Abstract: An electronic component includes a base body, a first internal electrode, and a first external electrode. The first internal electrode is located inside the base body. The first external electrode covers a part of the outer surface of the base body. The first external electrode includes a first electrode covering a part of the outer surface of the base body and connected to the first internal electrode, and a second electrode covering the outer surface of the first electrode. The second electrode has spherical copper particles and silicon. An average size of the spherical copper particles is different in a first part of the second electrode than in a second part of the spherical electrode.

Abstract: Disclosed embodiments include a hybrid power converter including a switched capacitor converter and a buck converter in parallel where the buck converter is operated in an open loop and non-regulated mode; the switched capacitor converter and the buck converter are connected to an input terminal, where the switched capacitor converter operates in an open loop and non-regulated mode and provides power to a load based on an input voltage, the buck converter operates in an open loop mode and provides power to the load based on the voltage of the input terminal, and the controller enables the buck converter to provide power to the load based on at least one of a voltage of the load or a current of the load.

Abstract: An antenna module includes a ground electrode disposed in a dielectric substrate (and radiating elements and feed wiring lines. The radiating elements are disposed to face the ground electrode. The feed wiring lines transmit radio frequency signals to the radiating elements. The radiating element is disposed between the radiating element and the ground electrode. The radiating element is disposed between the radiating element and the ground electrode. The radiating element is larger in size than the radiating element, and the radiating element is larger in size than the radiating element. In plan view in a direction normal to the dielectric substrate, the radiating elements are disposed to overlap with each other. The feed wiring line transmits a radio frequency signal to the radiating element. The feed wiring line transmits a radio frequency signal to the radiating elements.

Abstract: An electronic component includes a base body, and a first internal electrode and a second internal electrode located inside the base body. In addition, the electronic component includes a first external electrode and a second external electrode that cover a part of the outer surface of the base body and do not contain a silver component. The first external electrode includes a first electrode covering a part of the outer surface of the base body and connected to the first internal electrode, and a second electrode covering the outer surface of the first electrode. The second electrode contains copper particles and a silicone resin as a synthetic resin. When viewed in a specific section including the first electrode and the second electrode, the copper particles of the second electrode are in line contact with the outer surface of the first electrode.

Abstract: An inductor component includes an insulating body, and a coil inside the body and wound around an axis. The coil includes a first coil wiring layer that extends in a direction intersecting with a first direction parallel to the axis, and a second coil wiring layer that is away from the first coil wiring layer in an axis direction and extends in a direction intersecting with the axis direction. The first and second coil wiring layers configure a facing portion in which they face each other with an interlayer insulating portion, which is part of the body, between them. In a cross section, of the facing portion, orthogonal to an extending direction of the first coil wiring layer, the first coil wiring layer has a first upper surface that is on an interlayer insulating portion side.

Abstract: A first chip includes a first insulating layer, a first device layer laminated on the first insulating layer, a first multilayer wiring layer laminated on the first device layer, and a first anchor. A high-frequency circuit is in the first chip. A second chip includes a substrate, a second multilayer wiring layer on the substrate, and a second anchor. A control circuit that controls the high-frequency circuit is in the second chip. The first anchor is embedded in the first device layer and the first insulating layer, and exposed from a surface of the first insulating layer. The second anchor is embedded in the second multilayer wiring layer, and exposed from a surface of the second multilayer wiring layer. The first and second anchors are formed from an identical metal material.

Abstract: An electronic component includes a base body and an alumina film covering an outer surface of the base body. The alumina film includes a film-shaped part made of alumina and in contact with the outer surface of the base body, and a particle layer located on the outer surface side of the film-shaped part. The particle layer includes a plurality of alumina particles bonded to the outer surface of the film-shaped part. The average value of the thicknesses of the alumina film including the film-shaped part and the particle layer is 0.05 ?m or more and 2.0 ?m or less. The interval between the particles is 1.3 ?m or less.

Abstract: A composite component device including two or more composite component layers having an electronic component layer and a rewiring layer on the electronic component layer. The two or more composite component layers are laminated in a thickness direction such that the electronic component layer and the rewiring layer are alternately disposed, and the electronic component layer has one or more electronic components having an electronic component main body having a first surface perpendicular to the thickness direction and a second surface opposed to the first surface; and component electrodes on the first surface. The component electrode of the one or more electronic components is electrically connected to the rewiring layer, and an electronic component layer in a composite component layer adjacent to the rewiring layer of two or more composite component layers has an electronic component layer through-via electrically connected to the rewiring layer of another composite component layer.

Abstract: In a cover for covering a part of an oral instrument, a cover member is formed in a bag shape having an opening formed by partially bonding a measurement surface side sheet and an upper side sheet disposed to face each other. A protective sheet is bonded to the measurement surface side sheet of the cover member. The protective sheet protrudes from an opening edge of the cover member when viewed in a thickness direction of the cover member. Further, a bonded portion where the protective sheet and the cover member are bonded to each other is disposed along the opening edge of the cover member.

Abstract: A device may include a coil unit assembly that includes a first, second, and third coil unit annularly arranged. Further, may include a busbar provided on an outer peripheral surface of the coil unit assembly, wherein when a direction in which an axis of the stator extends is defined as an axial direction, a direction which is orthogonal to the axial direction and in which outer peripheral surface and inner peripheral surface of the stator face each other is a radial direction, and a direction along an outer periphery of the stator when viewed from the axial direction is a circumferential direction, wherein the coil units each include a split core that includes a tooth that extends in the radial direction, an insulator mounted to overlap at least the tooth of the split core, and a coil that includes a winding wound around the tooth of the split core with the insulator interposed therebetween.

Abstract: An inductor including a conductor having a plate thickness is embedded in a core containing magnetic powder. The core includes a mounting surface facing a mounting substrate side at the time of mounting, an upper surface facing the mounting surface, and a pair of end surfaces orthogonal to the mounting surface. The conductor includes a conductive wire extending inside the core over the pair of end surfaces, and a pair of electrode terminals. Each electrode terminal includes an electrode portion at respective end portions of the conductive wire and exposed to the mounting surface, and first and second bent portions having a first bend and second bend, respectively, which are each 2.0 times to 3.0 times the plate thickness. When one of the first and second bends is 2.0 times or more the plate thickness, the other is less than 3.0 times the plate thickness.

Abstract: A power amplifier circuit 10 includes amplifiers 102 and 103, bias circuits 1023 and 1033, and a control circuit 106 that controls the bias circuits 1023 and 1033. When the power amplifier circuit 10 operates in a low power mode, the control circuit 106 controls the bias circuit 1023 and the bias circuit 1033 such that a bias current or voltage is supplied to the amplifier 102 and a bias current or voltage is not supplied to the amplifier 103. When the power amplifier circuit 10 operates in a high power mode in which an output power is higher than an output power in the low power mode, the control circuit 106 controls the bias circuit 1023 and the bias circuit 1033 such that a bias current or voltage is supplied to the amplifier 102 and a bias current or voltage is supplied to the amplifier 103.

Abstract: A power amplifier circuit includes an amplifier circuit, a bias circuit, a detector, and a control circuit. The amplifier circuit includes a first bipolar transistor. The bias circuit includes an emitter follower. The emitter follower includes a second bipolar transistor and supplies a bias current to the base of the first bipolar transistor. The detector detects the voltage of a power supply terminal connected to the collector of the first bipolar transistor. The control circuit includes a current limiting circuit disposed between a battery terminal and the collector of the second bipolar transistor. The control circuit changes an upper limit value of a control current to be supplied to the collector of the second bipolar transistor, based on the voltage detected by the detector.

Abstract: An acoustic wave element includes a piezoelectric substrate, an IDT electrode on the piezoelectric substrate, and a reflector. The IDT electrode includes plural electrode fingers, and the reflector includes plural reflector electrode fingers. In a case where IRGAP is an IDT-reflector gap that is a distance between a center of the electrode finger located closest to the reflector and a center of the reflector electrode finger located closest to the IDT electrode, and ?REF is a reflector wave length that is twice a repetition pitch of the reflector electrode fingers, a ratio of about 0.25?IRGAP/?REF?about 0.44 is satisfied, and the reflector wave length is longer than an IDT wave length that is a repetition pitch of the electrode fingers.

Abstract: A ceramic electronic component includes: a ceramic body having a first surface; an external electrode disposed at least on the first surface; an internal electrode disposed inside the ceramic body; and a connection conductor connected to the external electrode and extending through a surface or an interior of the ceramic body to electrically connect to the internal electrode. The external electrode includes an overhanging portion extending laterally from its portion connected to the connection conductor. At least a portion of the overhanging portion is a peeled portion peeled off from the ceramic body.

Abstract: In a radio-frequency circuit, a first switch is connected to an antenna terminal. A second switch is connected to the first switch and is connected to the antenna terminal via the first switch. A first filter is connected to the first switch without having the second switch interposed therebetween and allows a radio-frequency signal of a first communication band to pass through the first filter. A second filter is connected to the first switch via the second switch and allows a radio-frequency signal of a second communication band to pass through the second filter. The second communication band is higher than the first communication band. The radio-frequency circuit further includes an inductor. The inductor is not connected in series with the first filter and is connected in series with the first switch and the second switch between the first switch and the second switch.

Abstract: An RFID module is provided that includes a substrate having first and second main surfaces; an RFIC chip and a coil conductor on the first main surface; and a first conductor pattern within the substrate. The coil conductor includes a plurality of coil elements each having a pair of legs and a bridge connecting first ends of the pair of legs. The coil elements are arranged in a row across a predetermined winding axis; and a second conductor pattern is on the first main surface and connects with the coil elements to form a coil shape. A first end of the RFIC chip is connected to a first end of the coil conductor. The first conductor pattern is between the second ends of the RFIC chip and the coil conductor. The first conductor pattern has a fold-back portion where the direction in which the pattern extends is folded back.

Abstract: A module includes a substrate including a first surface, a first component mounted on the first surface, at least a part of which is covered with a first conductive film, a sealing resin arranged to cover the first surface and the first component, and a shield film that covers a part of a surface of the sealing resin on a side distant from the substrate. The surface of the sealing resin on the side distant from the substrate includes a shielded region covered with the shield film when viewed in a direction perpendicular to the first surface and a non-shielded region not covered with the shield film. The non-shielded region is superimposed on at least a part of the first conductive film.

Abstract: An output matching circuit includes: a converter electrically connected to an output end of a power amplifier element to convert an impedance of the output end to an impedance higher than the impedance of the output end by magnetic coupling; and a first filter circuit electrically connected between the output end of the power amplifier element and the converter to make a short circuit in a frequency band different from a predetermined transmission frequency band.

Abstract: A module includes a substrate including a first surface, a first component mounted on the first surface, at least a part of a surface of which on a side distant from the substrate is covered with a first conductive film, a sealing resin arranged to cover the first surface and the first component, and a shield film that covers at least a part of a surface of the sealing resin on the side distant from the substrate. The shield film includes a first shield portion superimposed on at least a part of the first conductive film and a second shield portion. The first shield portion is isolated from the second shield portion by a groove that divides the shield film and is provided to such a depth as entering the sealing resin. The first shield portion is electrically independent.