Abstract: An inductor component includes an element assembly, a coil that is within the element assembly and is spirally wound in the coil axis direction, a first outer electrode electrically connected to one end of the coil, and a second outer electrode electrically connected to the other end of the coil. The element assembly includes an insulator, and a face of the element assembly includes a bottom face parallel to a coil axis direction, and a top face opposed to the bottom face in a height direction T orthogonal to the coil axis direction. The first and second outer electrodes each are exposed to at least the bottom face of the element assembly. The coil is formed by electrically interconnecting a plurality of coil wires laminated in the coil axis direction.

Abstract: A pair of first members each have an electrically conductive surface and a disposed to face each other. A plurality of second members each made of an electrically conductive material are disposed between the pair of first members. The plurality of second members are arranged in a periodic pattern in at least one direction parallel to the conductive surface and disposed between the pair of first members. A dielectric member is disposed between each of the plurality of second members and each of the pair of first members. The dielectric member is in contact with the plurality of second members and with the pair of first members. An electronic component is provided that is configured to control propagation of radio waves such as microwaves, millimeter waves, or sub-millimeter waves, and that allows for reduced deflection of the conductive surface.

Abstract: An antenna device includes a ground plane, a flat-plate-shaped first feed element, a flat-plate-shaped second feed element, a first feed line connected to the first feed element, and a second feed line connected to the second feed element. The ground plane, the first feed element, and the second feed element are stacked respective order and spaced apart from each other. At least part of the second feed line is disposed in a same conductor layer as the ground plane and is disposed at a position that overlaps the first feed element as the ground plane is viewed from a plan view.

Abstract: A short-range wireless communication device includes a receiving circuit, a power-receiving circuit, a short-range wireless communication IC, a rectifier circuit, and a load circuit. The receiving circuit and the power-receiving circuit have a common circuit portion composed of a coil, a capacitor, and a capacitor. The coil and the capacitor constitute a first parallel resonance circuit, and the coil, the capacitor, and the capacitor constitute a second parallel series resonance circuit. The first parallel resonance circuit and the second parallel series resonance circuit function as impedance adjusting circuits, an output impedance of the receiving circuit is adjusted to be higher than or equal to a first predetermined value for realizing load modulation and an output impedance of the power-receiving circuit is adjusted to be lower than or equal to a second predetermined value for realizing power supply, and operations of the receiving circuit and the power-receiving circuit are realized.

Abstract: Transmission signal generation circuitry generates a transmission chirp, and the transmission chirp is transmitted from a transmission antenna. A reflected wave, from an object to be detected, of the transmission chirp transmitted from the transmission antenna is received by a reception antenna. A mixer mixes the transmission chirp and a reception chirp received by the reception antenna to generate an intermediate frequency signal. Signal processing circuitry obtains, for a plurality of respective analysis periods corresponding to different frequency bands of the transmission chirp, frequency spectral waveforms of the intermediate frequency signal, detects a peak appearing in the plurality of frequency spectral waveforms, and determines, based on variations in peak position among the plurality of frequency spectral waveforms, whether or not the peak is due to a valid object.

Abstract: An inductor component comprising an element body; a helically wound coil disposed in the element body; and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a plurality of insulating layers and a mark layer constituting a portion of an outer surface of the element body, and a K abundance ratio (atom %) in the mark layer is higher than a K abundance ratio (atom %) in the insulating layers.

Abstract: A microelectromechanical accelerometer for measuring acceleration, comprising a first proof mass and ae second proof mass. The first proof mass is adjacent to the second proof mass. A suspension structure allows the first proof mass to undergo rotation out of the device plane about a first rotation axis and the suspension structure allows the second proof mass to undergo rotation out of the device plane about a second rotation axis. The first and second rotation axes are parallel to each other and define an x-direction which is parallel to the first and the second rotation axes and a y-direction which is perpendicular to the x-direction. The y-coordinate of the first rotation axis is greater than the y-coordinate of the second rotation axis by a nonzero distance D.

Abstract: An electrical device that includes a substrate; a 3D capacitor including a capacitor dielectric region of a dielectric material, a capacitor electrode region of a conductive material, the capacitor dielectric region and the capacitor electrode region being arranged at least partially inside a cavity extending in the substrate from a top face of the substrate; and a surrounding through opening in the substrate and which surrounds a surrounded substrate region, the 3D capacitor being outside of the surrounded substrate region, the surrounding through opening extending from the top face to a bottom face of the substrate, wherein inside the surrounding through opening a surrounding dielectric region of the dielectric material and a surrounding conductive region of the conductive material are arranged.

Abstract: An inductor includes a coil having a winding portion, and a pair of lead-out portions extended from the winding portion; a body containing the coil and including a magnetic portion, the magnetic portion including metallic particles and a first resin; and a pair of outer electrodes on a surface of the body. The body has a metallic-particle exposed region on its surface. Each outer electrode includes a conductive resin layer, and a first plating layer on the conductive resin layer. The conductive resin layer is disposed on at least the metallic-particle exposed region. The first plating layer includes a first covering region covering the conductive resin layer, and a first extending region continuous to the first covering region and extending to at least the metallic-particle exposed region. The first plating layer is connected with at least a portion of the metallic particles on the metallic-particle exposed region.

Abstract: Circuits and methods for extending the linear range of IC-based environmental sensors. The IC-based environmental sensors may sense environmental characteristic such as humidity levels, the presence and/or concentration of specific chemicals, and/or the presence and/or concentration of specific biological molecules. The linearity of an environmental sensor can be extended by heating the sensor within a range of non-linear operation to artificially induce the sensor to operate within its linear range, and then accurately measuring, either directly or indirectly, the temperature rise caused by such heating. A correction factor is then determined based on the measured temperature rise that is combined with measurements from the sensor while operating within its non-linear range in order to generate an accurate estimate of an actual environmental characteristic.

Abstract: A high-frequency module (1) includes a mounting substrate (90), a duplexer (60L) arranged on the mounting substrate (90), a duplexer (60H) arranged on the mounting substrate (90) and having a pass band with a higher frequency than a pass band of the duplexer (60L), and a semiconductor control IC (40) arranged on the mounting substrate (90) and stacked with the duplexer (60L) of the duplexers (60L and 60H).

Abstract: Three-dimensional capacitive structures may be produced by forming a capacitive stack conformally over pores in a region of porous anodic oxide. The porous anodic oxide region is provided on a stack of electrically-conductive layers including an anodization-resistant layer and an interconnection layer. In the pores there is a position having restricted diameter quite close to the pore bottom. In a first percentage of the pores in the region of anodic oxide, a functional portion of the capacitive stack is formed so as to extend into the pores no further than the restricted-diameter position. Cracks that may be present in the anodization-resistant layer have reduced effect on the properties of the capacitive structure. Increased thickness of the anodization-resistant layer can be tolerated, enabling equivalent series resistance of the overall capacitive structure to be reduced.

Abstract: The coil component includes a magnetic body containing a metallic material and a resin material, a coil conductor embedded in the magnetic body, and a pair of outer electrodes electrically connected to ends of the coil conductor. The coil conductor includes an exposed portion at each end portion of the coil conductor, and a covered portion covered with an insulating substance disposed between the exposed portions. The covered portion is disposed inside a face of the magnetic body on which the outer electrodes are disposed.

Abstract: A multilayer ceramic capacitor includes a stacked body and external electrodes. The stacked body includes stacked dielectric layers and internal electrodes. The external electrodes are disposed on lateral surfaces of the stacked body and are connected to the internal electrodes. A ratio of min to max is not less than about 36% and not more than about 90%, where A1, A2, A3, and A4 respectively denote the surface areas of first, second, third, and fourth external electrodes that are located on the first or second main surface of the stacked body.

Abstract: A wireless communication device transmits and receives a high-frequency signal having a first frequency as a carrier frequency. The device includes a base material made of paper, an antenna pattern of an Sn alloy formed on the base material, and an RFIC element connected electrically to the antenna pattern. Moreover, the antenna pattern including a thin wire part and a thick wire part that differ in wire width from each other.

Abstract: A resonator is provided that includes a vibration part and a mass addition portion. The vibration part includes a piezoelectric film, an upper electrode, and a lower electrode. The upper electrode and the lower electrode are disposed on opposite sides with the piezoelectric film therebetween. The amount of displacement of the vibration part is greater in a region corresponding to at least part of the mass addition portion than in any other region. The mass addition portion has an inclined surface that slopes in such a manner that the mass addition portion has end regions and a central region thinner than at least one of the end regions when the vibration part is viewed in a plan view.

Abstract: A magnetic-component module includes a substrate, a core on a first surface of the substrate, a spacer on the core, a gap between a bottom surface of the core and the first surface of the substrate, a winding including wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate, and traces on and/or in the substrate, and an overmold material encapsulating the core, the spacer, and the wire bonds and filling the gap.

Abstract: An electrical connector is capable of performing stable inspection without affecting an extraction force of a connector engagement portion. The electrical connector includes a housing having an electrical insulation property, an internal terminal held by the housing, and an external terminal held by the housing, with the external terminal to be electrically connected to a ground. The external terminal includes a fitting portion having a first engagement wall portion at one side and having a second engagement wall portion at the other side in a plan view from a connector insertion/extraction direction. A first engagement portion is formed at the first engagement wall portion, and a second engagement portion is formed at the second engagement wall portion.

Abstract: A bipolar transistor includes a collector layer, a base layer, and an emitter layer that are formed in this order on a compound semiconductor substrate. The emitter layer is disposed inside an edge of the base layer in plan view. A base electrode is disposed on partial regions of the emitter layer and the base layer so as to extend from an inside of the emitter layer to an outside of the base layer in plan view. An insulating film is disposed between the base electrode and a portion of the base layer, with the portion not overlapping the emitter layer. An alloy layer extends from the base electrode through the emitter layer in a thickness direction and reaches the base layer. The alloy layer contains at least one element constituting the base electrode and elements constituting the emitter layer and the base layer.

Abstract: An RF signal transmitting/receiving circuit includes: at least one power amplifier circuit that amplifies and outputs an RF transmission signal; duplexers each including a transmission filter that passes the RF transmission signal amplified by the power amplifier circuit, and a reception filter that passes an RF reception signal; at least one distribution circuit that divides the RF transmission signal input to the power amplifier circuit and outputs a first signal; a signal output circuit that outputs, based on the first signal, in at least one transmission path among transmission paths of a plurality of the RF reception signals, at least one second signal that has substantially a same delay amount, an inverted phase, and substantially same power as the RF transmission signal mixed in the RF reception signal; and coupling circuits that couple the second signal to the RF reception signal transmitted in the at least one transmission path.