Patents Assigned to Nihon Denshizairyo Kabushiki Kaisha
  • Patent number: 7307435
    Abstract: A probe card includes a main substrate, a main reinforcing plate attached to the upper surface of the main substrate, a sub-reinforcing plate attached to the upper surface of the main reinforcing plate, and coupling force adjusting means that couples the main reinforcing plate with the sub-reinforcing plate and adjusts the coupling force therebetween. The coupling force adjusting means has a plurality of threaded holes provided at intersections of a plurality of imaginary concentric circles, which is provided with a distance from a center of a probe card on a surface of the sub-reinforcing plate, and a plurality of imaginary straight lines, which is provided radially from the center at an predetermined angle; a plurality of screw holes provided at same intersections on a surface of the main reinforcing plate; and a plurality of coupling screws threaded selectively into the threaded holes 23a and the screw holes.
    Type: Grant
    Filed: September 20, 2005
    Date of Patent: December 11, 2007
    Assignee: Nihon Denshizairyo Kabushiki Kaisha
    Inventor: Chikaomi Mori
  • Patent number: 7268568
    Abstract: The invention aims to provide a vertical type probe card in which a probe can scrape an oxide film on a surface of an electrode of the measurement object, thereby ensuring stable contact with the electrode of the measurement object.
    Type: Grant
    Filed: September 13, 2005
    Date of Patent: September 11, 2007
    Assignee: Nihon Denshizairyo Kabushiki Kaisha
    Inventors: Kazumichi Machida, Atsuo Urata, Teppei Kimura
  • Patent number: 7208964
    Abstract: It is an object of the present invention to provide an arch type probe capable of enduring a load caused by overdriving even if the probe is miniaturized, and a probe card using the same. An arch type probe 200 has a shape including a first quarter circle arc portion 210 which is supported at one end thereof by the base plate 100 and a second quarter circle arc portion 220 which is connected to the other end of the first quarter circle arc portion 210, extending toward the base plate and a little shorter than the first quarter circle arc portion 221. The top portion of the arch type probe 200 serves as a contact surface brought into contact with an electrode of a semiconductor water B.
    Type: Grant
    Filed: May 5, 2004
    Date of Patent: April 24, 2007
    Assignee: Nihon Denshizairyo Kabushiki Kaisha
    Inventors: Atsushi Mine, Toranosuke Furusho, Kazumichi Machida, Atsuo Urata, Teppei Kimura, Teruhisa Sakata
  • Publication number: 20070052432
    Abstract: The invention aims to provide a vertical type probe card in which a probe can scrape an oxide film on a surface of an electrode of the measurement object, thereby ensuring stable contact with the electrode of the measurement object.
    Type: Application
    Filed: September 13, 2005
    Publication date: March 8, 2007
    Applicant: NIHON DENSHIZAIRYO KABUSHIKI KAISHA
    Inventors: Kazumichi Machida, Atsuo Urata, Teppei Kimura
  • Patent number: 7075319
    Abstract: A probe card including a substrate body, a contactor unit provided below the substrate body for establishing an electrical contact with the subject to be tested as well as for establishing an electrical contact with the substrate body, a supporting device for supporting the contactor unit from below with elastic force and parallelism adjusting screws that come in contact with the contactor unit from above in a vertical direction for adjusting a degree of parallelism of the contactor unit. In particular, the supporting device is configured to include a coil spring interposed toward a vertical direction between a flange section provided at the inside section of the support member arranged below the substrate body and a flange section provided at the outside section of the contactor unit.
    Type: Grant
    Filed: July 21, 2003
    Date of Patent: July 11, 2006
    Assignee: Nihon Denshizairyo Kabushiki Kaisha
    Inventor: Chikaomi Mori
  • Publication number: 20060061375
    Abstract: A probe card includes a main substrate, a main reinforcing plate attached to the upper surface of the main substrate, a sub-reinforcing plate attached to the upper surface of the main reinforcing plate, and coupling force adjusting means that couples the main reinforcing plate with the sub-reinforcing plate and adjusts the coupling force therebetween. The coupling force adjusting means has a plurality of threaded holes provided at intersections of a plurality of imaginary concentric circles, which is provided with a distance from a center of a probe card on a surface of the sub-reinforcing plate, and a plurality of imaginary straight lines, which is provided radially from the center at an predetermined angle; a plurality of screw holes provided at same intersections on a surface of the main reinforcing plate; and a plurality of coupling screws threaded selectively into the threaded holes 23a and the screw holes.
    Type: Application
    Filed: September 20, 2005
    Publication date: March 23, 2006
    Applicant: NIHON DENSHIZAIRYO KABUSHIKI KAISHA
    Inventor: Chikaomi Mori
  • Patent number: 6980013
    Abstract: A probe card including rectilinear probes; a guide base plate having an insulating property, in which a plurality of guide holes are formed through which the probes are inserted in a freely movable manner and a length of a guide hole is shorter than a length of a probe; and a plurality of sheet members having an insulating property, disposed above the guide base plate facing the plate, and laminated one on another with a spacing therebetween so as not to be in contact with one another. The tail ends of some of the probes can be brought into contact with the electrode pads on a lowest sheet member, and the tail ends of the other probes penetrate through the lowest sheet member so as to be enabled to be in contact with electrode pads on other sheet members.
    Type: Grant
    Filed: August 17, 2004
    Date of Patent: December 27, 2005
    Assignee: Nihon Denshizairyo Kabushiki Kaisha
    Inventors: Kazumichi Machida, Atsuo Urata, Teppei Kimura
  • Publication number: 20050184745
    Abstract: An object of the invention is to provide a probe card capable of properly performing a measurement. A probe card according to the invention includes: probes 100 shaped to allow vertical elastic deformation; a supporting substrate 200 with the probes provided on the lower surface thereof; a main substrate 300 positioned opposing the upper surface of the supporting substrate 200; an intermediate substrate 400 disposed between the supporting substrate 200 and main substrate 300; a supporting member 500 that is a column-shaped member with one end thereof attached to the center of the supporting substrate 200 and the other end thereof attached to the intermediate substrate 400 and holds the supporting substrate 200 so that the supporting substrate 200 is inclinable; and elastic members for holding the supporting substrate 200 so that the supporting substrate 200 is in a horizontal position relative to the main substrate 300, which are provided between the supporting substrate 200 and main substrate 300.
    Type: Application
    Filed: February 22, 2005
    Publication date: August 25, 2005
    Applicant: NIHON DENSHIZAIRYO KABUSHIKI KAISHA
    Inventors: Kazumichi Machida, Atsuo Urata, Atsushi Mine
  • Publication number: 20050184743
    Abstract: An object of the present invention is to provide a probe card capable of readily arranging a wiring pattern without forming the through hole while using a silicon substrate as a supporting substrate. The probe card comprises: a supporting substrate 100, one surface of which is formed in a pyramid shape having one step; a plurality of probes 200 arranged on the surface of a thick part of the supporting substrate 100; a plurality of bumps 110 arranged on the surface of a thin part of the supporting substrate 100; and a plurality of wiring patterns 120 which are arranged on the one surface of the supporting substrate 100 and electrically connects each of the probes 200 with each of the bumps 110.
    Type: Application
    Filed: February 14, 2005
    Publication date: August 25, 2005
    Applicant: NIHON DENSHIZAIRYO KABUSHIKI KAISHA
    Inventor: Teppei Kimura
  • Publication number: 20050151547
    Abstract: A probe card including rectilinear probes; a guide base plate having an insulating property, in which a plurality of guide holes are formed through which the probes are inserted in a freely movable manner and a length of a guide hole is shorter than a length of a probe; and a plurality of sheet members having an insulating property, disposed above the guide base plate facing the plate, and laminated one on another with a spacing therebetween so as not to be in contact with one another. The tail ends of some of the probes can be brought into contact with the electrode pads on a lowest sheet member, and the tail ends of the other probes penetrate through the lowest sheet member so as to be enabled to be in contact with electrode pads on other sheet members.
    Type: Application
    Filed: August 17, 2004
    Publication date: July 14, 2005
    Applicant: NIHON DENSHIZAIRYO KABUSHIKI KAISHA
    Inventors: Kazumichi Machida, Atsuo Urata, Teppei Kimura
  • Publication number: 20050099194
    Abstract: It is an object of the present invention to provide an arch type probe capable of enduring a load caused by overdriving even if the probe is miniaturized, and a probe card using the same. An arch type probe 200 has a shape including a first quarter circle arc portion 210 which is supported at one end thereof by the base plate 100 and a second quarter circle arc portion 220 which is connected to the other end of the first quarter circle arc portion 210, extending toward the base plate and a little shorter than the first quarter circle arc portion 221. The top portion of the arch type probe 200 serves as a contact surface brought into contact with an electrode of a semiconductor water B.
    Type: Application
    Filed: May 5, 2004
    Publication date: May 12, 2005
    Applicant: NIHON DENSHIZAIRYO KABUSHIKI KAISHA
    Inventors: Atsushi MINE, Toranosuke FURUSHO, Kazumichi MACHIDA, Atsuo URATA, Teppei KIMURA, Teruhisa SAKATA
  • Publication number: 20050099195
    Abstract: It is an object of the present invention to provide a probe sheet capable of achieving correct measurement independently of a dispersion in height of electrodes of measurement objective; and a probe sheet unit using the same. A probe sheet unit A is a sensing section of a measuring instrument (not shown) for a measurement objective B and includes: a base plate 100 mounted to a prober of the instrument; and a probe sheet 200 mounted to a lower surface of the base plate, and the probe sheet 200 includes: a sheet member 210 having a flexibility; and plural probes 220 for measurement provided on one surface of the sheet member 210, wherein a probe 220 has a shape capable of elastic deformation in a direction, upward or downward.
    Type: Application
    Filed: May 18, 2004
    Publication date: May 12, 2005
    Applicant: NIHON DENSHIZAIRYO KABUSHIKI KAISHA
    Inventors: Kazumichi MACHIDA, Atsuo URATA, Atsushi MINE, Teppei KIMURA, Teruhisa SAKATA
  • Patent number: 6853208
    Abstract: Purpose: To present a vertical probe card capable of reusing without replacing a broken probe if a probe is broken. Constitution: A vertical probe card having vertical probes 100, being used in measurement of electric characteristics of an LSI chip 610 to be measured, comprising a main substrate 300 forming conductive patterns 310, a plurality of probes 100 drooping vertically from the main substrate 300, and a probe support 200 provided at the back side of the main substrate 300 for supporting the probes 100, in which the probe support 200 is disposed parallel to the main substrate 300, and has an upper guide plate 210 and a lower guide plate 220 for supporting the probes 100 by passing the through-holes 211,221 opened in each, and the lower guide plate 220 is composed of three substrates 220A, 220B, 220C laminated separably.
    Type: Grant
    Filed: May 10, 2001
    Date of Patent: February 8, 2005
    Assignee: Nihon Denshizairyo Kabushiki Kaisha
    Inventors: Masao Okubo, Kazumasa Okubo, Hiroshi Iwata
  • Patent number: 6836024
    Abstract: The present invention aims to provide an apparatus for connecting between substrates capable of replacing a connector one by one. An apparatus for connecting between substrates A is provided with a connector 100 for electrically connecting an upside electrode 11 mounted at the back surface of an upside substrate 10 and a downside electrode 21 mounted at the front surface of a downside substrate 20 in a personal computer and a supporting plate 200 arranged between the upside substrate 10 and the downside substrate 20 for removably supporting the connector 100, and the connector 100 is able to be inserted into a positioning hole formed on the supporting plate 200 and has a mounting terminal 110 having a leading edge section being in contact with the downside electrode 21 and a connecting section 120 mounted at a base edge section of the mounting terminal 110 and having a leading edge section being in contact with the upside electrode 11.
    Type: Grant
    Filed: May 7, 2003
    Date of Patent: December 28, 2004
    Assignee: Nihon Denshizairyo Kabushiki Kaisha
    Inventors: Chikaomi Mori, Hirotada Takahashi, Masao Kawata, Kenichi Nojiri
  • Publication number: 20040104738
    Abstract: To prevent deformation of a component member such as a contactor unit to thereby perform a test under a satisfactory continuity condition.
    Type: Application
    Filed: July 21, 2003
    Publication date: June 3, 2004
    Applicant: NIHON DENSHIZAIRYO KABUSHIKI KAISHA
    Inventor: Chikaomi Mori
  • Publication number: 20020041189
    Abstract: Purpose: To present a vertical probe card capable of reusing without replacing a broken probe if a probe is broken.
    Type: Application
    Filed: May 10, 2001
    Publication date: April 11, 2002
    Applicant: Nihon Denshizairyo Kabushiki Kaisha
    Inventors: Masao Okubo, Kazumasa Okubo, Hiroshi Iwata
  • Patent number: 6300783
    Abstract: A first assembly configuration features in including: a plurality of probes having a buckling portion to buckle, upon a contact by an end of a contact portion onto an electrode of semiconductor integrated circuit; a first board provided with a first wiring pattern connected with a connecting portion of the probe; a second board removably fastened with the first board and provided with a second wiring pattern connected with the first wiring pattern; housing members mounted with the second board for holding the contact portion of the probe.
    Type: Grant
    Filed: September 4, 1998
    Date of Patent: October 9, 2001
    Assignee: Nihon Denshizairyo Kabushiki Kaisha
    Inventors: Masao Okubo, Kazumasa Okubo, Hiroshi Iwata
  • Patent number: 6294922
    Abstract: A first assembly configuration features in including: a plurality of probes having a buckling portion to buckle, upon a contact by an end of a contact portion onto an electrode of semiconductor integrated circuit; a first board provided with a first wiring pattern connected with a connecting portion of the probe; a second board removably fastened with the first board and provided with a second wiring pattern connected with the first wiring pattern; housing members mounted with the second board for holding the contact portion of the probe.
    Type: Grant
    Filed: December 23, 1996
    Date of Patent: September 25, 2001
    Assignee: Nihon Denshizairyo Kabushiki Kaisha
    Inventors: Masao Okubo, Kazumasa Okubo, Hiroshi Iwata
  • Patent number: D424043
    Type: Grant
    Filed: October 13, 1998
    Date of Patent: May 2, 2000
    Assignee: Nihon Denshizairyo Kabushiki Kaisha
    Inventor: Hiroyuki Shiroki
  • Patent number: D424539
    Type: Grant
    Filed: October 13, 1998
    Date of Patent: May 9, 2000
    Assignee: Nihon Denshizairyo Kabushiki Kaisha
    Inventor: Hiroyuki Shiroki