Abstract: Provided is a method of manufacturing a light emitting module, the method including: providing a light guiding plate having a first main surface serving as a lighting surface, and a second main surface opposite to the first main surface, the second main surface defining a recess thereon, preparing a light emitting element unit by attaching a wavelength conversion portion to a light emitting element having electrodes and a light emitting surface; providing a light diffusion portion at a bottom of the recess; depositing the light emitting element unit onto the light diffusion portion in the recess; and forming a terminal having an electrical conductivity on the electrodes of the light emitting element.
Abstract: A light source module includes a light-emitting device having an upper surface and a lower surface and including: at least one light-emitting element and a plurality of conductive regions on the upper surface of the light-emitting device; a mounting substrate having an upper surface on which a lower surface side of the light-emitting device is located, the mounting substrate including conductive patterns on the upper surface of the mounting substrate, each conductive pattern including a device-side connecting portion and an external side connecting portion; and a plurality of conductive members each having a first end bonded to a respective one of the device-side connecting portion and a second end opposite to the first end, the second end being in contact with a respective one of the conductive region by elasticity to electrically connect the respective one of the conductive regions and a respective one of the conductive patterns.
Abstract: Provided is a method for producing a wavelength conversion sintered body that emits light under irradiation of excitation light. The method for producing a wavelength conversion sintered body includes: preparing a molded body obtained by molding a mixture containing an ?-SiAlON fluorescent material and aluminum oxide particles and having a content of Ga of 15 ppm by mass or less; and primary calcining the molded body at a temperature in a range of 1,370° C. or more and 1,600° C. or less to obtain a first sintered body.
Abstract: A light emitting device includes a resin package having a rectangular shape in a top view and two short-side lateral surfaces and two long-side lateral surfaces. The two short-side lateral surfaces include a first external surface and a second external surface located on an opposite side from the first external surface. The two long-side lateral surfaces include a third external surface and a fourth external lateral surface located on an opposite side from the third external lateral surface. The lead is not exposed on the third external lateral surface nor the fourth external lateral surface. The first lead is exposed at the first external lateral surface and the second external lateral surface, respectively flush with the resin member at the first external lateral surface and the second external lateral surface. The second lead is exposed at the second external lateral surface, flush with the resin part at the second external lateral surface.
Abstract: A semiconductor device manufacturing method includes: (A) orienting an upper surface of a semiconductor element which has the upper surface and a suction surface of a collet which has a suction hole so that the upper surface of the semiconductor device and the suction surface of the collet face each other, the upper surface including a first region and a second region, the second region lying higher than the first region; (B) bringing the suction surface of the collet into contact with a part of the second region of the semiconductor element; and (C) picking up the semiconductor element using the collet while the collet sucks in air between the first region and the suction surface via the suction hole, wherein in (B), an entirety of an uppermost surface of the second region is in contact with a region of the suction surface exclusive of the suction hole.
Abstract: An object is to promote a reduction in thickness of a light guide plate and suppress brightness non-uniformity of the light guide plate. A light guide plate, including: a light exit surface from which light is emitted; an opposite surface on an opposite side of the light exit surface; a depressed portion provided on the opposite surface; and a plurality of scattering portions which are provided on the light exit surface, the opposite surface, and a bottom surface of the depressed portion and which refract and scatter light, wherein the depressed portion has a tapered surface which spreads from the bottom surface of the depressed portion toward an opening of the depressed portion.
Abstract: A light-emitting device includes: a light-emitting element; a first light-transmissive member located on an upper surface of the light-emitting element and containing substantially no phosphor; a second light-transmissive member located on an upper surface of the first light-transmissive member and containing a first phosphor; and a third light-transmissive member covering an upper surface of the second light-transmissive member and a lateral surface of the light-emitting element and containing a second phosphor. A refractive index of a resin material serving as a base material of the second light-transmissive member is higher than a refractive index of a resin material serving as a base material of the first light-transmissive member. A refractive index of a resin material serving as a base material of the third light-transmissive member is equal to or higher than the refractive index of the resin material serving as the base material of the second light-transmissive member.
Abstract: A package includes a first lead, a first molded body, a second lead, and a second molded body. The first lead includes a first portion which has a first recess portion or a first through hole passing through the first portion. The second lead is provided on the first lead to be bonded to the first lead such that a bonding side surface faces to the first lead. The second lead includes a second portion which overlaps with the first portion and which has a second recess portion on the bonding side surface or a second through hole passing through the second portion. The second recess portion communicates with the first through hole. The second through hole communicates with the first recess portion. The second molded body fills the first through hole and the second recess portion, or fills the first recess portion and the second through hole.
Abstract: A light emitting module includes: a light emitting element unit including: a light-emitting element that has a main-light-emission surface, an electrode-formation surface and a side-surface, a light-transmissive member that covers the main-light-emission surface, and a first light-reflection member that covers the side-surface; a light-transmissive light guide plate including a first main-surface as a light emission surface, and a second main-surface opposed to the first main-surface and has a recess accommodating the light emitting element unit so that the first light-reflection member is partially arranged out of the recess in a cross-section; a light-transmissive interposition member that contacts an interior side-surface of the recess and an exterior side-surface of the light emitting element unit; and a second light-reflection member that partially covers the second main-surface and the interposition member.
Abstract: A light emitting device includes a first substrate including a flexible first base member and a first wiring pattern provided on the first base member; a second substrate including a second base member and a second wiring pattern provided on the second base member; and a plurality of light emitting elements mounted on the first wiring pattern. The first substrate includes: a joining end portion that is located at a first, joining end of the first substrate, and that overlaps a portion of the second substrate, and a second end, other than the joining end, that does not overlap the second substrate. The first wiring pattern and the second wiring pattern do not face each other. An electrically conductive joining member is disposed across the first wiring pattern and the second wiring pattern, while partially covering the joining end portion of the first substrate.
Abstract: A light emitting device includes a base having a conductor wiring, at least one light emitting element mounted on the base and electrically connected to the conductor wiring, and a light transmissive sealing member. The light transmissive sealing member includes a light diffusion material. The light transmissive sealing member covers the at least one light emitting element. The light transmissive sealing member has a projection shape. The projection shape has a substantially circular bottom surface facing the base and a height in a light axis direction of the at least one light emitting element. The height is greater than a diameter of the substantially circular bottom surface. The light transmissive sealing member has a maximum length when the light transmissive sealing member is viewed from the light axis direction. The diameter of the substantially circular bottom surface is smaller than the maximum length of the light transmissive sealing member.
Abstract: A package includes a first electrode and a second electrode that are located at a bottom portion of a bottomed recess, and a first resin securing the first electrode and the second electrode in place and forming a part of the bottomed recess. The first electrode has a first outer lead having a first indentation at a tip in a plan view. The second electrode has a second outer lead having a second indentation at a tip in a plan view. The first resin has at least a portion between the first electrode and the second electrode located at the bottom portion of the bottomed recess, wall portions structuring lateral walls of the bottomed recess, and flange portions having the same thickness as a thickness of the first outer lead and different outward widths from the wall portions on both sides of the first outer lead in a plan view.
Abstract: A light source device includes: a light-shielding member defining an opening; a light-guide member located in the opening in a top view and including two or more divided lens portions; and a plurality of light-emitting parts disposed such that each of the plurality of light-emitting parts corresponds to a respective one of the lens portions, each of the plurality of light-emitting parts being configured to be individually turned on. Each of the light-emitting parts has an upper surface serving as a light-emitting surface. The two or more lens portions are Fresnel lenses. Irradiation areas corresponding to the light-emitting parts are at least partially different from each other.
Abstract: A light emitting device includes a light emitting element having an emission peak wavelength in a range of 380 nm to 420 nm and a fluorescent member including at least one fluorescent material that is excited by light from the light emitting element for light emission, wherein a mixture of light from the light emitting element and light from the fluorescent material has a correlated color temperature in a range of 2000 K to 7500 K as measured according to JIS Z8725, and the light emitting device has a spectral distribution in which, when the integral value over a wavelength range of 380 nm to 780 nm is normalized to 100%, the proportion of an integral value over a wavelength range of 380 nm to 420 nm is 15% or more, and the ratio a as defined by the expression (1) is 0.9 or more and 1.6 or less.
Abstract: A light emitting device includes: a light emitting element that comprises a first electrode and a second electrode located at a lower surface of the light emitting element; a covering member that covers the light emitting element such that at least a portion of a lower surface of each of the first electrode and the second electrode is exposed from a lower surface of the covering member; and first and second metal layers, each of which covers and contacts the exposed portion of the lower surface of a respective one of the first and second electrodes. In a bottom view, the first electrode has a shape with at least one recess on a first side facing to the second electrode, a portion of a lower surface of the covering member being exposed from the recess of the first metal layer.
Abstract: A light-emitting device includes a light-emitting element that includes a semiconductor structure including a first semiconductor layer, a second semiconductor layer, and a light-emitting layer therebetween and is configured to emit first light from an upper surface of the first semiconductor layer; a protective film over the upper surface of the first semiconductor layer; a light-transmissive resin layer disposed in contact with the protective film; and a wavelength conversion layer facing the upper surface of the first semiconductor layer over the protective film and the light-transmissive resin layer, the upper surface of the first semiconductor layer having first projections and a flat portion, an upper surface of the protective film having second projections above the first projections. In a cross-sectional view a void is located above the flat portion and between the protective film and the light-transmissive resin layer.
Abstract: A method includes preparing a wafer including a substrate and a semiconductor structure, and irradiating an inner portion of the substrate at a predetermined depth in a thickness direction a plurality of times with laser pulses at a first time interval and a predetermined distance interval between irradiations. Each irradiation performed at the first time intervals in the step of irradiating the substrate with laser pulses includes irradiating the substrate at a first focal position in the thickness direction with a first laser pulse having a first pulse-energy; and after irradiating with the first laser pulse, irradiating the substrate with a second laser pulse performed after a second time interval, the second time interval being shorter than the first time interval and being in a range of 3 ps to 900 ps, and the second laser pulse having a second pulse-energy 0.5 to 1.5 times the first pulse-energy.
November 26, 2018
November 19, 2020
NICHIA CORPORATION, IMRA AMERICA, INC.
Abstract: A method for manufacturing a light-transmissive member includes: providing a supporting member, and a light-transmissive sheet disposed on the supporting member, the light-transmissive sheet including: a first layer containing substantially no phosphor, and a second layer containing a phosphor; and forming a plurality of light-transmissive members from the light-transmissive sheet by dividing the light-transmissive sheet with a blade over the supporting member, such that each light-transmissive member includes: a first portion formed by separation of the first layer by a first crevice, the first portion containing substantially no phosphor, and a second portion formed by separation of the second layer by a second crevice, the second portion containing a phosphor, wherein one of the first portion and the second portion is layered on the other of the first portion and the second portion.
Abstract: A method for manufacturing a light emitting device, includes: providing a reflective film; providing a light emitting element having a semiconductor stacked layer and electrodes formed at a first main surface side of the light emitting element; pressing the reflective film on the first main surface side to deform the reflective film, and disposing the reflective film on at least a side surface of the light emitting element; and exposing the electrodes of the light emitting element from the reflective film.
Abstract: A light emitting module and a planar light source reduced in thickness are provided. A light emitting module includes: a light guide plate including a first main surface serving as a light emitting surface, a second main surface provided on a side opposite to the first main surface, and a recess provided at the second main surface; a first fluorescent material layer provided in the recess; a light emitting element provided at the first fluorescent material layer on the second main surface side; and a second fluorescent material layer provided at the second main surface.