Abstract: A light emitting device includes: a base having a recess and a flat upper surface; a light emitting element disposed on the upper surface of the base and configured to emit light laterally from an emission end surface; and a reflective member disposed on the upper surface of the base to face the light emitting element with the recess located between part of the reflective member and the light emitting element in a top view, the reflective member having a reflective surface configured to reflect the light upward. At least a portion of the reflective surface overlaps with the recess in the top view. A lower end of the reflective surface is located lower than the upper surface of the base and higher than a bottom surface of the recess in a direction normal to the upper surface of the base.

Abstract: A light-emitting device includes: a heat dissipation member having a mounting surface; a frame body fixed to the heat dissipation member and having an upper surface; a submount supported by the mounting surface and having an upper surface and a lower surface; and a semiconductor laser element supported by the upper surface of the submount. The lower surface of the submount includes a first region bonded to the mounting surface and a second region facing the upper surface of the frame body and not bonded to the upper surface of the frame body.

Abstract: A method of manufacturing a light-emitting device includes: providing a light source including a first substrate and a light-emitting element coupled to the first substrate; and after the providing of the light source, forming one or more positioning holes in the first substrate at locations spaced apart from a light-emitting part of the light source by predetermined distances in a top plan view.

Abstract: A method of manufacturing a light source device includes: disposing bumps containing a first metal on a first substrate which is thermally conductive; disposing a bonding member on the bumps, the bonding member containing Au—Sn alloy; disposing a light emitting element on the bumps and the bonding member; and heating the first substrate equipped with the bumps, the bonding member, and the light emitting element.

Abstract: A light source device includes: a plurality of light source parts configured to emit light, in which each of the light source parts includes a light-emitting element and a light guiding member, the plurality of light source parts are disposed in a circular, planar-shaped placement region and are arranged in (i) a combination of at least a rectangular grid and a triangular grid or (ii) a concentric circular pattern, and the plurality of light source parts are configured to emit the light in a matrix pattern in an irradiated region.

Abstract: A wavelength conversion member includes: a sintered body that has a light incidence face, a light emission face, and a light reflecting face that is different from the light incidence face and the light emission face, wherein the sintered body contains phosphor particles. The light reflecting face of the sintered body has a plurality of recessed portions. A distribution of the phosphor particles at the light reflecting face is lower than a distribution of the phosphor particles at a cross-section inside the sintered body.

Abstract: An apparatus for treating spermatozoa of an animal to increase motility includes: a holding or mounting unit configured to hold or support a sperm container; a lighting unit configured to irradiate the sperm container held or supported by the holding or mounting unit with light having wavelengths in a range of 390-420 nm; and a light controller unit configured to control the lighting unit.

Abstract: Provided is a light-emitting material containing a phosphor that emits red light with high luminance. The light-emitting material contains a fluoride phosphor having a first composition containing an alkali metal including K, Si, Al, Mn, and F. In the first composition, when a total number of moles of the alkali metal is 2, a total number of moles of Si, Al, and Mn is in a range from 0.9 to 1.1, a number of moles of Al is in a range from greater than 0 to 0.1, a number of moles of Mn is in a range from greater than 0 to 0.2, and a number of moles of F is in a range from 5.9 to less than 6.0. The fluoride phosphor has a cubic system crystal structure and has a lattice constant of 0.8138 nm or larger.

Abstract: Provided is a method for producing a positive electrode for a nonaqueous electrolyte secondary battery, the method including obtaining a positive electrode active material having a volume-average particle size in a range of 1 m to 8 m and a specific surface area that is 1.4 m2/g or more from: particles containing a lithium transition metal composite oxide; and an aluminum compound having a volume-average particle size in a range of 1 nm to less than 500 nm, and obtaining a positive electrode active material layer by dispersing the positive electrode active material, a conduction aid, and a binder in a solvent to obtain a dispersion, applying the dispersion to the current collector, drying the dispersion, and subsequently compression-molding the dispersion and the current collector to have a density in a range of more than 2.6 g/cm3 and less than 2.8 g/cm3.

Abstract: Provided is a fluoride phosphor that can improve reliability in a light-emitting device. The fluoride phosphor includes fluoride particles and an oxide covering at least a portion of the surface of the fluoride particles. The oxide contains at least one element selected from the group consisting of Si, Al, Ti, Zr, Sn, and Zn, and a content percentage of the oxide is in a range from 2 mass % to 30 mass %. The fluoride particles have a composition containing an element M including at least one element selected from the group consisting of Group 4 elements, Group 13 elements, and Group 14 elements, an alkali metal, Mn, and F, and when the number of moles of the alkali metal is 2, the number of moles of Mn is in a range greater than 0 and less than 0.2, the number of moles of the element M is a range greater than 0.8 and less than 1, and the number of moles of F is in a range greater than 5 and less than 7.

Abstract: A method of producing semiconductor nanoparticles includes: providing first semiconductor nanoparticles containing a first semiconductor containing Ag, In, Ga, and S, and a second semiconductor disposed on a surface of the first semiconductor and containing Ga and S; performing a first heat treatment of a first mixture containing the first semiconductor nanoparticles, a Ga source, and an S source to obtain a first heat-treated product comprising semiconductor composite particles; and performing a second heat treatment of a second mixture containing the semiconductor composite particles and a gallium halide to obtain a second heat-treated product.

Abstract: A light source device includes: a laser diode configured to emit laser light; a substrate directly or indirectly supporting the laser diode; and a cap secured to the substrate and covering the laser diode, the cap including: a first portion configured to transmit the laser light that is emitted from the laser diode, and a second portion that is bonded to the first portion. The second portion includes: a pair of lateral wall portions that are located at lateral sides of the laser diode, the pair of lateral wall portions being bonded to the first portion, a cover portion that is located above the laser diode and connects the pair of lateral wall portions together, and a rear wall portion that faces the first portion with the laser diode disposed between the first portion and the rear wall portion of the second portion.

Abstract: Provided are molds for polar anisotropic ring-shaped bonded magnet molded articles which enable the production of bonded magnet molded articles with a high degree of roundness and only slight distortion, without the need for mold modification and preparation of a test mold, and a method of preparing such molds. The present invention relates to a method of preparing a mold for a polar anisotropic ring-shaped bonded magnet molded article, the method including: 1) determining the shrinkage length (Tc) of a desired polar anisotropic ring-shaped bonded magnet molded article using the following equation: Tc=T×(?1/100??2/100); 2) determining the radius (Dm) of a magnetic pole portion of a mold cavity using the following equation: Dm=D/(1??2/100); and 3) defining the outer peripheral shape of the mold cavity from the Tc, the Dm, and the number (P) of magnetic poles of the molded article.

Abstract: A light source includes a plurality of light emitting elements, a light blocking member, and a plurality of light-transmissive members. The light emitting elements are arranged in a matrix to form a rectangular shape as a whole in a plan view. The light blocking member covers lateral surfaces of the light emitting elements with an upper surface of each of the light emitting elements being exposed from the light blocking member. The light-transmissive members arranged in a matrix to form a rectangular shape as a whole in the plan view. The light-transmissive members include a plurality of first light-transmissive members respectively disposed on the light emitting elements, and a plurality of second light-transmissive members disposed on the light blocking member in an outer periphery region located outwardly of the light emitting elements in the plan view.

Abstract: A light-emitting device includes a support including a wall portion; a light-emitting element placed on the support and surrounded by the wall portion in a plan view; a first light-transmissive member having a first outer surface and a second outer surface, which is located above the first outer surface and is located inside the first outer surface in the plan view, and covering the light-emitting element and the wall portion; and a light-shielding member covering the first light-transmissive member. The first outer surface and the second outer surface are exposed from the light-shielding member, and a surface roughness of the first outer surface is rougher than a surface roughness of the second outer surface.

Abstract: Provided are a light emitting device capable of reducing glare, a headlight, and a vehicle including the same. The light emitting device comprises: a light emitting element having a light emission peak wavelength in a range of 400 nm or more and 490 nm or less; and a wavelength conversion member including a first fluorescent material having a light emission peak wavelength in a range of 480 nm or more and less than 580 nm and a second fluorescent material having a light emission peak wavelength in a range of 580 nm or more and 680 nm or less and having a composition different from that of the first fluorescent material, wherein the light emitting device emits light having a first luminance ratio Ls/L that is 0.

Abstract: A rare earth aluminate sintered compact including rare earth aluminate phosphor crystalline phases and voids, wherein an absolute maximum length of 90% or more by number of rare earth aluminate phosphor crystalline phases is in a range from 0.4 ?m to 1.3 ?m, and an absolute maximum length of 90% or more by number of voids is in a range from 0.1 ?m to 1.2 ?m.

Abstract: A light-emitting device includes a substrate comprising a base member, a first wiring, a second wiring, and a via hole; at least one light-emitting element electrically connected to and disposed on the first wiring; and a covering member having light reflectivity and covering a lateral surface of the light-emitting element and a front surface of the substrate. The base member defines a plurality of depressed portions separated from the via hole in a front view and opening on a back surface and a bottom surface of the base member. The substrate includes a third wiring covering at least one of inner walls of the plurality of depressed portions and electrically connected to the second wiring. A depth of each of the plurality of depressed portions defined from the back surface toward the front surface is larger on a bottom surface side than on an upper surface side of the base member.

Abstract: An LED light source includes a board, a holder, an LED, a fastener, a lens, a supporter, and an adhesive. The board has a first surface. The holder is arranged on or above the first surface. The LED is arranged on or above the first surface. The fastener fastens the LED to the first surface. The lens has an exterior shape larger than the LED as viewed in a plan view, and is arranged on or above an LED upper surface to refract LED light so as to direct the light outward. The supporter is arranged on an exterior with respect to the LED as viewed in a plan view on a lens surface facing the first surface. The supporter is held by the holder for positioning of the lens at a predetermined position on the first surface. The adhesive bonds the supporter and the board together.

Abstract: A method for manufacturing a circuit board includes: preparing a first substrate and a second substrate, wherein: the first substrate comprises a convex post member formed at a top surface of the first substrate, and the second substrate including a first surface and a second surface opposite to the first surface, and comprising: a first metal layer formed on at least the first surface, and an opening through which a top surface of the post member is uncovered in a plan view; bonding at least a portion of a top surface of the first substrate excluding the post member and the second surface of the second substrate so that the top surface of the post member is uncovered through the opening; and forming a circuit pattern by removing a first portion of the first metal layer.