Abstract: The invention relates to water-based adhesives for industrial applications obtained by mixing water-redispersible polymer powder and water-soluble polymer powder with water, wherein the weight ratio of the water-redispersible polymer powder to the water-soluble polymer powder is from about 0.001:1 to 100:1 and the water-based adhesive has a set speed of less than 300 sec, when measured with a 36 ?m thick layer at 23° C. and 50% relative humidity and 385 ?m thick carton boards with a weight of 275+/?3 g/m2 and Cobb values on one side of 43 g/min/m2 and 27 g/min/m2 on the other side, has a solids content of about 7.5 to 70 wt.-% and a Brookfield viscosity at 23° C. at 20 rpm, measured according to the ASTM D1084 standard, of about 500 to 10,000 mPas. The water-based industrial adhesive has the capability to bond a low surface tension substrate to a cellulosic substrate, in particular with a weight-ratio of water-redispersible polymer powder to water-soluble polymer powder from about 0.

Abstract: Hot melt adhesives are provided that have improved heat resistance. The adhesives comprise a metallocene polyolefin, an amorphous ?-olefin polymer, a tackifier and a functional polyolefin. The functional polyolefin is used in an amount sufficient to increase the heat resistance. A preferred functional polyolefin is a maleated polyolefin such as maleated polypropylene. A preferred tackifier is a hydrogenated hydrocarbon tackifier.

Abstract: The invention relates to an aqueous dispersion and dispersion powder composition for highly flexible, waterproof, hydraulically binding tile adhesives having an extended open time, and containing an emulsion polymer (A) having a glass transition temperature (Tg) of approximately 10° C. to 80° C., and an emulsion polymer (B) having a glass transition temperature (Tg) of approximately ?60° C. to +20° C. The difference of the glass transition temperatures (Tg) of the emulsion polymers (A and B) is at least approximately 5° C. The proportion of vinyl acetate monomer units is 0 to 70 mol-% and the minimum film forming temperature according to DIN 53787 of the 50% aqueous dispersion composition is approximately 15° C. or less, and the monomers, stabilization systems and optionally the additional additives of the dispersion and/or dispersion powder composition are selected such that a good cement compatibility is guaranteed.

Abstract: Insulation blankets having preapplied thereon a reactivatable hot melt adhesive.

Abstract: Moisture curable reactive hot melt adhesive compositions are prepared using a novel two-step polymerization process. Resulting adhesives have improved green strength.

Abstract: Moisture curable hot melt adhesive compositions that contain functionally modified polyolefins and have improved green strength before set are prepared without using added crystalline polyester polyol.

Abstract: The invention provides an isocyanate free UV curable hot melt composition which may be hardened upon exposure to UV radiation to provide a protective coating. The coating is particularly useful in wood-working and furniture applications.

Abstract: High green strength reactive hot melt adhesives are prepared using silane-functional liquid polymers. The adhesive are formulated using a silane-reactive polymer or, alternatively, a non-silane-reactive polymer together with a compatible tackifier.

Abstract: The present invention relates to a hydrocolloid blend which exhibits an innovative texture in compositions. The blend consists essentially of a waxy starch which has been enzymatically debranched and a non-high amylose starch which has been stabilized and inhibited in a ratio of 0.8:1 to 8:1.

Abstract: A radiation-curable desiccant-filled adhesive/sealant composition comprising a radiation-curable resin, one or more desiccant fillers, one or more photoinitiators or photosensitizers, and optionally, one or more inorganic or organic fillers.

Abstract: The present invention concerns adhesive compositions that provide corrosion-preventative properties and improved adhesive bonding on corrodible surfaces, such as may be found in electronic components. These compositions provide the substrates with greatly increased resistance to corrosion, especially during long term exposure to high temperatures and/or high humidity. When used on conductive substrates, the compositions also maintain good initial and ongoing electrical conductivity.

Abstract: A radio frequency identification (“RFID”) system antenna having adhesive pre-applied to one or more of its contact pads to allow for high speed attachment of the antenna to the RFID die or die strap. Also disclosed is a method for attaching an RFID antenna having pre-applied adhesive to a die or die strap.

Abstract: Isocyanurate compounds or resins have the structure (I) in which Y is an hydroxyl group —OH or a maleimide group Formula (II) provided that at least one maleimide group is present, and Q is any divalent organic moiety, aliphatic or aromatic.

Abstract: Polymeric compounds containing an oxetane functionality and a styrenic functionality have the structure in which polymer is a polymeric backbone from which depend the oxetane and styrenic functionalities; m and n are integers from 2 to 500; R1 is a methyl or ethyl group; R2 and R3 are H or a methyl or ethyl group; R4 is a direct bond or a divalent hydrocarbon; W and Z independently are an ether, ester, amide, or carbamate group; and G is hydrogen, or —OR1, —SR1, or —N(R2)(R3), in which R1, R2 and R3 are as described above.

Abstract: An ultraviolet or electron beam curable conductive material for use in the electronics industry. The conductive material has a low viscosity and is capable of application to a substrate by high speed printing techniques such as flexography and rotogravure and provides high electrical conductivity following cure. The conductive material comprises one or more oligomers, one or more acrylate carriers, one or more reactive monomers such as vinyl ether, conductive filler and one or more photoinitiators. Optional additional ingredients, such as diluents, dispersants, etc. may be added as desired.

Abstract: A conductive composition for coating a semiconductor wafer comprises conductive filler that has an average particle size of less than 2 microns and a maximum particle size of less than 10 microns, a first resin that has a softening point between 80-260° C., solvent, curing agent, and a second resin, wherein at room temperature the first resin is substantially soluble in the solvent.

Abstract: Sago-based gelling starches and the use thereof. Such modified starches exhibit exceptionally fast gelling properties, high gel strengths, and exceptional elasticity. These properties allow for significantly reduced processing times, including reduced hold times. Further, the higher gel strength allows for reduced starch levels without loss of final product gel strength integrity or texture. The instant gelling starches are particularly useful in food systems of the type that gel upon standing, such as pie and cream fillings, puddings, spreads, and jellies.

Abstract: A material for producing a conductive composition comprising polymer particles, conductive particles, and a liquid medium. The material is in a liquid/dispersion form until it is cured at which time it forms an electrically conductive composition. The composition contains larger sized polymer particles along with smaller metal conductive filler particles such as nanoparticle-sized filler particles. The larger polymer particles create excluded volume in the material matrix and reduce the percolation threshold of the conductive filler particles to provide a conductive material with a reduced volume fraction of electrically conductive filler. The electrical conductivity of the material is further increased after heat treatment which causes the conductive filler particles to sinter together to form a highly conductive network.

Abstract: The present invention relates to a process of making a starch crosslinked with sodium trimetaphosphate or with a combination of sodium trimetaphosphate and sodium tripolyphosphate. The reaction has increased efficiency over the standard crosslinking process and/or reduced phosphorus effluent.

Abstract: A linear or cyclic siloxane compound contains pendant carbon to carbon double bonds, Si—H bonds, and pendant oxetane functionality. These compounds have two curing temperatures, one associated with a hydrosilation reaction between the carbon to carbon double bond and the Si—H entity, and the other associated with the ring opening of the oxetane.