Abstract: A device for testing electronic components such as integrated circuit ICs, under particular pressure conditions, has a pressure test chamber with contact elements which on the one hand are connected to an electronic testing device and on the other hand extend into a cavity of the pressure test chamber. Arranged inside the cavity of the pressure test chamber, there is and air-fight sealing board which extends transversely over the contact elements and is sealed peripherally from an assigned pressure chamber half. By means of the sealing board, first contact element sections are separated air-tightly from second contact element sections but are in electrically conductive connection.

Abstract: In the case of a handling apparatus for passing electronic components, in particular ICs, which are provided in a component carrier, to a testing apparatus, a component holder having a positioning device is provided and has movable clamping elements which can be moved from an open position, in which they are at a distance from the side edges of the component, into a clamping position, in which they apply a pressure force, which prevents lateral movement of the component, to the side edges of the component.

Abstract: In a cold test device for electronic components, there are a cryogenic fluid supply line (5) for supply of a liquid cryogenic fluid, an evaporator (9), a cryogenic fluid line (11) for transporting the gaseous cryogenic fluid to the electronic component (3), in the cryogenic fluid line (11) which transports the gaseous cryogenic fluid there being a volumetric flow regulator (13, 13?, 13?) which stabilizes the pressure and the volumetric flow of cryogenic fluid.

Abstract: In the case of a test apparatus for testing electronic components which are present in an assembly, in particular in the form of strips, a slide-like contacting board supporting device (28), to which the contacting board (22) can be fastened, is mounted on the test head (15), wherein the contacting board supporting device (28) can be moved parallel to the plane of the contacting board when the contacting nest (24) is docked on the test head (15), with the result that the contacting board (22) can be brought into different test positions which are laterally beside one another.

Abstract: A guide path for electronic components has guide elements by means of which the components are guided obliquely with respect to the direction of the light beams at least in the area of a light barrier, such that the component produces a shadow area which is higher than the side end surface of the component.

Abstract: In the case of a position-correction device for correcting the position of a component holder of a handling apparatus for electronic components, in particular ICs, a base plate and a centering frame which can be displaced in relation to the base plate are provided in the region of a contact unit. A drive device is also provided and is operatively connected to the centering frame in order to displace the centering frame and thus the component holder inserted into the centering frame as a function of correction values which are calculated by a computation device on the basis of measured values which are obtained by a position-detection device for detecting the actual position of the component which is to be tested and is held in the component holder.

Abstract: In the case of a handling apparatus for passing electronic components, in particular ICs, which are provided in a component carrier, to a testing apparatus, a component holder having a positioning device is provided and has movable clamping elements which can be moved from an open position, in which they are at a distance from the side edges of the component, into a clamping position, in which they apply a pressure force, which prevents lateral movement of the component, to the side edges of the component.

Abstract: In a cold test device for electronic components, there are a cryogenic fluid supply line (5) for supply of a liquid cryogenic fluid, an evaporator (9), a cryogenic fluid line (11) for transporting the gaseous cryogenic fluid to the electronic component (3), in the cryogenic fluid line (11) which transports the gaseous cryogenic fluid there being a volumetric flow regulator (13, 13?, 13?) which stabilizes the pressure and the volumetric flow of cryogenic fluid.

Abstract: In a docking apparatus for coupling a first apparatus consisting of a handler or prober and a second apparatus consisting of a testing head for electronic components, at least one locking unit is provided having an axial insertion opening for inserting a locking pin. In the area of the insertion opening, a plurality of balls are arranged, between which the locking pin is insertable. Furthermore, a ball clamping sleeve is provided, which by means of an axial displacement causes a radial movement of the balls and therefore fixes the locking pin.

Abstract: In a guiding apparatus for positionally accurate docking of a testing head for electronic components to a handler or prober, a guiding pin is provided, arranged to be displaceable in a direction normal to its longitudinal direction on an attachment block attached on a testing head or handler/prober. Within the attachment block, a taper pin is provided longitudinally displaceable and carrying a taper tip on its end facing the guiding pin. The guiding pin has a centering recess on its side facing the taper pin. The taper tip can be brought into and out of engagement with the centering recess, wherein by inserting the taper tip into the centering recess a predetermined position of the guiding pin with respect to the attachment block, and therefore with respect to that device, which carries the guiding pin, can be achieved.

Abstract: An apparatus for separating objects of the same kind, in particular electronic components such as integrated circuits (IC's), that are delivered in succession in a sloping delivery passage, the apparatus having a stop member arranged in the region of the delivery passage that is displaced substantially transverse to the direction of delivery so that it holds back or holds fast the respective foremost object, and having a control circuit (P) that cyclically controls the displacing movement of the stop member, is to be designed so that while ensuring a relatively long service life it is suitable for use for different components, in particular with regard to their length.

Abstract: An apparatus for testing and sorting electronic components (33), in particular IC's, is directly mounted on the mounting (2a, 2b to 10a, 10b), preferably forming part of a manipulator, for a test computer. In order to convey the components (33) between an input magazine (16), a testing head (20) and an output magazine (17) a suction head (20) is provided which is movable on a carriage guide (15) and which may be lowered. The mounting forming part of the manipulator permits the test computer (1) and the whole apparatus arranged on a slope so that the components (33) in the magazine rods (26) of the input magazine (16) and the output magazine (17) slide forwards under gravity.

Abstract: In a device for testing and sorting electronic components, and more particularly integrated circuit chips, the untested components are arranged in parallel magazine channels, which are arranged on a gradient, of an input magazine. The tested components are collected in an output magazine set up in the same way. The magazines are to be suitable, more particularly, for taking up CC (chip carrier) components. These components have a free rear surface upon which they can slip in the magazine channels arranged on a gradient. The magazines consist of a flat base plate (15), upon which guide rails, which are T-shaped in cross section, are mounted in such a way that they limit the magazine channels at the side and at the top, the guide rails being connected with each other to form a block which, as a whole, is capable of being exchanged. The components are tested in a channel, their connecting contacts being connected up with corresponding test contacts.

Abstract: In the case of an apparatus for testing and sorting oblong, electronic components, more particularly integrated chips, the components, which have been supplied in a row, are separated by means of a separating arrangement. The separating arrangement consists of a belt conveyer, which is arranged above a slideway for the components which have been supplied and which takes hold of the components which have been supplied and pushes them forward on the slideway. A control signal, which is emitted by a detecting arrangement which is arranged after the separating arrangement, is used for the purpose of stopping the belt conveyer so that the component, which has just been delivered by the belt conveyer, can, in the first instance, be tested. After testing has taken place, the belt conveyer is set in operation again.

Abstract: In a device for receiving components (8', 8", 8"'), particularly integrated chips, in receiving portions (15, 19, 20, 21, 22) of an input and/or output magazine of a component testing machine, with a testing device, the receiving portions are formed by providing grooves for each portion, in a support plate (14), at a distance corresponding to the varying distance between connections of the components to be received.