Abstract: The present invention aims to provide a method of producing a fine particulate inorganic oxide dispersion, which makes it possible to easily disperse a fine particulate inorganic oxide while reducing the amount of dispersant used. The present invention relates to a method of producing a fine particulate inorganic oxide dispersion, the method including mixing the following components (A) to (D): (A) at least one fine particulate inorganic oxide selected from the group consisting of zirconium oxide (ZrO2), titanium oxide (TiO2), and barium titanate (BaTiO3), (B) a dispersant, (C) an alkoxysilane compound, and (D) a solvent having the following Hansen solubility parameters: a hydrogen bonding component (dH) of 11 or less and a polar component (dP) of 4 or more; and wet grinding the resulting mixture.

Abstract: Provided is a resin composition for imprinting excellent in imprint properties and optical properties such as high refractive index and low haze. The invention relates to a resin composition for imprinting containing: (A) a polysiloxane resin represented by the following formula (1): (R1SiO3/2)a(R22SiO2/2)b(R33SiO1/2)c(SiO4/2)d wherein R1, R2, and R3 are each independently a hydrogen atom, a hydroxy group, an alkoxy group, a C1-C12 hydrocarbon group, or a C1-C12 substituent having one or more crosslinkable functional groups, with at least one of R1, R2, or R3 being a C1-C12 substituent having one or more crosslinkable functional groups, and when a plurality of R1s, R2s, or R3s are present, they may be different from one another; and a, b, c, and d are numbers satisfying the following conditions: 0.001?a?1.00, 0?b?0.999, 0?c?0.30, 0?d?0.30, and a+b+c+d=1.

Abstract: A photocurable resin composition includes: a first reactive compound that forms a glass phase through curing; a second reactive compound that is compatible with the first reactive compound and forms a rubber phase through curing; and a photopolymerization initiator. The first reactive compound includes at least a reactive monomer, and the second reactive compound includes at least a reactive oligomer. A polar term dP1 of Hansen Solubility Parameter of the first reactive compound and a polar term dP2 of Hansen Solubility Parameter of the second reactive compound differ by 1.8 or more.

Abstract: A photocurable resin composition includes a reactive monomer, a reactive oligomer, and a photopolymerization initiator. A cured product of the reactive monomer has a glass transition point of less than 20° C., and a cured product of the reactive oligomer has a glass transition point of less than 20° C. A cured product of the photocurable resin composition has a loss tangent tan ? at 25° C. of 0.2 or less. The cured product of the photocurable resin composition has an elongation at break in accordance with ASTM D638 of 150% or more.

Abstract: A manufacturing method of a mounting structure, the method including: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member; a step of preparing a sheet having thermosetting property; a disposing step of disposing the sheet on the mounting member so as to face the second circuit members; and a sealing step of pressing the sheet against the first circuit member and heating the sheet, to seal the second circuit members and to cure the sheet, wherein the second circuit members include a reference member, and a first adjacent member and a second adjacent member each adjacent to the reference member, a separation distance D1 between the reference member and the first adjacent member is different from a separation distance D2 between the reference member and the second adjacent member, at least one of the plurality of the second circuit members is a hollow member to be provided with a space from the first circuit member, a

Abstract: A manufacturing method of a mounting structure, the method including: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member, the mounting member having a space between the first circuit member and the second circuit member; a step of preparing a laminate sheet including a first thermal-conductive layer and a second thermal-conductive layer, the first thermal-conductive layer disposed at least on one outermost side; a disposing step of disposing the laminate sheet on the mounting member such that the first thermal-conductive layer faces the second circuit members; and a sealing step of pressing the laminate sheet against the first circuit member and heating the laminate sheet, to seal the second circuit members so as to maintain the space, and to cure the laminate sheet.

Abstract: An object of the present invention is to provide a resin composition for encapsulation capable of suppressing warpage even when a large-area substrate is encapsulated. In order to solve the above problems, a resin composition for encapsulating an electronic member containing an epoxy resin (A), a compound having a polyalkylene glycol chain (B), and an inorganic filler (C) is provided. Thus, even when a large-area substrate is encapsulated, an effect of suppressing the warpage can be obtained.

Abstract: A curable resin composition includes: a first epoxy resin having a polyoxyalkylene chain; a second epoxy resin different from the first epoxy resin; a thermoplastic resin having a weight average molecular weight of 300,000 or less, and having a reactive functional group; at least one selected from the group consisting of a curing agent and a curing accelerator; and an inorganic filler.

Abstract: A manufacturing method of a mounting structure includes: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member; a disposing step of disposing a thermosetting sheet and a thermoplastic sheet on the mounting member, with the thermosetting sheet interposed between the thermoplastic sheet and the first circuit member; a first sealing step of pressing a stack of the thermosetting sheet and the thermoplastic sheet against the first circuit member, and heating the stack, to seal the second circuit members and to cure the thermosetting sheet into a cured layer; and a removal step of removing the thermoplastic sheet from the cured layer. At least one of the second circuit members is a hollow member having a space from the first circuit member, and in the first sealing step, the second circuit members are sealed so as to maintain the space.

Abstract: A method of producing a sealed structure, the method including: preparing a substrate and a curable resin composition in a liquid form; and sealing the substrate with the curable resin composition, to form a sealed body including the substrate and a cured product of the curable resin composition. The sealing step includes: printing the curable resin composition onto the substrate, to cover the substrate with a first coating film of the curable resin composition; and compression-molding the first coating film and the substrate together using a mold, with a pressing surface of the mold abut against the first coating film, to convert the first coating film into a second coating film. A ratio of a projected area S1 of the first coating film onto the substrate to a projected area S2 of the second coating film onto the substrate: S1/S2 is 0.9 or more.

Abstract: To provide an epoxy resin composition capable of forming a polished surface with high flatness when polished after curing, and a method for producing an electronic component mounting structure having a polished surface with high flatness, the polished surface obtained by polishing the surface of an encapsulation body. Disclosed are an epoxy resin composition, an electronic component mounting structure including the epoxy resin composition, and a method for producing the electronic component mounting structure, wherein: the epoxy resin composition includes a fused silica possibly containing hollow particles, and a curing agent; on a polished surface obtained by polishing a cured product of the epoxy resin composition, the number of pores having a diameter of more than 5 ?m observed within a 25-mm2 area is one or less, the pores derived from cross sections of the hollow particles; and the polished surface is coated with a coating material.

Abstract: A polymer comprising at least 1% by mole of a structural unit represented by Formula (2); in Formula (2), two R1s are the same or different from each other and are each a hydrogen atom or an alkyl group having 1 to 6 carbon atoms; X is a single bond, an oxygen atom, or a group represented by —COO—, —OOC—, —CONH—, —NH—, —NHCO—, —NR3—, or —CH2O—; Y is a single bond or an oligooxyalkylene group; two R2s are the same or different from each other and are each an alkyl group having 1 to 6 carbon atoms; R3 is an alkyl group having 1 to 6 carbon atoms; m is an integer of 1 to 10; and n is an integer of 2 to 10; and having a number average molecular weight of 5,000 or more has various characteristics suitable for use in contact with a living organism and can be easily produced.

Abstract: A manufacturing method of a mounting structure, the method including: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member via bumps, the mounting member having a space between the first circuit member and the second circuit member; a step of preparing a sheet having a space maintaining layer; a disposing step of disposing the sheet on the mounting member such that the space maintaining layer faces the second circuit members; and a sealing step of pressing the sheet against the first circuit member and heating the sheet, to seal the second circuit members so as to maintain the space, and to cure the sheet. The bumps are solder bumps. The space maintaining layer after curing has a glass transition temperature of higher than 125° C., and a coefficient of thermal expansion at 125° C. or lower of 20 ppm/K or less.

Abstract: A cured product of a curable material is a cured product of a curable material containing a benzoxazine compound and a polymerization initiator. The benzoxazine compound has a polymerizable functional group on a nitrogen atom constituting an oxazine ring. The cured product has a curing rate of 60% or more. The present invention also encompasses a polymer composition including a polymer including repeating units of a polymerizable monomer having a benzoxazine ring.

Abstract: A photocurable resin composition includes a reactive monomer, a reactive oligomer, and a photopolymerization initiator. A cured product of the reactive monomer has a glass transition point of less than 20° C., and a cured product of the reactive oligomer has a glass transition point of less than 20° C. A cured product of the photocurable resin composition has a loss tangent tan ? at 25° C. of 0.2 or less. The cured product of the photocurable resin composition has an elongation at break in accordance with ASTM D638 of 150% or more.

Abstract: A manufacturing method of a mounting structure, the method including a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member; a disposing step of disposing a thermosetting sheet and a thermoplastic sheet on the mounting member, with the thermosetting sheet interposed between the thermoplastic sheet and the first circuit member; a first sealing step of pressing a stack of the thermosetting sheet and the thermoplastic sheet against the first circuit member, and heating the stack, to seal the second circuit members and to cure the thermosetting sheet into a first cured layer; a removal step of removing the thermoplastic sheet from the first cured layer; and a coating film formation step of forming a coating film on the first cured layer, after the removal step.

Abstract: A curable resin composition includes: a first epoxy resin having a polyoxyalkylene chain; a second epoxy resin different from the first epoxy resin; a thermoplastic resin having a weight average molecular weight of 300,000 or less, and having a reactive functional group; at least one selected from the group consisting of a curing agent and a curing accelerator; and an inorganic filler.

Abstract: An endotoxin adsorbent comprising a crystalline cellulose having a nitrogen atom-containing cationic group can sufficiently remove endotoxin from a material containing endotoxin to be removed and containing a substance having a cationic group and can efficiently remove endotoxin also from a highly viscous material. The nitrogen atom-containing cationic group may be typically a functional group derived from a polyvalent amine and/or a quaternary ammonium salt. The crystalline cellulose having a nitrogen atom-containing cationic group may comprise the nitrogen atom-containing cationic group at a content of 0.05 to 3 meq/dry·g in terms of anion exchange capacity.

Abstract: Means for removing endotoxin is provided. Endotoxin is removed by contacting an endotoxin adsorbent including a cellulose nanofiber having an amino group with a liquid containing endotoxin.

Abstract: An electric conductive fiber structure includes an electric conductive resin containing electric conductive polymer(s), the electric conductive resin being filled in gaps between single fibers included in a fiber structure, the electric conductive fiber structure having 15% or more area ratio of the electric conductive resin present in an area of 15 to 30 ?m from a surface when a cross section in a thickness direction of the fiber structure is observed.