Patents Assigned to Nichia Corporation
  • Patent number: 11962121
    Abstract: A light emitting device includes a semiconductor laser element, a base member, and a cover. The base member includes a first alignment mark, a second alignment mark, a third alignment mark, and a fourth alignment mark. The base member has a disposition surface on which the semiconductor laser element is disposed. The cover is bonded to the base member to define a closed space in which the semiconductor laser element is arranged. The first alignment mark and the second alignment mark are arranged outside the closed space. The third alignment mark and the fourth alignment mark are arranged inside the closed space. A straight line connecting the first alignment mark and the second alignment mark is parallel to a straight line connecting the third alignment mark and the fourth alignment mark.
    Type: Grant
    Filed: April 18, 2023
    Date of Patent: April 16, 2024
    Assignee: NICHIA CORPORATION
    Inventors: Tadayuki Kitajima, Tomokazu Taji
  • Patent number: 11955768
    Abstract: A light-emitting device includes: a base including: a mount surface, and a lateral wall located around the mount surface, the lateral wall including: a pair of first protrusions located opposite to each other in a first direction which is parallel to a side of the mount surface, and a pair of second protrusions located opposite to each other in a second direction which is perpendicular to the first direction, the second protrusions being provided lower than the first protrusions; one or more light-emitting elements mounted on the mount surface of the base; a first light-transmissive member sealing a space in which the one or more light-emitting elements are mounted; and one or more wires connecting to the one or more light-emitting elements, the one or more wires being bonded on conduction regions provided on at least one of upper surfaces of the second protrusions.
    Type: Grant
    Filed: March 14, 2023
    Date of Patent: April 9, 2024
    Assignee: NICHIA CORPORATION
    Inventor: Kiyoshi Enomoto
  • Patent number: 11956870
    Abstract: A light source device that supplies a constant current to a diode load that includes a plurality of light-emitting elements connected in series. The light source device includes a power supply circuit connected to the diode load and a peak current limiting circuit connected in series to the diode load. The peak current limiting circuit includes a current detector that is connected in series to the diode load and a current-regulating circuit that controls a current to the diode load by a detection voltage of the current detector. Further, the current detector has a series circuit including a resistor and a coil.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: April 9, 2024
    Assignee: NICHIA CORPORATION
    Inventors: Daisuke Mori, Hironobu Shibata, Ryosuke Mori, Masaki Omori, Hideki Kondo
  • Patent number: 11955466
    Abstract: A light emitting device includes a package for surface mounting, the package including at least three leads defining a first recess, a second recess, and a third recess. A first light emitting element is disposed in the first recess and emits first light, a second light emitting element is disposed in the second recess and emits second light, and a third light emitting element is disposed in the third recess and emits third light. A first colored resin member is disposed in the first recess, a second colored resin member is disposed in the second recess, and a third colored resin member is disposed in the third. A mold resin including a first lens portion, a second lens portion, and a third lens portion each overlapping a recess of a respective one of the plurality of leads.
    Type: Grant
    Filed: August 24, 2021
    Date of Patent: April 9, 2024
    Assignee: NICHIA CORPORATION
    Inventor: Yoshio Ichihara
  • Publication number: 20240113492
    Abstract: A light-emitting device includes a semiconductor laser element, a wavelength conversion member, and a package. The wavelength conversion member includes a wavelength conversion portion and a reflective portion. The wavelength conversion portion includes a light incident surface and a light-emitting surface. The package includes a disposition region. The wavelength conversion member is disposed at a position away in a first direction from a position at which the semiconductor laser element is disposed. The light-emitting surface has a shape that, in a plan view perpendicular to the light-emitting surface, has a first region decreasing in width in a second direction perpendicular to the first direction from the side closest to the semiconductor laser element toward the first direction.
    Type: Application
    Filed: September 22, 2023
    Publication date: April 4, 2024
    Applicant: NICHIA CORPORATION
    Inventors: Tadayuki KITAJIMA, Soichiro MIURA, Munetake FUKUNAGA, Yusuke MORI
  • Publication number: 20240113503
    Abstract: A light-emitting device includes a semiconductor laser element, a wavelength conversion member, and a package. The wavelength conversion member includes a wavelength conversion portion and a reflective portion as in the specification. The wavelength conversion portion includes a light incident surface and a light-emitting surface as in the specification. The package includes a disposition region as in the specification. The wavelength conversion member is disposed at a position away in a first direction from a position at which the semiconductor laser element is disposed. In a plan view perpendicular to the light-emitting surface, the light-emitting surface has a shape that has a first region as in the specification, and a region of at least 80% or more of the light incident surface overlaps an imaginary line that passes through a point of the light-emitting surface closest to the semiconductor laser element and that is parallel to the second direction.
    Type: Application
    Filed: September 22, 2023
    Publication date: April 4, 2024
    Applicant: NICHIA CORPORATION
    Inventor: Soichiro MIURA
  • Publication number: 20240111204
    Abstract: A light emitting module according to an embodiment of the present disclosure includes a light source, a lens disposed over the light source and configured to transmit light from the light source, and a cover member disposed over the lens, wherein the cover member includes, in a top view, a first region, a second region located around the first region and having a higher light diffusion effect than the first region, and a third region located inward of the first region and on which the light from the light source transmitted through the lens is incident.
    Type: Application
    Filed: September 11, 2023
    Publication date: April 4, 2024
    Applicant: NICHIA CORPORATION
    Inventor: Tsuyoshi OKAHISA
  • Publication number: 20240112857
    Abstract: A method of preparing an anisotropic magnetic powder compression molded product, the method including: compressing a magnetic powder in a mold using a compression punch while magnetically orienting the magnetic powder to obtain a compressed magnetic powder, wherein the compression punch has a contact surface with the magnetic powder that is not perpendicular to a compression direction; and compression molding the compressed magnetic powder using a molding punch having a different shape from the compression punch.
    Type: Application
    Filed: September 29, 2023
    Publication date: April 4, 2024
    Applicant: NICHIA CORPORATION
    Inventors: Takashi ASADA, Shuichi TADA
  • Publication number: 20240113253
    Abstract: A method of manufacturing a light emitting element includes: an n-side nitride semiconductor layer growing process in which an n-side nitride semiconductor layer is grown; an active layer growing process in which an active layer comprising a plurality of nitride semiconductor well layers and a plurality of nitride semiconductor barrier layers is grown on the n-side nitride semiconductor layer, wherein the active layer is configured to emit ultraviolet light; and a p-side nitride semiconductor layer growing process in which a A-side nitride semiconductor layer is grown on the active layer. The active layer growing process includes: a first barrier layer growing process, a second barrier layer growing process, and a well layer growing process.
    Type: Application
    Filed: November 30, 2023
    Publication date: April 4, 2024
    Applicant: NICHIA CORPORATION
    Inventor: Hiroki KONDO
  • Publication number: 20240112838
    Abstract: A method of producing a phosphate-coated SmFeN-based anisotropic magnetic powder, the method including stirring a slurry containing a raw material SmFeN-based anisotropic magnetic powder, water, a phosphate source, and an aluminum source to obtain a SmFeN-based anisotropic magnetic powder having a surface coated with a phosphate.
    Type: Application
    Filed: September 29, 2023
    Publication date: April 4, 2024
    Applicant: NICHIA CORPORATION
    Inventors: Masahiro ABE, Shuichi TADA, Satoshi YAMANAKA, Kenta IWAI
  • Publication number: 20240113263
    Abstract: A light-emitting device includes a light-emitting element a semiconductor structure body including an n-side layer, a p-side layer, and an active layer, the n-side layer including an n-side exposed surface exposed from the active layer and the p-side layer in a plan view. The semiconductor structure body includes a side surface connecting the n-side exposed surface and an upper surface of the p-side layer. An insulating film includes a first opening exposing the n-side exposed surface, and a second opening positioned above the upper surface of the p-side layer. An n-side electrode includes a first part positioned above the upper surface of the p-side layer with the insulating film interposed, a second part electrically connected with the n-side exposed surface in the first opening and electrically connected with the first part located at the insulating film covering the side surface, and a third opening that exposes the insulating film covering the side surface of the semiconductor structure body.
    Type: Application
    Filed: September 13, 2023
    Publication date: April 4, 2024
    Applicant: NICHIA CORPORATION
    Inventor: Yoshiyuki AIHARA
  • Patent number: 11945173
    Abstract: A method for processing a resin member includes: irradiating a first member comprising a resin with first light of a first wavelength that causes electronic excitation of the resin; and irradiating the resin electronically excited through irradiation with the first light with second light of a second wavelength longer than the first wavelength. A wavelength range of the second wavelength is within a wavelength range in which light absorption of the resin increases through electronic excitation of the resin.
    Type: Grant
    Filed: June 23, 2022
    Date of Patent: April 2, 2024
    Assignees: LASER SYSTEMS INC., NICHIA CORPORATION
    Inventors: Yuichi Asakawa, Yasuyuki Tsuboi, Hiroaki Tamemoto, Ryota Taoka, Minoru Yamamoto
  • Patent number: 11945729
    Abstract: A method for producing a nickel cobalt complex hydroxide includes first crystallization of supplying a solution containing Ni, Co and Mn, a complex ion forming agent and a basic solution separately and simultaneously to one reaction vessel to obtain nickel cobalt complex hydroxide particles, and a second crystallization of, after the first crystallization, further supplying a solution containing nickel, cobalt, and manganese, a solution of a complex ion forming agent, a basic solution, and a solution containing said element M separately and simultaneously to the reaction vessel to crystallize a complex hydroxide particles containing nickel, cobalt, manganese and said element M on the nickel cobalt complex hydroxide particles crystallizing a complex hydroxide particles comprising Ni, Co, Mn and the element M on the nickel cobalt complex hydroxide particles.
    Type: Grant
    Filed: December 3, 2021
    Date of Patent: April 2, 2024
    Assignee: NICHIA CORPORATION
    Inventors: Hideki Yoshida, Masato Sonoo, Takahiro Kitagawa
  • Patent number: 11947245
    Abstract: A light-emitting device includes: a plurality of light-emitting elements arranged in an array on a base member; and a lens that comprises at least four Fresnel lenses disposed above the base member and facing the plurality of light-emitting elements. In a top plan view, a center of each of the plurality of light-emitting elements is offset from a lens center of the corresponding one of the Fresnel lenses of the lens in a direction toward a center of the lens. The plurality of light-emitting elements include at least two first light-emitting elements and at least two second light-emitting elements, wherein an emission color of the first light-emitting elements is different from an emission color of the second light-emitting elements.
    Type: Grant
    Filed: October 7, 2022
    Date of Patent: April 2, 2024
    Assignee: NICHIA CORPORATION
    Inventors: Tsuyoshi Okahisa, Shinya Matsuoka
  • Patent number: 11949209
    Abstract: A semiconductor device includes: a package including: a heat dissipating body comprising a metal, an insulting part surrounding the heat dissipating body, one or more semiconductor laser elements disposed on the heat dissipating body, at least one outer metal layer that is located on a lower surface of the insulting part and is spaced from a lower surface of the heat dissipating body; a mounting substrate including: at least one first metal pattern located at an upper surface of the mounting substrate, and a second metal pattern located at the upper surface of the mounting substrate; at least one first bonding member located between the at least one outer metal layer and the first metal pattern; and a second bonding member located between the lower surface of the heat dissipating body and the second metal pattern, wherein the second bonding member comprises a metal material.
    Type: Grant
    Filed: January 13, 2023
    Date of Patent: April 2, 2024
    Assignee: NICHIA CORPORATION
    Inventors: Shohei Itonaga, Eiichiro Okahisa
  • Patent number: 11946637
    Abstract: A light source device includes: a combined body including light emitting portions including: a first light emitting portion including a first light emitting element, and a second light emitting portion provided separately from and along an outer periphery of the first light emitting portion in a plan view, the second light emitting portion including a plurality of second light emitting elements; and a lens disposed above the combined body. The first light emitting element and the plurality of second light emitting elements are arrayed in first and second directions that are perpendicular to each other. The first light emitting element and the plurality of second light emitting elements are controllable to be lit independently.
    Type: Grant
    Filed: April 5, 2022
    Date of Patent: April 2, 2024
    Assignee: NICHIA CORPORATION
    Inventors: Norimasa Yoshida, Shinya Matsuoka, Yuta Oka
  • Patent number: 11948925
    Abstract: A light emitting device includes a substrate including first, second, third and fourth wiring portions on a top surface of a base member and arrayed in a first direction, and a connection wiring portion connecting the second and third wiring portions. The connection wiring portion includes first and second connection ends respectively connected with the second and third wiring portions, and a connection central portion connecting the first and second connection ends and having a maximum width in a second direction different from each of a maximum width of the first connection end and a maximum width of the second connection end. In the second direction, at least a part of the connection wiring portion has a width narrower than each of a maximum width of the second wiring portion and a maximum width of the third wiring portion.
    Type: Grant
    Filed: October 4, 2022
    Date of Patent: April 2, 2024
    Assignee: NICHIA CORPORATION
    Inventors: Takuya Nakabayashi, Tadaaki Ikeda, Tetsuya Ishikawa
  • Publication number: 20240105891
    Abstract: A method of manufacturing a light emitting device includes providing an intermediate body having a light emitting element, a bottom part on which the light emitting element is disposed, and a first wall disposed on the bottom part and surrounding the light emitting element apart from a lateral face of the light emitting element. The method further includes disposing a light transmissive member having a height in excess of the height of the first wall and covering the upper face of the first wall and the light emitting element, forming a first groove by removing a portion of the light transmissive member thereby exposing at least a portion of the upper face of the first wall, forming a second wall by disposing a first resin in the first groove, and cutting the second wall along a lengthwise direction of the first groove thereby obtaining the light emitting device.
    Type: Application
    Filed: September 21, 2023
    Publication date: March 28, 2024
    Applicant: NICHIA CORPORATION
    Inventor: Takehiro NISHIMORI
  • Publication number: 20240105110
    Abstract: A display driving circuit drives a display unit including a plurality of light-emitting elements connected along respective common lines and arranged in a matrix. The driving circuit includes one or more element drivers for driving the plurality of light-emitting elements of the display unit, a memory that stores lighting period information indicating a lighting period in which each light-emitting element is lit by the one or more element drivers, an element lighting period controller that outputs the lighting period information stored in the memory to each element driver, a switching unit that selects each common line based on the lighting period information stored in the memory, and a common line lighting period controller that is interposed between the memory and the switching unit and controls a lighting period in which each common line is activated according to the lighting period information.
    Type: Application
    Filed: September 14, 2023
    Publication date: March 28, 2024
    Applicant: NICHIA CORPORATION
    Inventor: Yasuo HIGASHIDANI
  • Publication number: 20240105459
    Abstract: A method for manufacturing a semiconductor element includes preparing a semiconductor structure body that includes a p-side layer and an n-side layer; forming a first carbon film on the p-side layer by vapor deposition, the vapor deposition utilizing carbon ions generated by an arc discharge without introducing a gas to a discharge space, the discharge space being a vacuum; forming a second carbon film on the n-side layer by the vapor deposition; removing the first carbon film; and removing the second carbon film. A first bias voltage of the forming during the first carbon film on the p-side layer is higher than a second bias voltage of the forming during the second carbon film on the n-side layer.
    Type: Application
    Filed: September 15, 2023
    Publication date: March 28, 2024
    Applicant: NICHIA CORPORATION
    Inventor: Naoki MUSASHI