Patents Assigned to Nichia Corporation
  • Patent number: 11575073
    Abstract: A light-emitting device includes: a substrate; a light-emitting element disposed on the substrate; a light-transmissive member disposed on a light extraction surface of the light-emitting element; a cover that covers the light-emitting element with a gap between the cover and the light-emitting element, the cover including: an upper portion that is transmissive to light emitted from the light-emitting element, a sidewall extending along a peripheral edge of the upper portion and having an outer lateral surface, and a recess defined by the upper portion and the sidewall; and a fixing member arranged on at least a part of the outer lateral surface of the sidewall of the cover. The fixing member is formed of a material that is deformable due to a pressing force generated in the event of an engagement with a counterpart member.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: February 7, 2023
    Assignee: NICHIA CORPORATION
    Inventors: Tsuyoshi Okahisa, Tomohito Shinomiya, Daizo Kiba
  • Patent number: 11575243
    Abstract: A light emitting device includes: a plurality of light emitting elements including a first light emitting element and a second light emitting element; a case enclosing the light emitting elements and comprising a light-transmissive region; a plurality of main lenses, each covering a portion of the light-transmissive region, the plurality of main lenses including a first main lens configured to collimate or converge light emitted from the first light emitting element and a second main lens configured to collimate or converge light emitted from the second light emitting element; and a plurality of sub-lenses disposed in the case, the plurality of sub-lenses including a first sub-lens located in an optical path between the first light emitting element and the first main lens, and a second sub-lens located in an optical path between the second light emitting element and the second main lens.
    Type: Grant
    Filed: October 13, 2020
    Date of Patent: February 7, 2023
    Assignee: NICHIA CORPORATION
    Inventors: Soichiro Miura, Ryota Okuno
  • Patent number: 11575242
    Abstract: A light emission device includes: a base part; a semiconductor laser device disposed on the base part; a frame body fixed to the base part and provided around the semiconductor laser device; a lid bonded to an upper surface of the frame body; and a first electrical conduction member bonded to an outer surface of the base part or an outer surface of the frame body, the first electrical conduction member having a first conductive region and a second conductive region that are electrically connected to the semiconductor laser device. In a top plan view, the first electrical conduction member includes a first portion overlapping the frame body and a second portion not overlapping the frame body, the first conductive region being contained in the first portion, and the second conductive region being contained in the second portion.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: February 7, 2023
    Assignee: NICHIA CORPORATION
    Inventor: Takuya Hashimoto
  • Patent number: 11572506
    Abstract: A method for producing a fluoride fluorescent material comprises: preparing fluoride particles having a composition containing at least one element or ion A selected from the group consisting of alkaline metal elements and NH4+, at least one element M selected from the group consisting of Group-4 elements and Group-14 elements, Mn4+, and F, in which a molar ratio of A in 1 mol of the composition is 2, a total molar ratio of M and Mn4+ is 1, a molar ratio of Mn4+ is in a range of more than 0 and less than 0.2, and a molar ratio of F is 6; subjecting the fluoride particles to a first heat treatment at a temperature of 500° C. or more in an inert gas atmosphere; washing the first heat-treated fluoride particles with a washing liquid; and bringing the washed fluoride particles into contact with a fluorine-containing substance and subjecting the resulting fluoride particles to a second heat treatment at a temperature of 400° C. or more.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: February 7, 2023
    Assignee: NICHIA CORPORATION
    Inventor: Tomokazu Yoshida
  • Patent number: 11573169
    Abstract: A method of conducting a shear strength test on a semiconductor element with improved pressing force direction includes pressing a peripheral surface of the semiconductor element with a shear tool in a direction inclined to gradually head away from the surface of the substrate along the direction of pressing to conduct a shear strength test with a die shear strength tester.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: February 7, 2023
    Assignee: NICHIA CORPORATION
    Inventors: Atsushi Maruno, Wataru Okamoto
  • Publication number: 20230036533
    Abstract: A light-emitting device includes: a plurality of light-emitting elements arranged in an array on a base member; and a lens that comprises at least four Fresnel lenses disposed above the base member and facing the plurality of light-emitting elements. In a top plan view, a center of each of the plurality of light-emitting elements is offset from a lens center of the corresponding one of the Fresnel lenses of the lens in a direction toward a center of the lens. The plurality of light-emitting elements include at least two first light-emitting elements and at least two second light-emitting elements, wherein an emission color of the first light-emitting elements is different from an emission color of the second light-emitting elements.
    Type: Application
    Filed: October 7, 2022
    Publication date: February 2, 2023
    Applicant: NICHIA CORPORATION
    Inventors: Tsuyoshi OKAHISA, Shinya MATSUOKA
  • Publication number: 20230031544
    Abstract: A laser light source includes: a laser diode chip including an emission layer, a substrate supporting the emission layer, and an emission end surface; a submount that includes a principal surface on which the laser diode chip is fixed and a pair of lens supports located at opposite sides with respect to the emission end surface of the laser diode chip; a lens bonded to the end surfaces of the pair of lens supports; and a semiconductor laser package housing the aforementioned elements. The laser diode chip is fixed to the submount with the emission layer being closer to the submount than is the substrate. The emission end surface of the laser diode chip is located outward with respect to an edge of the principal surface. The end surfaces of the pair of lens supports are located outward with respect to the first end surface of the laser diode chip.
    Type: Application
    Filed: September 8, 2020
    Publication date: February 2, 2023
    Applicant: NICHIA CORPORATION
    Inventors: Norihiro DEJIMA, Hideaki TAKEDA, Hidenori MATSUO, Masaki OMORI
  • Publication number: 20230035957
    Abstract: A light source device includes: a substrate having a support face; a plurality of light emitting elements disposed on the support face, the plurality of light emitting elements including a first light emitting element and a second light emitting element, each of which is a vertical-cavity surface-emitting laser element; and a planar lightwave circuit having a light incident face that faces the support face and including a plurality of optical waveguides configured to guide light that has exited from the respective plurality of light emitting elements and entered the light incident face. The planar lightwave circuit is directly or indirectly supported by the plurality of light emitting elements. The substrate includes a first wiring layer electrically connected to the first light emitting element and the second light emitting element.
    Type: Application
    Filed: August 1, 2022
    Publication date: February 2, 2023
    Applicant: NICHIA CORPORATION
    Inventor: Tadaaki MIYATA
  • Publication number: 20230030724
    Abstract: A light-emitting module includes a light guide member including a first light guide portion including a first upper surface, a first lower surface, a first lateral surface, a first extending portion facing the first lateral surface and extending continuously from a portion of the first lateral surface, and a first hole portion, and a second light guide portion including a second upper surface, a second lower surface, a second lateral surface, a second extending portion facing the second lateral surface and extending continuously from a portion of the second lateral surface, and a second hole portion; a light source unit including a first light source disposed in the first hole portion, and a second light source disposed in the second hole portion; and a first light-reflective member covering at least a portion of the first lateral surface facing the first extending portion and at least a portion of the first extending portion facing the first lateral surface, in which the first extending portion faces the sec
    Type: Application
    Filed: July 19, 2022
    Publication date: February 2, 2023
    Applicant: NICHIA CORPORATION
    Inventors: Yasumasa YAMAMOTO, Yuki SHIBUTANI, Makoto KATSUNO
  • Publication number: 20230037204
    Abstract: A method of manufacturing a light emitting device includes: a resin layer disposition step including disposing, on a support, a resin layer in an A-stage state; a light emitting element mounting step including mounting a light emitting element on the resin layer such that a first surface faces an upper surface of the resin layer; a load application step including applying a load to the light emitting element so as to embed the semiconductor stack structure at least partly in the resin layer while a second surface of the light emitting element is exposed from the resin layer; a first heating step including heating the resin layer at a first temperature without applying the load, to lower a viscosity of the resin layer; and a second heating step including heating the resin layer at a second temperature higher than the first temperature to harden the resin layer.
    Type: Application
    Filed: July 27, 2022
    Publication date: February 2, 2023
    Applicant: NICHIA CORPORATION
    Inventors: Shinya MITSUHASHI, Takuhiro FURUKAWA
  • Publication number: 20230030292
    Abstract: A planar light source includes: a support member; a light guide member disposed on the support member and having a light source positioning part; and a light source disposed on the support member while being in the light source positioning part of the light guide member. The support member includes: an insulation base having a first face positioned closer to the light source and a second face positioned opposite the first face, a first conductive layer disposed on the first face of the insulation base and electrically connected to the light source, an adhesive layer disposed on and in contact with the first face of the insulation base and the first conductive layer, and a light reflecting sheet disposed on the adhesive layer.
    Type: Application
    Filed: July 25, 2022
    Publication date: February 2, 2023
    Applicant: NICHIA CORPORATION
    Inventors: Yukihiro MIURA, Masaaki KATSUMATA, Ryohei YAMASHITA, Takashi MATSUO
  • Publication number: 20230029800
    Abstract: A method of manufacturing a planar light source includes: providing a wiring substrate including: an insulating layer defining a first through-hole and a second through-hole that are separated from each other, and a first wiring layer and a second wiring layer that are disposed below the insulating layer, wherein the first wiring layer is separated from the first through-hole and the second wiring layer is separated from the second through-hole, and wherein, in a top plan view, the first wiring layer and the second wiring layer are arranged at two opposite sides with respect to the first through-hole and the second through-hole; disposing a light guide member and a light source above the wiring substrate; and forming (i) a first wiring member that fills the first through-hole, and (ii) a second wiring member that is separated from the first wiring member and fills the second through-hole.
    Type: Application
    Filed: October 12, 2022
    Publication date: February 2, 2023
    Applicant: NICHIA CORPORATION
    Inventors: Yasunori SHINOMIYA, Toru HASHIMOTO
  • Patent number: 11569413
    Abstract: A method includes: introducing a gas including gallium, an ammonia gas, and a gas including a p-type impurity to a reactor and forming a first p-type nitride semiconductor layer on a first light-emitting layer in a state in which the reactor has been heated to a first temperature; lowering a temperature of the reactor from the first temperature to a second temperature; introducing an ammonia gas with a first flow rate to the reactor and increasing the temperature of the reactor from the second temperature to a third temperature; and introducing a gas including gallium, an ammonia gas with a second flow rate, and a gas including an n-type impurity to the reactor, and forming a second n-type nitride semiconductor layer on the first p-type nitride semiconductor layer in a state in which the reactor has been heated to the third temperature.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: January 31, 2023
    Assignee: NICHIA CORPORATION
    Inventor: Seiichi Hayashi
  • Patent number: 11569634
    Abstract: A light emitting device includes: a base having a first stepped portion and a second stepped portion; a light emitting element; an electronic member configured to be irradiated by light emitted from the light emitting element; a first wiring region located on the first stepped portion; a second wiring region located on the second stepped portion; wires connected to the light emitting element and the electronic member. The wires includes a first and second wires. The first wire has a first end that is connected to the first wiring region, and a second end. The second wire has a first end that is connected to the second wiring region, and a second end. A position of the second end of the first wire relative to the bottom face is lower than a position of the second end of the second wire relative to the bottom face.
    Type: Grant
    Filed: December 3, 2020
    Date of Patent: January 31, 2023
    Assignee: NICHIA CORPORATION
    Inventors: Shota Murakami, Soichiro Miura
  • Publication number: 20230025627
    Abstract: A planar light source includes: a support member including a wiring substrate, a light guide member, a light source disposed in a hole of the light guide member, and a first reinforcing member disposed on the support member and surrounding the light guide member in a plan view. The first reinforcing member includes first and second portions extending in a first direction and facing each other, and includes third and fourth portions extending in a second direction orthogonal to the first direction and facing each other. At least one of the first portion, the second portion, the third portion, and the fourth portion has light reflectivity to light emitted from the light source. In the plan view, the light guide member is located between the first and second portions in the second direction, and is located between the third and fourth portions in the first direction.
    Type: Application
    Filed: July 18, 2022
    Publication date: January 26, 2023
    Applicant: NICHIA CORPORATION
    Inventors: Shinya KONDO, Takuya NAKABAYASHI
  • Publication number: 20230022563
    Abstract: A light emitting device includes: at least one semiconductor laser element; a base member on which the at least one semiconductor laser element is disposed; a light-transmissive member including: an upper surface, a lower surface, and a light-transmissive region through which laser light emitted from the at least one semiconductor laser element is transmitted from the lower surface to the upper surface; and a lens member through which the laser light emitted from the at least one semiconductor laser element, the lens member being fixed to the base member or the light-transmissive member. At least the light-transmissive region is made of sapphire. The light-transmissive member includes an incident surface on which the laser light is incident, the incident surface being an a-plane of the sapphire.
    Type: Application
    Filed: October 6, 2022
    Publication date: January 26, 2023
    Applicant: NICHIA CORPORATION
    Inventor: Kazuma KOZURU
  • Publication number: 20230023001
    Abstract: A light source device that supplies a constant current to a diode load that includes a plurality of light-emitting elements connected in series. The light source device includes a power supply circuit connected to the diode load and a peak current limiting circuit connected in series to the diode load. The peak current limiting circuit includes a current detector that is connected in series to the diode load and a current-regulating circuit that controls a current to the diode load by a detection voltage of the current detector. Further, the current detector has a series circuit including a resistor and a coil.
    Type: Application
    Filed: December 8, 2020
    Publication date: January 26, 2023
    Applicant: NICHIA CORPORATION
    Inventors: Daisuke MORI, Hironobu SHIBATA, Ryosuke MORI, Masaki OMORI, Hideki KONDO
  • Publication number: 20230026963
    Abstract: Provided is a light emitting device, including a light emitting element having a light emission peak wavelength in a range of 380 nm or more and 500 nm or less, and a wavelength converting member including a ceramic composite including an inorganic fluorescent material having a light emission peak wavelength in a range of 510 nm or more and 570 nm or less and an inorganic oxide, and a translucent thin film having a physical film thickness in a range of 82 nm or more and 140 nm or less and a refractive index smaller than the refractive index of the ceramic composite, disposed on a light emission side of the ceramic composite, the translucent thin film including a fluoride containing at least one kind of an element selected from the group consisting of an alkali metal element, an alkaline earth metal element, and a Group 13 metal element.
    Type: Application
    Filed: July 7, 2022
    Publication date: January 26, 2023
    Applicant: NICHIA CORPORATION
    Inventors: Toshiyuki HIRAI, Gentaro TANAKA
  • Publication number: 20230027533
    Abstract: A light emitting device includes a substrate including first, second, third and fourth wiring portions on a top surface of a base member and arrayed in a first direction, and a connection wiring portion connecting the second and third wiring portions. The connection wiring portion includes first and second connection ends respectively connected with the second and third wiring portions, and a connection central portion connecting the first and second connection ends and having a maximum width in a second direction different from each of a maximum width of the first connection end and a maximum width of the second connection end. In the second direction, at least a part of the connection wiring portion has a width narrower than each of a maximum width of the second wiring portion and a maximum width of the third wiring portion.
    Type: Application
    Filed: October 4, 2022
    Publication date: January 26, 2023
    Applicant: NICHIA CORPORATION
    Inventors: Takuya NAKABAYASHI, Tadaaki IKEDA, Tetsuya ISHIKAWA
  • Patent number: RE49406
    Abstract: The present invention provides a light emitting element capable or realizing at least one of lower resistance, higher output, higher power efficiency (1 m/W), higher mass productivity and lower cost of the element using a light transmissive electrode for an electrode arranged exterior to the light emitting structure. A semiconductor light emitting element includes a light emitting section, a first electrode and a second electrode on a semiconductor structure including first and second conductive type semiconductor layers, the first and the second electrodes respectively including at least two layers of a first layer of a light transmissive conductive film conducting to the first and the second conductive type semiconductor and a second layer arranged so as to conduct with the first layer. First and second light transmissive insulating films are respectively arranged so as to overlap at least one part of the first and the second layers.
    Type: Grant
    Filed: July 10, 2019
    Date of Patent: January 31, 2023
    Assignee: NICHIA CORPORATION
    Inventors: Masahiko Sano, Takahiko Sakamoto, Keiji Emura, Katsuyoshi Kadan