Abstract: A short-range wireless communication device includes a coil, a capacitor, a short-range wireless communication IC, and a rectifier circuit. The short-range wireless communication IC and the rectifier circuit are connected to the coil via a node. The capacitor is connected between the node and the rectifier circuit. A receiving circuit is composed of the coil and a power-receiving circuit is composed of the coil and the capacitor. An output impedance of the receiving circuit is set larger than an output impedance of the power-receiving circuit at a communication frequency, and the output impedance of the power-receiving circuit is set smaller than the output impedance of the receiving circuit at a power-receiving frequency, by appropriately setting capacitance of the capacitor.

Abstract: A mounting nozzle is capable of holding an electronic component having multiple patterns provided on its pattern surface based on pattern design information. A camera is capable of capturing an image of the pattern surface of the electronic component. A movement mechanism is capable of moving the mounting nozzle between a location where capturing of the image by the camera is performed and a component mounting location. A control unit is capable of controlling the mounting nozzle and the movement mechanism. The control unit stores positional relationship information indicating positional relationship based on the pattern design information between a position of a registration pattern representative point identified by at least one registration pattern selected from the multiple patterns provided on the pattern surface and a position of a positioning reference point on which positioning of the electronic component at the component mounting location for mounting is based.

Abstract: A capacitor including a lower layer electrode, a dielectric film, and an upper layer electrode sequentially laminated on a partial area of an upper surface serving as one surface of a substrate formed from a compound semiconductor from a side closest to the substrate is disposed. A coating formed from an insulating metal oxide or a silicon oxide is disposed on or above the dielectric film. When the upper surface is viewed in a plan, the coating extends throughout an edge of the lower layer electrode from an area inside the edge of the lower layer electrode to an area outside the edge.

Abstract: An inductor component capable of reducing an electrical resistance of an inductor wire includes an element body; an inductor wire that is provided in the element body and wound on a plane; and an insulation wall that is provided on both side surfaces of the inductor wire in a direction orthogonal to an extension direction of the inductor wire and parallel to the plane. The insulation wall including a first portion provided on an inner peripheral surface of an innermost periphery of the inductor wire and a second portion provided on an outer peripheral surface of an outermost periphery of the inductor wire. Also, in a section orthogonal to the extension direction of the inductor wire, at least one of the first portion and the second portion being inclined with respect to a first direction orthogonal to the plane.

Abstract: An inductor component comprising an element body; a helically wound coil disposed in the element body; and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a plurality of insulating layers and a mark layer constituting a portion of an outer surface of the element body, and a K abundance ratio (atom %) in the mark layer is higher than a K abundance ratio (atom %) in the insulating layers.

Abstract: A short-range wireless communication device includes a receiving circuit, a power-receiving circuit, a short-range wireless communication IC, a rectifier circuit, and a load circuit. The receiving circuit and the power-receiving circuit have a common circuit portion composed of a coil, a capacitor, and a capacitor. The coil and the capacitor constitute a first parallel resonance circuit, and the coil, the capacitor, and the capacitor constitute a second parallel series resonance circuit. The first parallel resonance circuit and the second parallel series resonance circuit function as impedance adjusting circuits, an output impedance of the receiving circuit is adjusted to be higher than or equal to a first predetermined value for realizing load modulation and an output impedance of the power-receiving circuit is adjusted to be lower than or equal to a second predetermined value for realizing power supply, and operations of the receiving circuit and the power-receiving circuit are realized.

Abstract: Transmission signal generation circuitry generates a transmission chirp, and the transmission chirp is transmitted from a transmission antenna. A reflected wave, from an object to be detected, of the transmission chirp transmitted from the transmission antenna is received by a reception antenna. A mixer mixes the transmission chirp and a reception chirp received by the reception antenna to generate an intermediate frequency signal. Signal processing circuitry obtains, for a plurality of respective analysis periods corresponding to different frequency bands of the transmission chirp, frequency spectral waveforms of the intermediate frequency signal, detects a peak appearing in the plurality of frequency spectral waveforms, and determines, based on variations in peak position among the plurality of frequency spectral waveforms, whether or not the peak is due to a valid object.

Abstract: A radio-frequency module includes amplifiers and, a transformer including a primary coil and a secondary coil, an antenna connection terminal, an inductor disposed in series between one end of the secondary coil and the antenna connection terminal, and a capacitor connected between a path connecting the one end of the secondary coil and the inductor and a ground. One end of the primary coil is connected to an output end of the amplifier, another end of the primary coil is connected to an output end of the amplifier, another end of the secondary coil is connected to the ground, and the secondary coil and the inductor are coupled to each other via magnetic field coupling.

Abstract: An antenna device includes a ground plane, a flat-plate-shaped first feed element, a flat-plate-shaped second feed element, a first feed line connected to the first feed element, and a second feed line connected to the second feed element. The ground plane, the first feed element, and the second feed element are stacked respective order and spaced apart from each other. At least part of the second feed line is disposed in a same conductor layer as the ground plane and is disposed at a position that overlaps the first feed element as the ground plane is viewed from a plan view.

Abstract: A pair of first members each have an electrically conductive surface and a disposed to face each other. A plurality of second members each made of an electrically conductive material are disposed between the pair of first members. The plurality of second members are arranged in a periodic pattern in at least one direction parallel to the conductive surface and disposed between the pair of first members. A dielectric member is disposed between each of the plurality of second members and each of the pair of first members. The dielectric member is in contact with the plurality of second members and with the pair of first members. An electronic component is provided that is configured to control propagation of radio waves such as microwaves, millimeter waves, or sub-millimeter waves, and that allows for reduced deflection of the conductive surface.

Abstract: An inductor component includes an element assembly, a coil that is within the element assembly and is spirally wound in the coil axis direction, a first outer electrode electrically connected to one end of the coil, and a second outer electrode electrically connected to the other end of the coil. The element assembly includes an insulator, and a face of the element assembly includes a bottom face parallel to a coil axis direction, and a top face opposed to the bottom face in a height direction T orthogonal to the coil axis direction. The first and second outer electrodes each are exposed to at least the bottom face of the element assembly. The coil is formed by electrically interconnecting a plurality of coil wires laminated in the coil axis direction.

Abstract: An inductor component capable of improving an inductance value includes an element body that includes a magnetic layer and has a first principal surface and a second principal surface opposite to each other; a coil in the element body; and an insulation layer that covers a part of an outer surface of the coil. The coil has a first inductor wire wound along a plane orthogonal to a first direction which is orthogonal to the first principal surface and is from the second principal surface toward the first principal surface. At least a part of an inner peripheral surface of an innermost periphery of the first inductor wire is in contact with the magnetic layer without being covered with the insulation layer.

Abstract: A stacking apparatus includes a stacking stage, a correction mechanism, a driving mechanism, and a linear-motion mechanism. The stacking stage has a stacking surface, on which objects are to be stacked in layers. The correction mechanism moves the stacking stage in a direction parallel to the stacking surface. The driving mechanism moves the stacking stage in a direction perpendicular to the stacking surface. The linear-motion mechanism connects the stacking stage and the correction mechanism, gives freedom of movement in the direction perpendicular to the stacking surface and constrains movement in the direction parallel to the stacking surface. The driving mechanism includes a main body part that does not overlap the stacking stage when viewed in the direction perpendicular to the stacking surface, and an arm part that extends from the main body part and between the stacking stage and the correction mechanism and supports the stacking stage.

Abstract: A high-frequency module (1) includes a mounting substrate (90), a duplexer (60L) arranged on the mounting substrate (90), a duplexer (60H) arranged on the mounting substrate (90) and having a pass band with a higher frequency than a pass band of the duplexer (60L), and a semiconductor control IC (40) arranged on the mounting substrate (90) and stacked with the duplexer (60L) of the duplexers (60L and 60H).

Abstract: An inductor includes a coil having a winding portion, and a pair of lead-out portions extended from the winding portion; a body containing the coil and including a magnetic portion, the magnetic portion including metallic particles and a first resin; and a pair of outer electrodes on a surface of the body. The body has a metallic-particle exposed region on its surface. Each outer electrode includes a conductive resin layer, and a first plating layer on the conductive resin layer. The conductive resin layer is disposed on at least the metallic-particle exposed region. The first plating layer includes a first covering region covering the conductive resin layer, and a first extending region continuous to the first covering region and extending to at least the metallic-particle exposed region. The first plating layer is connected with at least a portion of the metallic particles on the metallic-particle exposed region.

Abstract: A microelectromechanical accelerometer for measuring acceleration, comprising a first proof mass and ae second proof mass. The first proof mass is adjacent to the second proof mass. A suspension structure allows the first proof mass to undergo rotation out of the device plane about a first rotation axis and the suspension structure allows the second proof mass to undergo rotation out of the device plane about a second rotation axis. The first and second rotation axes are parallel to each other and define an x-direction which is parallel to the first and the second rotation axes and a y-direction which is perpendicular to the x-direction. The y-coordinate of the first rotation axis is greater than the y-coordinate of the second rotation axis by a nonzero distance D.

Abstract: A magnetic-component module includes a substrate, a core on a first surface of the substrate, a spacer on the core, a gap between a bottom surface of the core and the first surface of the substrate, a winding including wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate, and traces on and/or in the substrate, and an overmold material encapsulating the core, the spacer, and the wire bonds and filling the gap.

Abstract: Circuits and methods for extending the linear range of IC-based environmental sensors. The IC-based environmental sensors may sense environmental characteristic such as humidity levels, the presence and/or concentration of specific chemicals, and/or the presence and/or concentration of specific biological molecules. The linearity of an environmental sensor can be extended by heating the sensor within a range of non-linear operation to artificially induce the sensor to operate within its linear range, and then accurately measuring, either directly or indirectly, the temperature rise caused by such heating. A correction factor is then determined based on the measured temperature rise that is combined with measurements from the sensor while operating within its non-linear range in order to generate an accurate estimate of an actual environmental characteristic.

Abstract: The coil component includes a magnetic body containing a metallic material and a resin material, a coil conductor embedded in the magnetic body, and a pair of outer electrodes electrically connected to ends of the coil conductor. The coil conductor includes an exposed portion at each end portion of the coil conductor, and a covered portion covered with an insulating substance disposed between the exposed portions. The covered portion is disposed inside a face of the magnetic body on which the outer electrodes are disposed.

Abstract: Three-dimensional capacitive structures may be produced by forming a capacitive stack conformally over pores in a region of porous anodic oxide. The porous anodic oxide region is provided on a stack of electrically-conductive layers including an anodization-resistant layer and an interconnection layer. In the pores there is a position having restricted diameter quite close to the pore bottom. In a first percentage of the pores in the region of anodic oxide, a functional portion of the capacitive stack is formed so as to extend into the pores no further than the restricted-diameter position. Cracks that may be present in the anodization-resistant layer have reduced effect on the properties of the capacitive structure. Increased thickness of the anodization-resistant layer can be tolerated, enabling equivalent series resistance of the overall capacitive structure to be reduced.