Abstract: A method for forming a molded circuit board is provided. The method includes the steps of forming a circuit having a first section and a second section on a conductive substrate, the first section and the second section being coplanar; then deforming the conductive substrate by mold-pressing, so that the first section and the second section become non-coplanar; providing a plastic material to cover the circuit and the conductive substrate; curing the plastic material by injection-molding; and removing the conductive substrate to expose the circuit. The molded circuit board made by this method is also provided.

Abstract: A manufacturing process of an embedded type flexible or rigid printed circuit board includes multiple steps. First, a layer of dry film is applied to a layer of copper foil. Then a circuit pattern is formed on the copper foil through photolithography processes. An etching stop layer is electroplated on the copper foil according to the circuit pattern. The etching stop layer is then electroplated with copper. The copper foil is softened by a high temperature process after removing the dry film. Then the layer of the copper foil is etched after coating with an organic layer and the organic layer is solidified.