Patents Assigned to Murata Manufacturing
  • Patent number: 11990666
    Abstract: An RFID reader/writer antenna device is provided that includes a first radiating element, a second radiating element, a third radiating element, baluns, a phase shifter, and a distributor. The radiating elements each comprise conductor patterns with extending directions that are parallel to each other, and used for reading or writing of RFID tags. The distributor connects the first radiating element, the second radiating element, and the third radiating element to a common input/output. The phase shifter causes a feeding phase of the second radiating element and feeding phases of the first radiating element and the third radiating element to have a phase difference of 90°. The baluns perform conversion between a balanced signal and an unbalanced signal.
    Type: Grant
    Filed: November 2, 2021
    Date of Patent: May 21, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Noboru Kato
  • Patent number: 11986757
    Abstract: A filtration filter according to the present invention includes a surface layer composed mainly of Pd, a base material inside the surface layer and composed mainly of a PdNi alloy, and an intermediate layer between the surface layer and the base material, wherein the intermediate layer is composed mainly of a PdNi alloy in which a Pd:Ni ratio changes from a surface layer side toward a base material side.
    Type: Grant
    Filed: May 18, 2021
    Date of Patent: May 21, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Masaru Banju, Takashi Kondo, Shusuke Yokota
  • Publication number: 20240162860
    Abstract: A power amplifier circuit includes an external input terminal, an external output terminal, a power amplifier connected to the external input terminal, power amplifiers, a power supply terminal connected to the power amplifier, and a power supply terminal connected to the power amplifier. The power amplifiers are connected in parallel with each other between the power amplifier and the external output terminal. A first power supply voltage which is variable to multiple discrete first voltage levels is supplied to the power amplifier via the power supply terminal. A second power supply voltage which is variable to multiple discrete second voltage levels is supplied to the power amplifier via the power supply terminal. The multiple discrete second voltage levels are different from the multiple discrete first voltage levels.
    Type: Application
    Filed: January 10, 2024
    Publication date: May 16, 2024
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Kenji TAHARA, Kae YAMAMOTO
  • Publication number: 20240162923
    Abstract: A radio frequency circuit includes power amplifiers, a transformer, a filter having a band A as a pass band, a filter having a band B as a pass band, a filter having a band C as a pass band, matching circuits connected to one end of an output side coil, and matching circuits connected to the other end of the output side coil. The matching circuit includes a capacitor disposed at a first path, a switch connected to the first path and a ground, a switch and an inductor connected in series, and the matching circuit includes a capacitor disposed at a second path, and a switch and an inductor connected in series, and the matching circuit includes a switch connected to a third path and the ground.
    Type: Application
    Filed: January 22, 2024
    Publication date: May 16, 2024
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Kenji TAHARA, Hiroki SHOUNAI, Kae YAMAMOTO, Ryo WAKABAYASHI
  • Patent number: 11984265
    Abstract: A multilayer ceramic capacitor includes dielectric layers made of a ceramic material and internal electrode layers laminated therein. The internal electrode layers each include dielectric columns provided therein. A solid solution layer in which S is solidly dissolved is provided at an interface between each of the dielectric columns and each of the internal electrode layers.
    Type: Grant
    Filed: September 19, 2022
    Date of Patent: May 14, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takumi Endou, Sho Watanabe, Akito Mori, Masahiro Wakashima
  • Patent number: 11980914
    Abstract: A vibrating device includes a vibrating element, a support, and a connector. The vibrating element includes a vibrating body that is tubular and includes a first opening end surface and a second opening end surface. The support extends in an axial direction and supports the vibrating body, the axial direction being a direction connecting the first opening end surface and the second opening end surface of the vibrating body. The connector connects the vibrating body and the support to each other. The vibrating body vibrates in a breathing vibration mode to generate a first node and a second node on the vibrating element at different positions in the axial direction. The connector is positioned between the first node and the second node.
    Type: Grant
    Filed: December 1, 2020
    Date of Patent: May 14, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yuuki Ishii, Hitoshi Sakaguchi, Katsumi Fujimoto
  • Patent number: 11984252
    Abstract: A winding-type coil component includes a first wire and a second wire having a twisted wire portion where the first wire and the second wire are twisted together. Switching positions of the first wire and the second wire in the twisted wire portion are shifted in a circumferential direction of a winding core portion every turn.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: May 14, 2024
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kohei Kobayashi, Ryota Hashimoto, Hiroyuki Tei, Chihiro Yamaguchi
  • Patent number: 11982572
    Abstract: A stick-on thermometer is provide that includes a first thermal resistor and a second thermal resistor that are arranged substantially parallel to an inner surface of a lower outer body. Moreover, first and second temperature sensors are arranged along a thickness direction of the first thermal resistor, third and fourth temperature sensors are arranged along a thickness direction of the second thermal resistor, and a wiring board is arranged substantially parallel to the first and second thermal resistors and on which there is mounted a processing circuit that processes detection signals of the first to fourth temperature sensors. The first and second thermal resistors are respectively formed of three first thermal resistor layers and three second thermal resistor layers formed substantially parallel to the inner surface of the lower outer body.
    Type: Grant
    Filed: March 16, 2021
    Date of Patent: May 14, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Toru Shimuta
  • Patent number: 11984808
    Abstract: A regulator for an interleaved power factor correction circuit to enhance current sharing performance includes adjuster circuitry that determines a duty cycle adjustment; judge circuitry that determines whether to activate the adjuster circuitry; distributor circuitry that determines tuned duty cycles based on input duty cycles and the duty cycle adjustment; and tuner circuitry that determines tuned average inductor currents in first and second phases of the interleaved power factor correction circuit based on the tuned duty cycles.
    Type: Grant
    Filed: March 9, 2020
    Date of Patent: May 14, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Longcheng Tan
  • Patent number: 11984380
    Abstract: A semiconductor package includes a module substrate having opposite top and bottom surfaces, a semiconductor chip provided with bumps and mounted on the top surface of the module substrate via the bumps, and a metal member having a top portion disposed at a level higher than the semiconductor chip with reference to the top surface of the module substrate and including the semiconductor chip in plan view and a side portion extending from the top portion toward the module substrate. The module substrate includes a first metal film disposed on or in at least one of the bottom surface and an internal layer of the module substrate. The first metal film is electrically connected to the bumps and reaches a side surface of the module substrate. The side portion is thermally coupled to the first metal film at the side surface of the module substrate.
    Type: Grant
    Filed: July 8, 2021
    Date of Patent: May 14, 2024
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Masao Kondo, Kenji Sasaki, Shigeki Koya
  • Patent number: 11984637
    Abstract: A transmission line includes first, second, third, and fourth signal lines, and first, second, third, and fourth electrode pads respectively connected thereto. A first main surface of an external connection portion includes a first region in which the first electrode pad and the second electrode pad are provided, and a second region in which the third electrode pad and the fourth electrode pad are provided. Each of the first electrode pad and the second electrode pad, in a plan view, is surrounded by a ground electrode, and at least one of the third electrode pad and the fourth electrode pad, in the plan view, includes a portion that is not surrounded by the ground electrode.
    Type: Grant
    Filed: November 19, 2021
    Date of Patent: May 14, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yushi Soeta, Hiromasa Koyama
  • Patent number: 11984251
    Abstract: A coil component and a method for manufacturing the coil component. A coil component includes a body having a plurality of stacked magnetic layers, and a coil inside the body and having a plurality of stacked coil wirings. The magnetic layers and the coil wirings are alternately stacked in one direction, a first surface of the coil wiring on one side in the one direction and one magnetic layer located on one side in the one direction of the coil wiring are in contact with each other, a gap portion exists between a second surface of the coil wiring on the other side in the one direction and the other magnetic layer located on the other side in the one direction of the coil wiring, and a magnetic film is present in at least a part of the second surface of the coil wiring.
    Type: Grant
    Filed: April 7, 2021
    Date of Patent: May 14, 2024
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Masayuki Oishi
  • Patent number: 11984865
    Abstract: A band pass filter includes filter circuits, first and second intermediate circuits, and a first capacitor. The first intermediate circuit includes an inductor connected between second and third capacitors. The second intermediate circuit includes an inductor connected between third and fourth capacitors. Resonant circuits included in the filter circuit are connected to ground via a common capacitor. Resonant circuits included in the filter circuit are connected to the ground via a common capacitor. The first capacitor is connected between the first and second intermediate circuits.
    Type: Grant
    Filed: July 5, 2022
    Date of Patent: May 14, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Tetsuo Taniguchi
  • Patent number: 11984254
    Abstract: A magnetic-component module includes a substrate, a core on a first surface of the substrate, a spacer on the core, a winding including wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate, and traces on and/or in the substrate, a lead frame that supports the core and that electrically connects the winding to the substrate, and an overmold material encapsulating the core, the spacer, the wire bonds, and a portion of the lead frame.
    Type: Grant
    Filed: July 9, 2020
    Date of Patent: May 14, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Lee Francis, William Jarvis, Takayuki Tange
  • Patent number: 11984868
    Abstract: Acoustic resonator devices and filters are disclosed. An acoustic resonator includes a substrate having a trap-rich region adjacent to a surface and a single-crystal piezoelectric plate having parallel front and back surfaces, the back surface attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm that spans a cavity in the substrate. An interdigital transducer (IDT) is formed on the front surface of the single-crystal piezoelectric plate such that interleaved fingers of the IDT are disposed on the diaphragm. The single-crystal piezoelectric plate and the IDT are configured such that a radio frequency signal applied to the IDT excites a shear primary acoustic mode within the diaphragm.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: May 14, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Patrick Turner
  • Patent number: 11983367
    Abstract: An electronic device is provided in which a capacitance of a capacitor that is formed between one or more reference second touch sensor electrodes and at least one first touch sensor electrodes is defined as a first reference capacitance with the capacitor formed when the touch sensor is folded along a folding line. Moreover, a capacitance of a capacitor formed between a left second touch sensor electrode and at least one of the plurality of first touch sensor electrodes is defined as a left capacitance. Furthermore, a capacitance of a capacitor formed between a right second touch sensor electrode and at least one of the plurality of first touch sensor electrodes is defined as a right capacitance. Using these capacitances, a determining unit of the electronic device can determine that a touch sensor is folded if both the left and the right capacitances are greater than the first reference capacitance.
    Type: Grant
    Filed: May 16, 2022
    Date of Patent: May 14, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hidekazu Kano, Hiroaki Kitada
  • Patent number: 11984869
    Abstract: An acoustic wave device includes a piezoelectric body including first and second main surfaces facing each other, an IDT electrode provided on the first main surface of the piezoelectric body and including electrode fingers, a high acoustic velocity member on the second main surface side of the piezoelectric body, in which an acoustic velocity of a propagating bulk wave is higher than an acoustic velocity of an acoustic wave propagating through the piezoelectric body, and a first dielectric film provided on an upper surface of the electrode fingers, in which a portion where a dielectric is not present is provided between the electrode fingers of the IDT electrode.
    Type: Grant
    Filed: April 6, 2021
    Date of Patent: May 14, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hideki Iwamoto, Takashi Yamane, Yasumasa Taniguchi, Katsuya Daimon
  • Patent number: 11982524
    Abstract: An input includes a first electrode and a first deformation portion. An output includes a second electrode and a second deformation portion. A transmission portion enables transmission of an elastic wave from the first deformation portion to the transmission portion and transmission of an elastic wave from the transmission portion to the second deformation portion. In operation, an input signal is input to the first electrode that deforms the first deformation portion to generate an elastic wave. The transmission portion transmits the elastic wave from the first deformation portion to the second deformation portion that is deformed by the elastic wave to generate an output signal to the second electrode. The detection unit detects a deformation amount from the reference state of the transmission portion based on the output signal.
    Type: Grant
    Filed: July 28, 2022
    Date of Patent: May 14, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Masamichi Ando, Kenichi Mori
  • Patent number: 11984873
    Abstract: There are disclosed acoustic diplexers and radios incorporating the acoustic diplexers. A diplexer includes common port, a low band port, a high band port, n low band sub-filters, and n high band sub-filters, where n is an integer greater than one. Each low band sub-filter has a first sub-filter port connected to the common port and a second sub-filter port connected to the low band port. Each high band sub-filter has a first sub-filter port connected to the common port and a second sub-filter port connected to the high band port. A first acoustic resonator is connected from the common port to ground and a second acoustic resonator is connected from the low band port to ground. The first and second acoustic resonators are configured to create respective transmission zeros adjacent to a lower edge of a passband of the diplexer.
    Type: Grant
    Filed: March 11, 2022
    Date of Patent: May 14, 2024
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Andrew Guyette, Neal Fenzi
  • Patent number: D1027820
    Type: Grant
    Filed: September 11, 2020
    Date of Patent: May 21, 2024
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Taichi Katsumoto, Yoshiichi Horikoshi, Masayuki Kageyama