Abstract: A non-destructive inspection (NDI) instrument includes a sensor connection system configured to receive test signals from at least two different types of NDI sensors which are configured to obtain test signals from an object being tested. The sensor connection system has sensor-specific connection circuits and at least one common sensor connection circuit. A data acquisition circuitry is coupled to the sensor connection and has sensor-specific data acquisition circuits and at least one common data acquisition circuit. It is further coupled to a common digital data processor which executes sensor-specific processing modules and at least one common processing module. A common display screen and user interface is coupled to the data processor and enables programs including sensor-specific user interface modules and at least one common user interface module. The sensor types preferably include all of or any combination of an ultrasound sensor, an eddy current sensor and acoustic sensor.

Abstract: Disclosed is an improved ultrasonic probe for Internal Rotating Inspection System (called IRIS) for inspecting tube-like structures from the inside of the tubes. The improved design deploys a rotor with rotor blades and a slotted stator located close to the emitting face of the transducer, to direct the flow of water such that air bubbles are carried away from a zone immediately in front of the transducer emitting face. Inspection accuracy and efficiency is significantly improved when air bubbles are effectively removed.

Abstract: An eddy current probe assembly suitable for inspecting a test object with longitudinal shape, being passed through the assembly in the object's axial direction during an inspection session, the probe assembly comprising multiple probe modules being disposed in a radial plane and with the modules partially overlaying on each other forming an iris structure encircling an inspection zone, wherein a movement in unison of each of the probe modules closer to or further away from the center of the inspection zone makes the inspection zone enlarged or contracted. Spring tension is applied on each of the probe modules so that constant life-off in maintained between the probe modules and the test surface. Array of eddy current elements for each probe module and multiple layers of probe modules can be employed to achieve complete coverage of the test surface. The radial cross-sectional shapes of the test objects can be of round or polygonal.

Abstract: A shielded eddy current coil probe is formed on a printed circuit board and comprises a first coil component forming a test coil and a second coil component forming an active shielding coil. The test coil and the active shielding coil are concentrically arranged and the number of coil windings in the active shielding coil and the field direction thereof are configured to limit the induced field or the sensed field in the test object to the footprint area of the test coil on the test object. Multiple sets of test coils with active shielding coils can be provided on the same or different layers of the printed circuit board to realize different driver, receiver and combined driver/receiver coil configurations.

Abstract: Alerting a user of a material inspection device to a change in thickness of a material being inspected is disclosed. A thickness offset is determined from calibration information. The calibration information identifies a time of flight of a pulse through a reference sample similar in composition to a material to be inspected. The thickness offset indicates when a thickness of a material being inspected differs from a thickness of the reference sample. A calibration thickness alarm is set, the calibration thickness alarm corresponding to the thickness offset. A change in thickness of the material being inspected is detected. The calibration thickness alarm is engaged to alert the user of the inspection device of a detected change in thickness of the material being inspected.

Abstract: A system and method for carrying out non-destructive testing and inspection of test objects to assess their structural integrity uses a calibration module configured to provide V-Path time of flight (TOF) correction data over a plurality of object thickness points, obtained from an object or objects having known thicknesses using the same physical probe as is used for the inspection measurements. When a probe launches acoustical waves into a test object and an instrument and a control system compute a time of flight value of the acoustical waves launched by the probe, the pre-obtained V-Path TOF correction data is used to correct the measured time of flight computed by the instrument.

Abstract: An apparatus for performing ultrasonic inspection of an object, during one measurement on the object, triggers a sequence of excitations of the probe system and receives a sequence of substantially identical echo signals reflected from the object, and further scales each echo signal to different degrees to increase and extend the dynamic range of the echo signals. An A/D converter is then used to digitize the scaled signal sequentially in a manner which dispenses the need for using numerous A/D converters and the associated filters. The digitized signal samples are then combined to produce a single digital output in a manner that is not over-flowed and with desirable resolution. A sequence of successive acquisitions of the scaled signal with the highest sensitivity are averaged to reduce system noise.

Abstract: Disclosed is a method and system which efficiently and accurately identifies an acoustic wedge by as simple as pressing a button to execute a command for a phased array inspection system, once the wedge is engaged with the system. It is based on the approach to use the time of flight that ultrasonic signals travel in the wedge to measure and calculate critical parameters, such as the wedge acoustic velocity, the wedge or incident angle and the height of the first element of the associated phased array probe above the base of the wedge.

Abstract: The invention relates to a method for nondestructive testing of a metallic workpiece (11) using an ultrasonic transducer testing head having the following steps: to generate an ultrasonic wave, an excitation pulse is transmitted using the ultrasonic transducer (1) to the workpiece (11), a response signal is measured using the magnetic field sensor (3), testing information, preferably transit time information of the ultrasonic wave and therefrom wall thickness information about the thickness of the workpiece (11), is ascertained on the basis of an ultrasonic echo component of the response signal, and further information, in particular distance information about the distance of the testing head from the workpiece (11), is ascertained on the basis of a magnetic field component of the response signal by supplementary analysis.

Abstract: An enhanced wireless eddy current probe is disclosed which has means to wirelessly couple to a non-destructive inspection (NDI) system situated some distance away from an inspection point on a material under inspection. The disclosed enhanced wireless eddy current probe provides means for executing advanced functions necessary for a complex eddy current inspection operation. These functions include, but are not limited to, storing, loading, and executing a predetermined firing sequence on an array of coil elements, probe balancing, probe calibration, and providing bibliographic information specific to said probe to a wirelessly coupled NDI system.

Abstract: Disclosed is an improved orthogonal eddy current probe with at least three coils, each of the coils is wound across the two facing sides of an at least six-sided right polygonal prism, such as a hexagonal core. At each time interval, two of the three coils are used as driver coils, being charged simultaneously with electric current driven in coherent directions to induce a combined eddy current and one of the coils is used as a receiver coil to sense the eddy current, with the combined eddy current to be orthogonal to the receiver coil. Each coil alternates to be one of the driver coils or the receiver coil at a predetermined switching sequence and a predetermined switching frequency during consecutive time intervals. The eddy current probe as disclosed provides the advantages of inspecting a test surface for flaws of any flaw orientation with one pass of scan, providing sufficient sensitivity and desirable noise cancellation in all directions.

Abstract: The invention herein disclosed provides a 2D coil and a method of using the 2D wound EC sensor for reproducing the Eddy Current Testing (ECT) response of a prior art 3D orthogonal sensor. The 3D orthogonal sensor is conventionally wound onto a 3D core, with at least some of the surfaces being un-parallel to the surface be inspected. Using the herein disclosed 2D configuration allows the use of printed circuit board technologies for the manufacturing of these EC sensors. The herein disclosed method and the associated 2D EC sensors are particularly useful for reproducing the EC effect of conventional orthogonal probe arrays.

Abstract: A flexible array probe is disclosed suitable for use in the non-destructive testing and inspection of test pieces with varying cross-sectional geometries. Array elements—such as, but not limited to, eddy current sensors, piezoelectric sensor elements, and magnetic flux leakage sensors—are mounted on thin alignment fins and coupled together with pairs of pivot mechanisms along the axis of desired rotation. The pivot mechanisms allow rotation in exactly one dimension and force the flexible array probe to align its elements orthogonally to the surface of the structure under test. Alignment and coupling fixtures are also disclosed.

Abstract: An enclosed electronic apparatus including a first continuous heat-transfer band forming at least a portion of the exterior surface of the enclosure, with continuous lateral edges on either side thereof, and mounting points on an internal side of the continuous heat transfer band to which a printed circuit board assembly is mountable. A printed circuit board assembly is mounted to the heat transfer band at the mounting points, with a thermally conductive portion forming a thermal path between a heat-producing electronic component of the printed circuit board assembly and the heat transfer band. A thermally conductive gasket between the printed circuit board assembly and the heat transfer band at the mounting points facilitates heat transfer. Opposing first and second enclosure portions seal the respective continuous lateral edges of the heat transfer band against penetration of fluid or debris.

Abstract: A device is disclosed for performing non-destructive inspection and testing (NDT/NDI) of an elongated test object, wherein the inspection system includes: a test object conveyor for conveying the test object along a longitudinal conveyance path; a probe assembly including phased-array probes, the probe assembly being configured to induce signals in the test object and sense echoes reflected from the test object; a probe assembly conveyor configured to movably support the probe assembly, to move the probe assembly on a circumferential path about the test object; and a control system coupled to the test object conveyor and to the probe assembly conveyor and configured to allow data acquisition by and from the phased-array probes while, simultaneously, the test object moves along the longitudinal path and the phased-array probes move on the circumferential path.

Abstract: The present invention relates to a flaw detector imaging apparatus for detecting and visualizing a flaw in a target material to be investigated, comprising an ultrasonic phase-array probe comprising an array of ultrasonic transducers and a flaw detector. The flaw detector includes at least one trigger channel to trigger ultrasonic emitting transducers of the array at respective time delays to produce an ultrasonic beam propagating through the target material, and a single receiver channel to receive echo signals produced by ultrasonic receiving transducers of the array in response to ultrasonic wave echoes reflected from a flaw in the target material. The single receiver channel comprises a delay circuit imparting to the received echo signals the respective time delays as used in the triggering of the ultrasonic emitting transducers and a combiner of the delayed echo signals.

Abstract: Disclosed is a method and an NDT/NDI probe deploying a slit or a flexible joint of probe bending region, preferably between two rows of probe elements to allow free bending between rows of probe elements and along the direction of the rows of elements and to allow two adjacent rows of elements to bend individually along its own natural bending lines perpendicular to the direction of the rows of elements. Also disclosed is the use of protective flexible pads to cover the probe elements and other probe components.

Abstract: A method and apparatus for effecting ultrasonic flaw detection of an object processes an echo signal received from the object being tested in at least three signal channels, wherein the echo signal is scaled to different degrees along each channel to increase and extend the dynamic range of an associated A/D converter system, in a manner which dispenses with the need for using numerous analog high pass and low pass filters and a variable gain amplifier. This reduces complexity and avoids performance limitations. The digital to analog converters sample the differently scaled input signal and a selection circuit selects the output of the digital output obtained from that analog to digital converter which has the highest gain, but which has not overflowed. The digital outputs are seamlessly merged to produce an output that can be displayed as a scan display which shows the location of faults.

Abstract: A method and apparatus for effecting ultrasonic flaw detection of an object processes an echo signal received from the object being tested in at least three signal channels, wherein the echo signal is scaled to different degrees along each channel to increase and extend the dynamic range of an associated A/D converter system, in a manner which dispenses with the need for using numerous analog high pass and low pass filters and a variable gain amplifier. This reduces complexity and avoids performance limitations. The digital to analog converters sample the differently scaled input signal and a selection circuit selects the output of the digital output obtained from that analog to digital converter which has the highest gain, but which has not overflowed. The digital outputs are seamlessly merged to produce an output that can be displayed as a scan display which shows the location of faults.