Abstract: Provided are a thermoplastic epoxy resin composition comprising (A) an epoxy compound having two epoxy groups in one molecule, (B) a compound having two phenolic hydroxyl groups in one molecule, and at least one compound selected from the group consisting of dihexylamine, diheptylamine, di(2-ethylhexyl)amine, N-ethylhexylamine, trihexylamine, dioctylamine, tri n-octylamine, N,N-dimethyl-n-octylamine, and N,N-dimethyldecylamine as (C) a curing accelerator, and a thermoplastic cured epoxy resin with transparency to visible light produced by curing the thermoplastic epoxy resin composition.

Abstract: An object of the present invention is to provide an adhesive agent composition for an organic fiber, the adhesive agent composition having high adhesive force and not requiring the use of epoxy resin that is high in manufacturing cost. The present invention relates to an adhesive agent composition for an organic fiber, the adhesive agent composition containing a halohydrin compound and a blocked isocyanate compound and also relates to a method of treating an organic fiber, the method including the step of treating the organic fiber with a treating agent containing the adhesive agent composition and a resorcin-formalin-rubber latex (RFL).

Abstract: An object of the present invention is to provide an adhesive agent composition for an organic fiber, the adhesive agent composition hardly causing precipitation or cohesion and having stable adhesive force. The present invention provides an adhesive agent composition for an organic fiber, the adhesive agent composition including epoxy resin and a water soluble curing agent, and also provides to a method of treating an organic fiber, the method including the steps of: (i) treating the organic fiber with the adhesive agent composition as a first treating agent; and (ii) treating the organic fiber, having been treated with the first treating agent, with a second treating agent containing a resorcin-formalin-rubber latex (RFL).

Abstract: A circuit member including: an element having a functional region; a tabular cover disposed opposite to the functional region; and a rib formed to surround the functional region, for providing a space between the functional region and the cover. The cover includes a sheet S having a thickness of 100 ?m or less. The sheet S has a tensile elastic modulus Es at 175° C. of 10 GPa or more. The tensile elastic modulus Es at 175° C. of the sheet S is preferably 20 GPa or more.

Abstract: Provided is a method for manufacturing nylon 6, said method being capable of producing a higher degree of crystallinity in a polymer at the end of a polymerization step performed on an anionically polymerizable caprolactam melt. The present invention is a method in which molten caprolactam in a reactor is anionically polymerized in the presence of a carbodiimide compound and both an anionic polymerization catalyst and an activator, neither of which is a carbodiimide compound, and a polymer is obtained from the reactor following the end of the polymerization step, yielding nylon 6 with a degree of crystallinity of at least 42% without raising the temperature of the interior of the reactor from the temperature thereof at the end of the polymerization step.

Abstract: Provided herein is an enzyme protein produced by a highly safe microorganism and having the activity to isomerize D-psicose to D-allose. The protein is any of the following proteins (a) to (c) with the activity to isomerize D-psicose to D-allose. (a) A protein comprising the amino acid sequence represented by SEQ ID NO: 1 originating in strain 710 of a microorganism of genus Streptomyces (Deposition Number: NITE BP-01423), or SEQ ID NO: 2 originating in strain 720 of a microorganism of genus Streptomyces (Deposition Number: NITE BP-01424), and having the activity to isomerize D-psicose to D-allose. (b) A protein comprising the amino acid sequence represented by SEQ ID NO: 1 or SEQ ID NO: 2 with the substitution, addition, insertion, or deletion of one or several amino acid residues, and having the activity to isomerize D-psicose to D-allose.

Abstract: An enzyme preparation for suppressing bitterness of food contains phospholipase and, if necessary, further contains protease. A method for suppressing bitterness of food includes treating a food material with a food bitterness suppressor containing the enzyme preparation. A method for producing a processed food product includes treating a food material with a food bitterness suppressor containing the enzyme preparation. Food treated with the enzyme preparation for suppressing bitterness of food tastes less bitter even when cooked after long-term preservation. Furthermore, an enzyme preparation for suppressing bitterness of food and for, if necessary, tenderizing food can be provided.

Abstract: There are provided an epoxy resin composition for encapsulation, which is particularly suitable for use in resin pre-setting type flip-chip mounting of a Cu post chip, and which is capable of suppressing defects due to the generation of voids; and a method for manufacturing a semiconductor device using a Cu post chip. The present invention provides an epoxy resin composition for semiconductor encapsulation for flip-chip mounting, which contains an epoxy resin (A), a curing agent (B), a curing accelerator (C), and 3 to 64 parts by weight, relative to 100 parts by weight of the component (A), of thermally thickening resin particles (D) having a volume-average primary particle diameter of 0.2 to 10 ?m; and a method for manufacturing a semiconductor device by resin pre-setting type flip-chip mounting of a Cu post chip using the composition.

Abstract: Provided are: an impact-resistant polyamide composition which exhibits improved toughness and improved impact strength and which can be easily polymerized in-situ in a molding stage; and a novel process for the production of the same. The novel process comprises initiating the anionic polymerization of ?-caprolactam in the presence of (A) an anionic polymerization catalyst, (B) an anionic polymerization activator, (C) 2.0 to 30% by weight (relative to the ?-caprolactam) of an N,N-disubstituted vinylbenzylamine, and (D) a radical polymerization initiator, and subjecting the resulting system to reaction under conditions comprising a reaction temperature of the reaction system of 120 to 180° C. and a reaction time of 10 seconds to 120 minutes. Since radical polymerization in the process is conducted without hindering the anionic polymerization, an alloyed polyamide composed of both polycaprolactam and poly (N,N-disubstituted vinylbenzylamine) can be obtained.

Abstract: The present invention aims to provide a coatable diffusing agent composition that can prevent the formation of precipitates, has a longer solution life than conventional PTG solutions free of water, and thus can be stably stored for a long period of time even when this PTG solution is produced in large quantities, and is highly cost effective. The coatable diffusing agent composition of the present invention includes a titanate, a phosphorus compound, water, and an organic solvent.

Abstract: A polymerizable epoxy compound composition containing an anionic polymerization initiator which can be easily produced, can attain a high polymerization rate and a high degree of polymerization, and can realize an epoxy polymer having properties unobtainable so far, an improvement in cured polymer properties, etc.; and a method of polymerizing an epoxy compound. The composition is an anionically polymerizable composition comprising a monofunctional epoxy compound or a di- or more functional epoxy resin and a polymerization initiator, the polymerization initiator comprising the potassium or sodium salt of a monocarboxylic acid monomer. The method, which is for producing a polymer of epoxy compounds, comprises polymerizing a monofunctional epoxy compound or a di- or more functional epoxy resin by anionic polymerization with the aid of the potassium or sodium salt of a monocarboxylic acid monomer.

Abstract: The present invention provides an anti-fungal agent for processed cereal foods, and the anti-fungal agent contains chitinase. The present invention also provides an anti-fungal agent-containing processed cereal food, which contains the anti-fungal agent. The present invention further provides a method for producing an anti-fungal agent-containing processed cereal food. With the present invention, a safe and inexpensive anti-fungal agent for processed cereal foods is provided.

Abstract: Provided are a thermoplastic epoxy resin composition comprising (A) an epoxy compound having two epoxy groups in one molecule, (B) a compound having two phenolic hydroxyl groups in one molecule, and at least one compound selected from the group consisting of dihexylamine, diheptylamine, di(2-ethylhexyl)amine, N-ethylhexylamine, trihexylamine, dioctylamine, tri n-octylamine, N,N-dimethyl-n-octylamine, and N,N-dimethyldecylamine as (C) a curing accelerator, and a thermoplastic cured epoxy resin with transparency to visible light produced by curing the thermoplastic epoxy resin composition.

Abstract: Disclosed herein is an infrared reflective substrate that can be easily produced by application onto the surface of a base material, has a film having a small film thickness, and achieves both high light permeability and excellent infrared reflective performance. The infrared reflective substrate includes: a transparent base material; and an infrared reflective layer formed by applying a coating agent containing a complex of poly(3,4-disubstituted thiophene) and a polyanion onto the transparent base material, and has a total light transmittance of 60% or higher. The complex preferably has a conductivity of 0.15 (S/cm) or higher, and the infrared reflective layer preferably has a film thickness of 0.50 ?m or less.

Abstract: A high heat-resistant composite material which comprises a polymerizable composition comprising a bi-functional epoxy compound, a tri- or more-functional epoxy compound and a polymerization initiator, wherein the polymerization initiator comprises a sodium salt or potassium salt of mono- or poly-functional carboxylic acid, and a reinforcing fiber such as a carbon fiber or a glass fiber; and a vehicle member or a construction member comprising the above heat-resistant composite material. Said composite material comprises an epoxy polymer having high heat-resistant physical properties over those of a conventional epoxy polymer as a matrix, and exhibits an extremely high retention factor of storage modulus at high temperature.

Abstract: An electrically conductive polymer obtained by oxidative polymerization of a heterocycle-containing aromatic compound as a monomer, wherein the heterocycle-containing aromatic compound is represented by the formula: A-B. In the above formula, A represents a substituted or unsubstituted thiophene ring group, or a substituted or unsubstituted pyrrole ring group; B represents a substituted or unsubstituted hydrocarbon aromatic ring group, a substituted or unsubstituted thiophene ring group, or a substituted or unsubstituted pyrrole ring group; the ring represented by A and the ring represented by B are directly linked; however, A and B represent structures that are different from each other. The compound can be produced by a coupling reaction using a hypervalent iodine reactant.

Abstract: Provided are: an impact-resistant polyamide composition which exhibits improved toughness and improved impact strength and which can be easily polymerized in-situ in a molding stage; and a novel process for the production of the same. The novel process comprises initiating the anionic polymerization of ?-caprolactam in the presence of (A) an anionic polymerization catalyst, (B) an anionic polymerization activator, (C) 2.0 to 30% by weight (relative to the ?-caprolactam) of an N,N-disubstituted vinylbenzylamine, and (D) a radical polymerization initiator, and subjecting the resulting system to reaction under conditions comprising a reaction temperature of the reaction system of 120 to 180° C. and a reaction time of 10 seconds to 120 minutes. Since radical polymerization in the process is conducted without hindering the anionic polymerization, an alloyed polyamide composed of both polycaprolactam and poly (N,N-disubstituted vinylbenzylamine) can be obtained.

Abstract: A low temperature curable epoxy resin composition which comprises: an epoxy component that contains an epoxy compound having per molecule at least two epoxy groups and that is liquid at 25° C.; an aromatic amine based curing agent that contains an aromatic amine compound having per molecule at least two amino groups directly bonded to the aromatic ring and that is liquid at 25° C.; and Mg(II) acetylacetonate as a cure accelerator. The composition, which contains a novel cure accelerator using a metal complex, exhibits high stability at room temperature while lowering a cure temperature or shortening a cure time.

Abstract: An electrically conductive polymer obtained by oxidative polymerization of a heterocycle-containing aromatic compound as a monomer, wherein the heterocycle-containing aromatic compound is represented by the formula: A-B. In the above formula, A represents a substituted or unsubstituted thiophene ring group, or a substituted or unsubstituted pyrrole ring group; B represents a substituted or unsubstituted hydrocarbon aromatic ring group, a substituted or unsubstituted thiophene ring group, or a substituted or unsubstituted pyrrole ring group; the ring represented by A and the ring represented by B are directly linked; however, A and B represent structures that are different from each other. The compound can be produced by a coupling reaction using a hypervalent iodine reactant.

Abstract: Disclosed is a novel method for manufacturing a semiconductor package, which can suppress the formation of voids in an encapsulating resin. Specifically disclosed is a method for manufacturing a semiconductor package, which comprises: (1) a step wherein a first member, which is selected from a group consisting of semiconductor chips and circuit boards, is coated with solvent borne semiconductor encapsulating epoxy resin composition that essentially contains (A) an epoxy resin, (B) a phenol novolac resin in such an amount that the mole number of phenolic hydroxyl groups is 0.8-1.