fluid flows around the suction head and is diverted along the suction head to the component.

Abstract: A carrier adapted to receive and align multiple electronic components, the carrier having receptacles each being adapted to receive an assigned one of the multiple electronic components, a first plate comprising a plurality of first abutting sections, the first abutting sections form one of boundaries of the respective assigned receptacles, a second plate comprising a plurality of second abutting sections, the second abutting sections form another of the boundaries of the respective assigned receptacles, and the first plate and the second plate are arranged slidably relative to each other.

Abstract: A handler for electronic components, in particular IC's, for controlling the temperature of the components and supplying and removing said components to and from a test device has circulating units that can be moved along a circulating track. Each unit has at least one retaining unit for retaining a component. In addition, the circulating units have temperature-control chambers containing components that are retained by the retaining units, so that the temperature of the components can be controlled during transport from the charging station to the test station.

Abstract: A guide rail for electronic components, especially for use in robots for electronic components. The guide rail comprises a vertical or inclined guide duct that is provided with a curved, undulating guide track along at least one section thereof in order to decelerate components as the components slide within the guide track.

Abstract: A handler for electronic components, in particular IC's, for controlling the temperature of the components and supplying and removing said components to and from a test device has circulating units that can be moved along a circulating track. Each unit has at least one retaining unit for retaining a component. In addition, the circulating units have temperature-control chambers containing components that are retained by the retaining units, so that the temperature of the components can be controlled during transport from the charging station to the test station.

Abstract: In a contact base with a plurality of contact springs for making contact with electronic components, in particular ICs, the contact springs each have an elongate contact blade, the longitudinal centre plane of said contact blade being situated parallel to the bending plane of the spring arm of the contact spring. Furthermore, the spring arm is formed in such a way that, when a pin is pressed, the contact blade moves in a direction which differs from the feed direction of the component in such a way that the contact blade moves along the pin.

Abstract: A plunger for holding and moving electrical components in particular IC's to and from a contacting device connected to a test bed, comprises a head piece with a fluid distribution chamber through which temperature-controlled fluid flows. A suction head is arranged such that the temperature-controlled fluid flows around the suction head and is diverted along the suction head to the component.

Abstract: In the case of a position-correction device for correcting the position of a component holder of a handling apparatus for electronic components, in particular ICs, a base plate and a centering frame which can be displaced in relation to the base plate are provided in the region of a contact unit. A drive device is also provided and is operatively connected to the centering frame in order to displace the centering frame and thus the component holder inserted into the centering frame as a function of correction values which are calculated by a computation device on the basis of measured values which are obtained by a position-detection device for detecting the actual position of the component which is to be tested and is held in the component holder.

Abstract: The invention relates to a tempering chamber for tempering electronic components, in particular, IC's, with a circulating device (15) with a number of carrier elements (18) running in a circle and two support devices arranged on opposite sides of the carrier elements (18) are provided within a housing (14), wherein the carrier elements (18) are mounted on said support elements such that the alignment of the carrier elements (18) is unaltered on circulation.

Abstract: In a device and a method for aligning and holding a plurality of singulated semi-conductor components in receiving pockets of a terminal carrier (5) that are separated from each other, the terminal carrier (5) has spring elements (12a, 12b), which are part of a spring plate (2). The spring plate (2) has a plurality of recesses (11) disposed next to each other for forming a corresponding plurality of receiving pockets (6) for the semi-conductor components, wherein the spring elements (12a, 12b) are formed from the spring plate (2) in one piece.

Abstract: A closure mechanism for pressure test chambers for testing electronic components, in particular ICs, has a plurality of pivoting jaws. At least some of the pivoting jaws have at least one lifting apparatus which can be advanced to two interacting cavity elements, which surround a cavity, by means of the pivoting jaws. Furthermore, at least some of the pivoting jaws have at least one locking device in order to move spacer elements into an intermediate space between the associated pivoting jaws and the compressed cavity element, as a result of which the tightness of the cavity is maintained even when the lifting apparatuses are retracted.

Abstract: A plunger for holding and moving electronic components in particular for introduction and removal of IC's to and from a contacting device connected to a test bed comprises a plunger head with at least one suction head for sectional contact with a component. A heat-conducting body, temperature-controlled by means of a fluid, is arranged such that the suction-contacted component is in contact with the heat-conducting body. The suction head passes through the heat-conducting body.

Abstract: A centering device for electronic components, particularly for ICs, has at least one centering unit comprising two L-shaped centering elements and two coupling elements. The centering elements and coupling elements are hinged together such that a pivoting movement of the coupling elements is forcibly coupled to a parallel displacement of the centering elements, thus causing a widening or narrowing of a centering opening for the components.

Abstract: In the case of a test apparatus for testing electronic components which are present in an assembly, in particular in the form of strips, a slide-like contacting board supporting device, to which the contacting board can be fastened, is mounted on the test head. The contacting board supporting device can be moved parallel to the plane of the contacting board when the contacting nest is docked on the test head, with the result that the contacting board can be brought into different test positions which are laterally beside one another.

Abstract: The technology herein relates to a handler for testing electronic components, said handler comprising an acceleration device provided with a tappet which is linearly guided by means of at least one flat spring comprising two groups of spring arms, one group being fixed to the tappet and the other group to a frame which is stationary in relation to a housing of the movement generation device. Handler comprising an acceleration device for testing electronic components.

Abstract: A guide path for electronic components has guide elements by means of which the components are guided obliquely with respect to the direction of the light beams at least in the area of a light barrier, such that the component produces a shadow area which is higher than the side end surface of the component.