Abstract: A method of manufacturing a light-emitting device includes: preparing at least one first structure including a support substrate, an adhesive layer, and light-emitting elements each having a first surface, and a second surface, and comprising a pair of element electrodes disposed on a second surface side; preparing a second structure including a substrate including a base and a plurality of pairs of wirings, and a bonding member disposed between a pair of wirings of the plurality of pairs of wirings; obtaining a third structure by causing the pair of element electrodes to face the pair of wirings and bonding each of light-emitting elements to the substrate with the bonding member interposed therebetween in a state in which the light-emitting elements and the substrate are heated at a first temperature; heating the third structure at a second temperature equal to or higher than the first temperature; and removing the support substrate from the third structure.

Abstract: A nitride semiconductor light emitting element includes: a first n-type semiconductor layer, a first p-type semiconductor layer disposed above and in contact with the first n-type semiconductor layer; a first superlattice layer disposed above the first p-type semiconductor layer and containing a p-type impurity; an active layer disposed above the first superlattice layer, a second n-type semiconductor layer disposed above the active layer; a first electrode electrically connected to the first n-type semiconductor layer; and a second electrode electrically connected to the second n-type semiconductor layer.

Abstract: A method for manufacturing a light-emitting device includes: providing a structure including: a substrate including a plurality of positive and negative wiring parts at an upper surface of the substrate, and a light source part disposed on the substrate, the light source part including: an element substrate, and a plurality of light-emitting parts, each of the light-emitting parts including: a semiconductor structure including a first surface facing the element substrate and a second surface positioned at a side opposite to the first surface, and positive and negative electrode parts disposed on the second surface of the semiconductor structure; providing a mold including an upper mold and a lower mold; disposing a first resin part between the upper surface of the substrate and the second surfaces of the semiconductor structures; and removing the element substrate from the light source part.

Abstract: A method of producing a substrate includes: providing a ceramic substrate having a first surface and a second surface that is located opposite the first surface; irradiating a first part of the first surface with a first laser light having a first pulse width to perform ablation of the first part of the ceramic substrate; and irradiating a second part of either the first surface or the second surface with a second laser light having a second pulse width, which is longer than the first pulse width, the second part being located apart from the first part in a plan view to perform thermal processing of a third part including the first part and the second part. Upon removal of the third part and a part enclosed by the third part, an aperture that extends from the first surface to the second surface is formed in the ceramic substrate.

Abstract: A method of manufacturing a light-emitting device includes: providing a substrate including a base, and a pair of wiring parts disposed on an upper surface side of the base; providing a light-emitting element including a semiconductor structure, and a pair of electrodes; disposing the light-emitting element above the substrate such that the electrodes face the wiring parts; disposing an electrically-conductive member containing copper such that the electrically-conductive member electrically connects the wiring parts to the electrodes and includes a body portion and a protruding portion, the body portion overlapping a corresponding wiring part of the wiring parts in a top view, and the protruding portion protruding outward such that a gap is located between the protruding portion and the base; and disposing a protective film at least in the gap in a state in which the gap is widened by heating the electrically-conductive member.

Abstract: A ?-SiAlON fluorescent material includes fluorescent material particles having a composition represented by the following formula (I), and a coating layer formed on the surface of the fluorescent material particles and having a refractive index smaller than that of the fluorescent material particles, wherein when the ?-SiAlON fluorescent material is measured by inductively coupled plasma-atomic emission spectroscopy, an amount of the coating layer is 0.4% by mass or more relative to a total amount of the fluorescent material particles and the coating layer being 100% by mass: Si6-zAlzOzN8-z:Euy??(I), wherein y and z satisfy 0<y?1.0 and 0<z?4.2.

Abstract: A method of producing a composite substrate includes: providing a layered body including: a base layer formed of a composite material containing diamond and a metal, the base layer having a first surface, and a second surface opposite to the first surface, and a flat layer having a lower surface bonded to the first surface of the base layer, and an upper surface having a surface roughness Ra of 10 nm or less; and directly bonding an insulating layer to the upper surface of the flat layer.

Abstract: A light transmissive member, a light source device, a method of producing a light transmissive member, and a method of producing a light source device, which can suppress occurrence of damage, are provided. The light transmissive member includes a light transmissive base member having a first surface and a second surface positioned on a side opposite to the first surface, a light transmissive first film covering the first surface, a light transmissive second film covering the second surface, and a light transmissive third film provided over the second film. The first film contains hydrous alumina. The second film contains aluminum oxide having a crystallinity lower than that of ?-alumina. Hardness of the third film is higher than hardness of the second film.

Abstract: A light-emitting device includes: a substrate; a plurality of light-emitting elements on or above the substrate, each of the light-emitting elements having an upper surface serving as a light-emitting surface and having a rectangular shape in a plan view from above the light-emitting device; and a plurality of light-transmissive members each having a rectangular shape in a plan view from above the light-emitting device and having a lower surface that faces the upper surface of each light-emitting element;

Abstract: A light-emitting module includes: a light source; a lens located over the light source and configured to transmit light from the light source; and a cover member located over the lens and having a lower surface on which the light is to be incident and an upper surface from which the light is to be emitted, where the lower surface of the cover member includes: a first region on which the light from the light source after being transmitted through the lens is to be incident, and a second region located around the first region, a light diffusivity of the second region being higher than a light diffusivity of the first region; and a light-transmissive member covering the upper surface of the cover member and having a higher hardness than a hardness of the cover member.

Abstract: A light emitting element includes: a semiconductor structure including: a first semiconductor layer that has: a first face that has a peripheral region, and a central region surrounded by the peripheral region in a plan view, wherein a surface roughness of the central region is higher than a surface roughness of the peripheral region, and a second face that opposes the first face and has a first region and a second region, an active layer disposed on the first region, and a second semiconductor layer disposed on the active layer; a first electrode disposed on the second region and electrically connected to the first semiconductor layer; a second electrode disposed on the second semiconductor layer and electrically connected to the second semiconductor layer; a first reflecting film disposed only on the peripheral region among the surfaces of the semiconductor structure; and a first protective film disposed on the central region.

Abstract: A positive electrode active material for a nonaqueous electrolyte secondary battery includes particles of a lithium-transition metal composite oxide that contains nickel in the composition thereof and has a layered structure. The particles have an average particle size DSEM based on electron microscopic observation in a range of 1 ?m to 7 ?m in which a ratio D50/DSEM of a 50% particle size D50 in volume-based cumulative particle size distribution to the average particle size based on electron microscopic observation is in a range of 1 to 4, and a ratio D90/D10 of a 90% particle size D90 to a 10% particle size D10 in volume-based cumulative particle size distribution is 4 or less.

Abstract: A substrate includes a first member having a through hole extending from an upper surface to a lower surface thereof, and a second member disposed inside the through hole. The second member includes a first region containing graphite, a second region located outward of the first region in a top view, containing graphite and a thermally conductive material that contains at least one of a metal or a ceramic, and having a volume fraction of the graphite lower than a volume fraction of the graphite in the first region, and a third region located outward of the second region in the top view, containing a thermally conductive material that contains at least one of a metal or a ceramic, and having a volume fraction of the thermally conductive material higher than a volume fraction of the thermally conductive material in the second region.

Abstract: A light-emitting device according to an embodiment of the present disclosure includes: a light-emitting element; a base having an upper surface opposite to a lower surface of the light-emitting element, the base directly or indirectly supporting the light-emitting element; a lid body having a flat plate-like shape and having a lower surface opposite to an upper surface of the light-emitting element; and a first frame portion located on the upper surface of the base and surrounding the light-emitting element, in which the base includes a first conductor portion bonded to the lower surface of the light-emitting element, the lid body includes a second conductor portion bonded to the upper surface of the light-emitting element, and the first frame portion is directly or indirectly bonded to the lid body.

Abstract: A wiring substrate includes a ceramic substrate having an upper surface, a lower surface, and a lateral surface. The lower surface includes a first lower surface and a second lower surface inward from the first lower surface. The lateral surface includes a first lateral surface and a second lateral surface inward from the first lateral surface. The wiring substrate includes a first wiring having a thickness of 80% or more of a height from the second lower surface to the first lower surface and disposed in contact with the second lower surface and the second lateral surface. A lateral surface of the first wiring is exposed from the first lateral surface. A main surface of 50% or more of a surface area of a lower surface of the first wiring is substantially parallel to the second lower surface and is disposed inward from the first lower surface.

Abstract: A method for manufacturing an image display device includes: providing a semiconductor growth substrate comprising a semiconductor layer on a first substrate, the semiconductor layer comprising a light-emitting layer; providing a second substrate comprising a circuit, wherein the circuit comprises a circuit element; forming a light-shielding layer on the second substrate; forming an insulating film on the light-shielding layer; bonding the semiconductor layer to the second substrate on which the insulating film is formed; forming a light-emitting element by etching the semiconductor layer; forming an insulating layer that covers the light-emitting element; and electrically connecting the light-emitting element to the circuit element. The light-shielding layer is located between the light-emitting element and the circuit element. In a plan view, the light-shielding layer covers the circuit element.

Abstract: A light-emitting device includes a wiring substrate, a reflecting member positioned at an upper side of the wiring substrate, a light source positioned at an upper side of the reflecting member, and a bonding member; the wiring substrate includes a first wiring part and a second wiring part at an upper surface of the wiring substrate; the reflecting member has a first through-hole including a first inclined surface spreading upward; the light source includes a first electrode and a second electrode; the bonding member includes a first conductive part and a resin part; the first conductive part is positioned in the first through-hole and electrically connects the first wiring part and the first electrode; and the resin part contacts the first inclined surface, the light source, and the first conductive part.

Abstract: A light source unit includes: a display device configured to emit light that has a substantially Lambertian light distribution and to display an image including a plurality of pixels; a color change sheet on which light emitted from the display device is incident; an imaging optical system including an input element and an output element configured such that light emitted from the color change sheet is incident on the input element, light traveling via the input element is incident on the output element, and light emitted from the output element forms a first image corresponding to the image; and a drive unit configured to change a positional relationship of the display device and the color change sheet.

Abstract: A light-emitting module includes: a first light source unit including: a first light source, and a first lens on which light emitted from the first light source is incident; a driver configured to rotate the first lens; and a controller configured to, conjunctively with the driver, control an output of the first light source. A central axis of light emitted from the first lens is oblique to a rotation axis of the first lens. The controller is configured to control the output of the first light source according to a position along a trajectory of the central axis of the light emitted from the first lens.

Abstract: A light source includes a plurality of light-transmissive members and a plurality of light emitting elements. Upper surfaces of the light-transmissive members are flush with each other. The light-transmissive members include a plurality of first light-transmissive members arranged to form a rectangular shape as a whole in a plan view, and a plurality of second light-transmissive members arranged in a rectangular frame shape as a whole surrounding the first light-transmissive members in the plan view. Each of the second light-transmissive members is smaller than each of the first light-transmissive members in the plan view. The light emitting elements are arranged under the first light-transmissive members with none of the light emitting elements being arranged under the second light-transmissive members.