Abstract: A modular jack which is made thin. A hole is pierced in a flat member and a box member is disposed at an opening on one side of the hole. A modular plug is inserted through an opening opposite to the opening where the box member is located. At that time, the insertion direction is regulated by the inner walls of the hole or the inner walls of the box member, push is stopped by a bottom portion of the box member, return is stopped by a hook portion located near the opening through which the modular plug is inserted, and an electrode section is electrically connected to the modular plug. Springs enable only one action to be required.

Abstract: A card-type line interface device is provided with good portability and low-price. The line interface device includes an adapter unit 1 and a card unit 2 for inserting into the card slot of a communication terminal device. The adapter unit 1 has a card connecting connector 11 on a part of the boxlike body, a line connector 12 on another part thereof, and an interface circuit 14. The adapter unit 1 is connected to the card unit 2 in use, and detached from it on carrying. With no troublesome cable, the line interface device can provide good portability. The reduced number of components and reduced number of assembling steps lead to low price.

Abstract: A modular jack applicable to a flat assembly. A hole is pierced in a flat member and a cover that can be opened and closed is disposed so as to cover an opening of the hole. When a modular plug is inserted into the hole, the cover is opened; when not, the cover is closed. When the cover is closed, it is housed in the opening, and the modular jack equals the flat member substantially in thickness. When the modular plug is inserted into the hole through the opening with the cover open, the insertion direction of the modular plug is regulated by inner walls of the hole. When the tip of the modular plug abuts against a bottom portion of the hole, the modular plug cannot be inserted any more. In the state, an electrode section located in the hole is electrically connected to electrodes of the modular plug. A hook portion disposed in the cover locks the modular plug so as to prevent the modular plug from easily dropping out of the modular jack even if the modular plug is pulled.

Abstract: A DQPSK delay detection circuit includes a semi-synchronous detector synchronously detecting an input signal to obtain two demodulated signals, a low-pass filter for extracting a baseband signal from the demodulated signals, an A-D convertor sampling the baseband signal by a clock signal with a frequency 32 times higher than a symbol rate frequency and converting them to digital values with a predetermined number of quantization bits, a clock pulse generator generating clock signals synchronized with the baseband signal and having a frequency equal to and two times as high as the symbol rate frequency with a phase adjusted in accordance with a change of an eye pattern of an output of the A-D convertor, a data delay unit delaying the output of the A-D convertor by a time equivalent to one time slot according to a clock signal synchronized with the baseband signal and having a frequency equal to the symbol rate frequency, an operation unit generating signals I and Q from the output of the A-D convertor and a on

Abstract: Disclosed herein is a chip type directional coupler comprising a laminated structure of a plurality of dielectric substrates, each dielectric substrate having a pair of stripline electrodes nonlinearly formed on its one major surface in parallel with each other, and a plurality of ground electrode substrates, each ground electrode substrate being provided with a ground electrode on its one major surface, the dielectric and ground electrode substrates being so alternately stacked that uppermost and lowermost layers are defined by the ground electrodes, and a plurality of external electrodes which are formed on side surfaces of the laminated structure. The pairs of stripline electrodes formed on the respective dielectric substrates are connected in series with each other through the intervening dielectric substrates, to define stripline electrodes of quarter wavelengths in overall length.

Abstract: A signal separation circuit for separating direct current power on a telephone with a transistor. A CPU, which includes an A/D converter, is connected to detect the emitter-collector voltage of the transistor, and to control the base current of the transistor to maintain the emitter-collector voltage constant.

Abstract: An opening 11 is formed in a region of a circuit board 10 opposite to a vibration region E of a piezoelectric element 5. The piezoelectric element 5 is mounted on the circuit board 10, and electrode connection portions 9 of the piezoelectric element 5 are connected with and fixed to the circuit board by a solder. In succession, soldered connection portions kept away from the vibration region E of the piezoelectric element 5 are filled with a bonding agent 8. Thereupon, an excess bonding agent 8 with which the soldered connection portions are filled is eliminated by the opening 11, and hence is prevented from invading the vibration region E of the piezoelectric element 5. Further, any stress exerted on the circuit board 10 is dispersed because of its being mostly received by the bonding agent 8, and hence any stress exerted on the piezoelectric element 5 is reduced.

Abstract: In this apparatus, a ceramic green sheet which may be formed with internal electrodes for forming laminated ceramic capacitors, is first punched out by a punch. After this punching operation, the punched-out ceramic green sheet held by the punch is conveyed to a transfer head by the punch and then conveyed to a stacking block by the transfer head. With these steps repeated, a plurality of punched-out ceramic green sheets are stacked on the stacking block. Each time a punched-out ceramic green sheet is stacked on the stacking block, a hot iron is applied to the uppermost one of the punched-out ceramic green sheets so as to pressure-weld it to the underlying punched-out ceramic green sheet.

Abstract: A wire ribbon has a plurality of insulator-coated conductive wires, each having an insulating layer formed on a surface of a conductive wire. The insulator-coated conductive wires are arranged parallel in a row to be adjacent to each other. The adjacent insulator-coated conductive wires are bonded to each other through interconnection adhesive layers so as to be integrated. A thermoplastic adhesive interlayer having an adhesion temperature lower than that of the interconnection adhesive layer is formed in a local circumferential region on an apex of each single-core wire on at least one of upper and lower surface sides of the wire ribbon.

Abstract: To improve transferability for stacking ceramic green sheets through a transfer technique, a ceramic green sheet formed on a first back film is heated and pressurized by rolls so as to be transferred to a second back film. Thereafter, the transferred ceramic green sheet is compression bonded through a contact surface defined by a surface exposed by separation of the first back film to at least one other ceramic green sheet which has been already stacked.

Abstract: A laminated high-frequency low-pass filter includes a first dielectric layer. A second dielectric layer, a third dielectric layer, a fourth dielectric layer, and a fifth dielectric layer are laminated on the first dielectric layer. An earth electrode is formed on the first dielectric layer. A first capacitive open-circuited stub electrode, a second capacitive open-circuited stub electrode and a third capacitive open-circuited stub electrode are formed on the second dielectric layer. A first strip line electrode and a second strip line electrode are formed on the third dielectric layer. The first and second strip line electrodes are formed as meander lines. A shield electrode is formed on the fourth dielectric layer.

Abstract: A resistor having a ceramic sintered body and at least one resistor film embedded therein so as to be covered by the ceramic sintered body except for portions of the resistor film-chat are connected to external electrodes. The sintered body is mainly composed of ZnO, and contains at least one element of Bi, Pb, B and Si as a subcomponent with respect to the main component.

Abstract: Anti-oxidizing treatment of copper power is carried out by immersing copper powder in a solution containing boric acid, separating the resultant copper powder from the solution, and heating the copper powder covered with a thin layer of the solution at a temperature of 50.degree. to 260.degree. C.

Abstract: A movement detector device consumes less power and provides a high detection reliability. The teeth on a rotating gear are magnetically detected. There are a number of interconnected magneto-resistors MR1 through MRi connected in series, with the series circuit connected between a power supply line and a ground line. There are output signal pickup points P1 through P7 at the connections between the adjacent magneto-resistors. Signals outputted from these signal pickup points P1 through P7 are shifted in their phases by 1/2period with respect to each other. These signals are paired, and each of the paired signals is fed to a differential amplifier circuit to provide signals E1 through E4 as detection signals. In another embodiments, a linear member has a number of magnetic spots which may be detected in the same manner that the gear teeth are detected.

Abstract: It is an object of the present invention to prevent variations in sensitivity of the sensor circuits of the respective channels by equalizing the power of oscillation frequency signals to be distributed/supplied from one oscillation circuit to the sensor circuits of the respective channels. Multi-channel sensor circuits are arranged with a common oscillation circuit. A high-impedance conversion circuit is connected to the output terminal of the oscillation circuit. A first impedance matching circuit for performing impedance matching of resonance circuits of the respective channels with reference to the oscillation circuit is arranged on the output side of the high-impedance conversion circuit. Second impedance matching circuits for performing impedance matching of the oscillation circuit with reference to the resonance circuits are connected at the input terminals of the resonance circuits of the respective channels.

Abstract: A pyroelectric IR-sensor in which a pyroelectric light receiving element is mounted on a MID substrate or a ceramic substrate of which thermal conductivity is less than 0.02 cal/cm.sec..degree. C. in a manner that both end portions of the pyroelectric light receiving element are supported by the substrate with the central portion of the pyloelectric light receiving element being spaced from the substrate, and chip parts are further mounted on the substrate.

Abstract: A plurality of sensor circuits each including an oscillator circuit, a detection electrode, and a ceramic resonator for changing a resonance frequency in accordance with a change in small electrostatic capacitance detected by the detector electrode and outputting a detection signal corresponding to a change in resonance frequency are formed on a circuit board. Detector electrode surfaces A.sub.1 to A.sub.4, B.sub.1 to B.sub.4, and C.sub.1 to C.sub.4 of the first to third sensor circuits are formed on the upper surface of the circuit board in a divisional manner. The detection surfaces of the respective sensor circuits are arranged to have codes in the scanning direction of an object to be detected. The fixed capacitances of the detection surfaces are decreased, and a change of state of the object can thus be detected at a high resolution.

Abstract: In order to detect the movement of a heat source over a widened range by using a reduced number of pyroelectric type infrared sensors, a sensor section includes two infrared detecting means X and Y. The area to be observed by the infrared detecting means X is divided into two zones A and B while the area to be observed by the infrared detecting means Y is divided into two single zones a and b. The single zones A and a are overlapped on each other to form an overlap zone (A, a). The movement of the heat source between the single zone B and the single zone b, between the overlap zone (A, a) and the single zone B and between the overlap zone (A, a) and the single zone b is judged to detect the movement of the heat source over the entire area to be observed by the sensor section. In such a manner, two infrared detecting means can cover three zones to be observed.

Abstract: A functionally gradient circuit board is constituted by a mixture of a metal and an insulating ceramic composition, the abundance ratio of the metal component to the component of the insulating ceramic composition being changed in the direction of thickness of the board.

Abstract: A magnetic sensor. A plurality of sensing parts are deposited and formed on an element substrate in film form. The inside two of the sensing parts are connected in series to use for a reading of a narrow pitch magnetic pattern, and the outside two of the sensing parts are also connected in series to use for a reading of a wide pitch magnetic pattern. The connection of the sensing parts is carried out by using terminals and wires. The terminals are provided so as to short-circuit the ends of the sensing parts or for every sensing part.