Abstract: A measuring device is provided for reducing the occurrence of damage to a sensor section. The sensor section includes a substrate, a pair of comb electrodes on a first principal surface, and a pair of back-side electrodes disposed on a second principal surface and corresponding to the pair of comb electrodes, respectively. The pair of comb electrodes includes a plurality of tooth sections and connection sections that connect the tooth sections to each other, respectively. The substrate includes via-hole conductors in positions corresponding to the tooth sections inside a region surrounded by the outer tooth sections on opposite ends in a direction in which the tooth sections in the pair of comb electrodes are aligned and the connection sections. The via-hole conductors connect the comb electrodes and the back-side electrodes.

Abstract: A multilayer ceramic capacitor includes dielectric layers made of a ceramic material and internal electrode layers laminated therein. The internal electrode layers each include dielectric columns provided therein. A solid solution layer in which S is solidly dissolved is provided at an interface between each of the dielectric columns and each of the internal electrode layers.

Abstract: An electronic device is provided in which a capacitance of a capacitor that is formed between one or more reference second touch sensor electrodes and at least one first touch sensor electrodes is defined as a first reference capacitance with the capacitor formed when the touch sensor is folded along a folding line. Moreover, a capacitance of a capacitor formed between a left second touch sensor electrode and at least one of the plurality of first touch sensor electrodes is defined as a left capacitance. Furthermore, a capacitance of a capacitor formed between a right second touch sensor electrode and at least one of the plurality of first touch sensor electrodes is defined as a right capacitance. Using these capacitances, a determining unit of the electronic device can determine that a touch sensor is folded if both the left and the right capacitances are greater than the first reference capacitance.

Abstract: A solid electrolytic capacitor that includes a resin molding including: a capacitor element laminate, the capacitor element laminate including a first layer and a second layer that are laminated together, the first layer includes a valve-action metal substrate exposed at a first end surface of the resin molding, the second layer includes an electrode lead-out layer exposed at a second end surface of the resin molding; an insulating substrate; and a sealing resin enclosing the capacitor element laminate; a first external electrode on a first end surface of the resin molding and connected to the valve-action metal substrate; a second external electrode on a second end surface of the resin molding and connected to the electrode lead-out layer; and a dummy layer not contributing to a capacity of the capacitor on a main surface of the capacitor element laminate in a lamination direction thereof and adjacent to the insulating substrate.

Abstract: A longitudinally coupled resonator acoustic wave filter includes a piezoelectric substrate, IDT electrodes on the piezoelectric substrate along an acoustic wave propagation direction, and a pair of reflectors on the piezoelectric substrate on both sides of the IDT electrodes in the acoustic wave propagation direction. Each of the reflectors includes first and second reflector busbars, and first reflective electrode fingers connected to at least one of the first reflector busbar and the second reflector busbar. The reflector includes a first portion in which lengths of the first reflective electrode fingers change in the acoustic wave propagation direction.

Abstract: A regulator for an interleaved power factor correction circuit to enhance current sharing performance includes adjuster circuitry that determines a duty cycle adjustment; judge circuitry that determines whether to activate the adjuster circuitry; distributor circuitry that determines tuned duty cycles based on input duty cycles and the duty cycle adjustment; and tuner circuitry that determines tuned average inductor currents in first and second phases of the interleaved power factor correction circuit based on the tuned duty cycles.

Abstract: Methods of fabricating acoustic filters are disclosed. The back of a piezoelectric plate is bonded to a surface of a substrate. The thickness of the piezoelectric plate is measured at a plurality of positions. Excess material is removed from the front surface of the piezoelectric plate in accordance with the thickness measurements to improve the thickness uniformity of the piezoelectric plate. After removing the excess material, a conductor pattern including a plurality of ladder filter circuits is formed on the front surface. Each ladder filter circuit includes at least one shunt resonator and at least one series resonator, each of which has an interdigital transducer (IDT). Cavities are formed in the substrate such that portions of the piezoelectric plate form a plurality of diaphragms spanning respective cavities. After the cavities are formed, interleaved fingers of each IDT are on a respective one of the plurality of diaphragms.

Abstract: A semiconductor package includes a module substrate having opposite top and bottom surfaces, a semiconductor chip provided with bumps and mounted on the top surface of the module substrate via the bumps, and a metal member having a top portion disposed at a level higher than the semiconductor chip with reference to the top surface of the module substrate and including the semiconductor chip in plan view and a side portion extending from the top portion toward the module substrate. The module substrate includes a first metal film disposed on or in at least one of the bottom surface and an internal layer of the module substrate. The first metal film is electrically connected to the bumps and reaches a side surface of the module substrate. The side portion is thermally coupled to the first metal film at the side surface of the module substrate.

Abstract: A magnetic-component module includes a substrate, a core on a first surface of the substrate, a spacer on the core, a winding including wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate, and traces on and/or in the substrate, a lead frame that supports the core and that electrically connects the winding to the substrate, and an overmold material encapsulating the core, the spacer, the wire bonds, and a portion of the lead frame.

Abstract: A transmission line includes first, second, third, and fourth signal lines, and first, second, third, and fourth electrode pads respectively connected thereto. A first main surface of an external connection portion includes a first region in which the first electrode pad and the second electrode pad are provided, and a second region in which the third electrode pad and the fourth electrode pad are provided. Each of the first electrode pad and the second electrode pad, in a plan view, is surrounded by a ground electrode, and at least one of the third electrode pad and the fourth electrode pad, in the plan view, includes a portion that is not surrounded by the ground electrode.

Abstract: A multiplexer includes a first filter on a first path, a second filter on a second path, and a third filter on a third path. A frequency of intermodulation distortion generated by a transmission signal within a pass band of the first filter and a transmission signal within a pass band of the second filter is within a pass band of the third filter. The first filter includes one or more series resonators on the first path and one or more parallel resonators on one or more paths connecting one or more nodes on the first path to a ground. A relative permittivity of a resonator of the one or more series resonators and the one or more parallel resonators that is closest to a common terminal is lowest among relative permittivities of the resonators.

Abstract: Acoustic resonator devices and filters are disclosed. An acoustic resonator includes a substrate having a trap-rich region adjacent to a surface and a single-crystal piezoelectric plate having parallel front and back surfaces, the back surface attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm that spans a cavity in the substrate. An interdigital transducer (IDT) is formed on the front surface of the single-crystal piezoelectric plate such that interleaved fingers of the IDT are disposed on the diaphragm. The single-crystal piezoelectric plate and the IDT are configured such that a radio frequency signal applied to the IDT excites a shear primary acoustic mode within the diaphragm.

Abstract: A directional coupler includes a multilayer body, a conductor (31), and a conductor (32). The conductor (31) is a conductor that is arranged in an insulating layer (21) of the multilayer body and that extends in a certain shape. The conductor (32) is arranged on a side of an insulating layer (22) of the multilayer body opposite the insulating layer (21). The conductor (32) runs parallel to the conductor (31) and is electromagnetically coupled to the conductor (31). The conductor (32) has a winding shape with one or more rounds, and has a conductor portion (321) and a conductor portion (325) that are arranged adjacent to each other with a spacing in a direction orthogonal to a running parallel direction. In plan view of the multilayer body, the conductor (31) is arranged between the conductor portion (321) and the conductor portion (325).

Abstract: An acoustic wave device includes a piezoelectric body including first and second main surfaces facing each other, an IDT electrode provided on the first main surface of the piezoelectric body and including electrode fingers, a high acoustic velocity member on the second main surface side of the piezoelectric body, in which an acoustic velocity of a propagating bulk wave is higher than an acoustic velocity of an acoustic wave propagating through the piezoelectric body, and a first dielectric film provided on an upper surface of the electrode fingers, in which a portion where a dielectric is not present is provided between the electrode fingers of the IDT electrode.

Abstract: A band pass filter includes filter circuits, first and second intermediate circuits, and a first capacitor. The first intermediate circuit includes an inductor connected between second and third capacitors. The second intermediate circuit includes an inductor connected between third and fourth capacitors. Resonant circuits included in the filter circuit are connected to ground via a common capacitor. Resonant circuits included in the filter circuit are connected to the ground via a common capacitor. The first capacitor is connected between the first and second intermediate circuits.

Abstract: There are disclosed acoustic diplexers and radios incorporating the acoustic diplexers. A diplexer includes common port, a low band port, a high band port, n low band sub-filters, and n high band sub-filters, where n is an integer greater than one. Each low band sub-filter has a first sub-filter port connected to the common port and a second sub-filter port connected to the low band port. Each high band sub-filter has a first sub-filter port connected to the common port and a second sub-filter port connected to the high band port. A first acoustic resonator is connected from the common port to ground and a second acoustic resonator is connected from the low band port to ground. The first and second acoustic resonators are configured to create respective transmission zeros adjacent to a lower edge of a passband of the diplexer.

Abstract: A wiring electrode on a piezoelectric substrate includes layers including an adhesive layer in contact with the piezoelectric substrate, an outermost layer indirectly above the adhesive layer, a low-resistance layer between the adhesive layer and the outermost layer, including first and second principal surfaces, and having a lowest electric resistance among the layers, and a barrier layer between the low-resistance layer and the outermost layer. An outer peripheral edge of the second principal surface of the low-resistance layer is inside an outer peripheral edge of the barrier layer, and an outer peripheral edge of the adhesive layer is outside an outer peripheral edge of the low-resistance layer, in plan view.

Abstract: A radio-frequency module includes an integrated circuit (IC) device and an external inductor provided outside the IC device. The IC device includes a plurality of low-noise amplifiers, one or more inductors, and a switching circuit. The plurality of low-noise amplifiers includes a plurality of transistors in one to one correspondence. The one or more inductors are coupled to one or more of the plurality of transistors. Each inductor is coupled to the emitter or source of a corresponding one of the plurality of transistors. The switching circuit is coupled between the emitter or source of each of the plurality of transistors and the external inductor. The external inductor is coupled between the switching circuit and ground in series with each of the one or more inductors via the switching circuit.

Abstract: A transmit/receive module includes plural duplexers, a power amplifier, and a sending transmission line. The plural duplexers operate in bands different from each other and each includes a transmit filter and a receive filter. The power amplifier amplifies signals of pass bands of the plural transmit filters and outputs the amplified signals. The sending transmission line is connected to the plural transmit filters. The signals of the pass bands of the plural transmit filters output from the power amplifier are transmitted through the sending transmission line.

Abstract: Transmission signal generation circuitry generates a transmission chirp, and the transmission chirp is transmitted from a transmission antenna. A reflected wave, from an object to be detected, of the transmission chirp transmitted from the transmission antenna is received by a reception antenna. A mixer mixes the transmission chirp and a reception chirp received by the reception antenna to generate an intermediate frequency signal. Signal processing circuitry obtains, for a plurality of respective analysis periods corresponding to different frequency bands of the transmission chirp, frequency spectral waveforms of the intermediate frequency signal, detects a peak appearing in the plurality of frequency spectral waveforms, and determines, based on variations in peak position among the plurality of frequency spectral waveforms, whether or not the peak is due to a valid object.