Patents Assigned to Nippon Steel Chemical Co., Ltd.
  • Publication number: 20090036631
    Abstract: Disclosed is a polymer which is useful for the preparation of an epoxy resin composition or a cured product thereof in film or sheet exhibiting high heat resistance, high thermal conductivity, low thermal expansion, high gas barrier property, and high toughness. The polymer is a thermoplastic aromatic ether polymer comprising a unit represented by the following general formula (1) at a ratio of 10 to 100 mol % and having a weight average molecular weight of 3,000 or more; in formula (1), X is an oxygen atom or a sulfur atom, R1 and R2 each is a hydrogen atom, an alkyl group of 1 to 8 carbon atoms, an aryl group, an alkoxy group, an aralkyl group, or a halogen atom, and n is a number of 1 to 3.
    Type: Application
    Filed: January 10, 2007
    Publication date: February 5, 2009
    Applicant: NIPPON STEEL CHEMICAL CO., LTD.
    Inventors: Masashi Kaji, Koichiro Ogami
  • Publication number: 20090026923
    Abstract: Disclosed are an organic electroluminescent device (organic EL device) that is improved in luminous efficiency and fully assured of driving stability and has a simple structure and an organic metal complex suitable therefor. The organic metal complex is represented by the following general formula (I) wherein Ar1 denotes an aromatic hydrocarbon group or a heteroaromatic group and may have substituents, Ar2 and Ar3 respectively denote an aromatic hydrocarbon group or a heteroaromatic group and may have substituents, M denotes a trivalent metal, and L denotes an arylate ligand containing a hetero ring having at least one nitrogen atom capable of coordinating M. This organic metal complex, along with a phosphorescent dopant, is suitable for a material constituting the light-emitting layer of an organic EL device.
    Type: Application
    Filed: June 5, 2006
    Publication date: January 29, 2009
    Applicant: NIPPON STEEL CHEMICAL CO., LTD.
    Inventors: Toshihiro Yamamoto, Takahiro Kai, Masaki Komori, Hiroshi Miyazaki
  • Publication number: 20080225438
    Abstract: A laminate (20) for a suspension comprises a stainless steel foil (11), and an insulating layer (12) and a conductor layer (13) that are stacked in this order on the stainless steel foil (11). The stainless steel foil (11) contains a martensite phase in a volume fraction of 0.4 to 2.5 volume %. The insulating layer (12) is made of a polyimide resin, for example. The conductor layer (13) contains pure copper or a copper alloy, for example. The laminate (20) for a suspension is used for producing a wiring-integrated suspension that flexibly supports a slider including a magnetic head such that the slider is opposed to a recording medium.
    Type: Application
    Filed: February 27, 2006
    Publication date: September 18, 2008
    Applicant: NIPPON STEEL CHEMICAL CO., LTD
    Inventors: Takahiro Kuki, Hisayoshi Mukai, Teppei Nishiyama, Kazuhisa Urano
  • Patent number: 7402645
    Abstract: The present invention relates to a soluble polyfunctional vinylaromatic copolymer improved in heat resistance, resistance to thermal decomposition, solvent solubility, and processability. The soluble polyfunctional vinylaromatic polymer is obtained by cationically polymerizing, at a temperature of 20 to 120° C., one or more monomer ingredients including 20 to 100 mol % divinylaromatic compound (a) in the presence of a donor ingredient, e.g., a quaternary ammonium salt, with the aid of a Lewis acid catalyst and an initiator represented by the following general formula (1) wherein R1 represents hydrogen or a monovalent C1-6 hydrocarbon group; R2 represents an aromatic or aliphatic hydrocarbon group having a valence of p; Z represents halogen or C1-6 alkoxy or acyloxy; and p is an integer of 1 to 6; provided that when two or more R1's and Z's are present per molecule, they may be identical to different from each other.
    Type: Grant
    Filed: January 26, 2005
    Date of Patent: July 22, 2008
    Assignee: Nippon Steel Chemical Co., Ltd.
    Inventor: Masanao Kawabe
  • Patent number: 7385017
    Abstract: This invention relates to a silicone resin composition which exhibits high heat resistance, high transparency and high dimensional stability and thus can be suitably used for optical applications such as a lens, an optical disc, an optical fiber, a substrate for a plat panel display, a window material for an automobile, and the like.
    Type: Grant
    Filed: March 22, 2004
    Date of Patent: June 10, 2008
    Assignee: Nippon Steel Chemical Co., Ltd.
    Inventors: Takashi Saito, Masayoshi Isozaki, Hideki Andoh
  • Patent number: 7381901
    Abstract: A hinge board having a hinge bending part and a rigid part includes: not less than two flexible wiring boards including a polyimide sheet layer, a conductor layer having a circuit formed on both sides or one side of the polyimide sheet layer, and a coverlay film layer covering the conductor layer; and a bonding material for bonding the flexible wiring boards. At least one of the flexible wiring boards is a flexible double-sided wiring board including the conductor layers on both sides of the polyimide sheet layer. Moreover, the flexible wiring boards are bonded to each other in the rigid part by use of the bonding material in such a manner that a space part is formed between the flexible wiring boards in the hinge bending part.
    Type: Grant
    Filed: October 19, 2005
    Date of Patent: June 3, 2008
    Assignee: Nippon Steel Chemical Co., Ltd.
    Inventors: Takashi Tanaka, Hidenori Nakajima, Yuichi Tokuda
  • Patent number: 7345125
    Abstract: The present invention relates to a silicone resin composition that can be used for a roll film having small birefringence, the silicone resin composition being suitable for, for example, optical applications, and a window material for an automobile, the silicone resin composition having high heat resistance, the silicon resin composition being stained at a low level, the silicone resin composition having a low thermal expansion coefficient, the silicone resin composition enabling a transparent conductive film to be stably formed, and the silicone resin composition providing good winding property.
    Type: Grant
    Filed: September 21, 2005
    Date of Patent: March 18, 2008
    Assignee: Nippon Steel Chemical Co., Ltd.
    Inventors: Masayoshi Isozaki, Takashi Saito, Hideki Andoh
  • Publication number: 20080057299
    Abstract: The present invention aims to provide a polyimide resin excellent in heat resistance, dimensional stability, and toughness as an insulating layer, and to obtain a laminate suitable for a flexible wiring board by using the polyimide resin, the laminate being excellent in resistance to rupture and flexibility even when the thickness of a polyimide resin layer is small. Provided is a laminate for a wiring board having a metal layer on at least one surface of a polyimide resin layer, in which a polyimide resin layer (A) obtained by imidating a polyimide precursor resin having a weight average molecular weight of 150,000 to 800,000 is a main polyimide resin layer, and a polyimide resin of which the main polyimide resin layer is constituted has structural units represented by the following general formulae (1) and (2) where R represents a lower alkyl group, a phenyl group, or a halogen atom, and Ar1 represents a residue of bis(aminophenoxy)benzene or bis(aminophenoxy)naphthalene.
    Type: Application
    Filed: August 10, 2007
    Publication date: March 6, 2008
    Applicant: Nippon Steel Chemical Co., Ltd.
    Inventors: Yasuhiro Adachi, Hironori Nagaoka, Hongyuan Wang, Naoko Osawa, Masahiko Takeuchi, Hironobu Kawasato
  • Patent number: 7338716
    Abstract: This invention relates to a laminate comprising an insulating polyimide resin layer etchable by an aqueous alkaline solution and a metal foil. The laminate has an insulating resin layer composed of a plurality of polyimide resin layers on the metal foil and the insulating resin layer has at least one polyimide resin layer (A) with a coefficient of linear thermal expansion (CTE) of 30×10?6/° C. or less and at least one polyimide resin layer (B) with a glass transition temperature (Tg) of 300° C. or below, the layer in contact with the metal foil is the polyimide resin layer (B), the bonding strength between the metal foil and the polyimide resin layer (B) in contact therewith is 0.5 kN/m or more, and the average rate of etching of the insulating resin layer by a 50 wt % aqueous solution of potassium hydroxide at 80° C. is 0.5 ?m/min or more. The laminate is useful for flexible printed circuits and the like.
    Type: Grant
    Filed: February 25, 2002
    Date of Patent: March 4, 2008
    Assignee: Nippon Steel Chemical Co., Ltd.
    Inventors: Kazuto Okamura, Kazutoshi Taguchi, Kazunori Ohmizo, Makoto Shimose
  • Publication number: 20070254182
    Abstract: Disclosed is an organic electroluminescent device (organic EL device) which has a simple structure and utilizes phosphorescence. The organic electroluminescent device is improved in luminescent efficiency and secured of sufficient driving stability. The organic electroluminescent device includes a luminescent layer or a plurality of organic compound thin film layers containing a luminescent layer formed between a pair of electrodes. The luminescent layer contains a compound composed of an Al complex of an oxyphenylbenzoxazole which is represented by the general formula (I) below as a host material, while containing an organic metal complex including Ru, Rh, Pd, Ag, Re, Os, Ir, Pt or Au as a guest material: where R1to R8 independently represent hydrogen atom, alkyl group, aromatic group or the like; n represents 2 or 4; and Z represents aromatic group, triarylsilyl group or the like when n is 2, while representing Al(III) when n is 4.
    Type: Application
    Filed: March 4, 2005
    Publication date: November 1, 2007
    Applicant: NIPPON STEEL CHEMICAL CO., LTD.
    Inventors: Takayuki Fukumatsu, Hiroshi Miyazaki
  • Publication number: 20070218315
    Abstract: The subject of the present invention is to provide a laminate for an HDD suspension which has a thin conductive layer and is free from warpage (camber) or deformation and that in compliance with demands on an HDD suspension for realization of a high density and superfine wiring, ensures high reliability and high precision; and a production process for the same. There is provided a laminate for an HDD suspension containing a stainless layer, polyimide resin layer and conductive layer, wherein a thickness of the conductive layer is 10 ?m or less, and in the production process, a laminate containing a stainless layer/polyimide resin layer/conductive layer is produced using the conductive layer having a thickness of larger than 10 ?m, and then only the conductive layer is subjected to chemical etching to thereby reduce a thickness of the conductive layer to 10 ?m or less.
    Type: Application
    Filed: March 31, 2005
    Publication date: September 20, 2007
    Applicant: NIPPON STEEL CHEMICAL CO., LTD.
    Inventors: Kazutoshi Taguchi, Kengo Takada
  • Publication number: 20070202339
    Abstract: This invention relates to an epoxy resin composition suitable for a solvent-free, one-component, room temperature-curable coating composition and to an epoxy-polysiloxane coating composition showing good adhesion to steel plates and the like and excellent weatherability. This epoxy resin composition comprises (a) an epoxy resin with an epoxy equivalent of 100-1000 g/eq., (b) a silane compound represented by the following general formula (1) Si(R1R2R3R4)??(1) (wherein R1 is an alkyl group of 1-6 carbon atoms and R2-R4 are hydrogen atoms, alkyl groups of 1-10 carbon atoms, aryl groups, hydroxyl groups, or alkoxy groups of 1-6 carbon atoms) and a condensate thereof, and (c) a phosphoric acid represented by the following general formula (2) H(n+2)PnO(3n+1)??(2) as essential components.
    Type: Application
    Filed: August 3, 2005
    Publication date: August 30, 2007
    Applicant: NIPPON STEEL CHEMICAL CO., LTD.
    Inventors: Mutsumi Yoshida, Kazuaki Nishiyama, Nobuyuki Furukawa, Yasuyuki Takeda, Makoto Matsuura
  • Patent number: 7259213
    Abstract: This invention relates to epoxy resins containing indole as structural unit, indole resins and resin compositions containing said epoxy resins and indole resins useful for applications such as laminating, molding, casting and adhesion on account of their excellent fire retardance, adhesiveness, moisture resistance and heat resistance. The indole resins of this invention and the epoxy resins obtained therefrom are represented by the following general formulas I and II wherein R1 is H, alkyl or the like, X is a crosslinking group represented by —C(R2R3)— or C(R4R5)—Ar—C(R4R5)— (wherein R2-R5 are H, alkyl or the like and Ar is a benzene or biphenyl ring), G is glycidyl group and n is an integer of 1-20.
    Type: Grant
    Filed: February 10, 2003
    Date of Patent: August 21, 2007
    Assignee: Nippon Steel Chemical Co., Ltd.
    Inventors: Masashi Kaji, Hisashi Yamada
  • Publication number: 20070167637
    Abstract: Provided is a production process by which a novel alicyclic oxetane compound which has an oxetane ring, has excellent light transmission in the near ultraviolet region, and is useful as a cationically polymerizable monomer can be easily obtained. The production process which is for obtaining an alicyclic oxetane compound includes subjecting an aromatic oxetane compound to nuclear hydrogenation in high-pressure hydrogen in the presence of a hydrogenation catalyst. For example, when 4,4?-bis[(3-ethyloxetan-3-yl)methoxymethyl]biphenyl is used as the aromatic oxetane compound, 4,4?-bis[(3-ethyloxetan-3-yl)methoxymethyl]bicyclohexyl is obtained as the alicyclic oxetane compound.
    Type: Application
    Filed: February 15, 2005
    Publication date: July 19, 2007
    Applicant: Nippon Steel Chemical Co., Ltd.,
    Inventors: Takehiro Shimizu, Kiyotaka Onishi, Hongwen Liu
  • Publication number: 20070155923
    Abstract: The present invention relates to a soluble polyfunctional vinylaromatic copolymer improved in heat resistance, resistance to thermal decomposition, solvent solubility, and processability. The soluble polyfunctional vinylaromatic polymer is obtained by cationically polymerizing, at a temperature of 20 to 120° C., one or more monomer ingredients including 20 to 100 mol % divinylaromatic compound (a) in the presence of a donor ingredient, e.g., a quaternary ammonium salt, with the aid of a Lewis acid catalyst and an initiator represented by the following general formula (1) wherein R1 represents hydrogen or a monovalent C1-6 hydrocarbon group; R2 represents an aromatic or aliphatic hydrocarbon group having a valence of p; Z represents halogen or C1-6 alkoxy or acyloxy; and p is an integer of 1 to 6; provided that when two or more R1's and Z's are present per molecule, they may be identical to different from each other.
    Type: Application
    Filed: January 26, 2005
    Publication date: July 5, 2007
    Applicant: NIPPON STEEL CHEMICAL CO., LTD.
    Inventor: Masanao Kawabe
  • Publication number: 20070149758
    Abstract: The present invention relates to an aromatic polyimide which has excellent heat resistance and excellent thermal dimensional stability, and which realizes low hygroscopic property, and an aromatic polyamic acid as a precursor for the aromatic polyimide. Provided are an aromatic polyamic acid including a structural unit represented by the following general formula (1), and an aromatic polyimide obtained by imidating the aromatic polyamic acid. The aromatic polyamic acid or the aromatic polyimide can be a copolymerization-type aromatic polyamic acid or aromatic polyimide having another structural unit: where, Ar1 represents a tetravalent organic group produced from a tetracarboxylic acid having one or more aromatic rings, and R represents a hydrocarbon having 2 to 6 carbon atoms.
    Type: Application
    Filed: December 6, 2004
    Publication date: June 28, 2007
    Applicant: NIPPON STEEL CHEMICAL CO., LTD.
    Inventors: Hongyuan Wang, Noriko Chikaraishi, Hironobu Kawasato
  • Publication number: 20070129502
    Abstract: Provided is curable resin composition which gives a cured article excellent in chemical resistance, dielectric properties, low water-absorption, heat resistance, flame retardance, and mechanical properties and which is usable in applications such as dielectric materials, insulating materials, heat-resistant materials, and structural materials. The curable resin composition includes a component (A) which is a polyphenylene ether oligomer having a number-average molecular weight of 700 to 4,000 and having a vinyl group at both end and a component (B) which is a solvent-soluble polyfunctional vinylaromatic copolymer which has structural units derived from monomers including a divinylaromatic compound (a) and an ethylvinylaromatic compound (b) and in which the content of repeating units derived from the divinylaromatic compound (a) is 20 mol % or higher, the ratio of the amount (wt. %) of the component (A) to that (wt. %) of the component (B) being (20 to 98):(2 to 80).
    Type: Application
    Filed: January 26, 2005
    Publication date: June 7, 2007
    Applicant: NIPPON STEEL CHEMICAL CO., LTD.
    Inventors: Masanao Kawabe, Hiroyuki Yano, Yasuji Shichijo, Kouhei Tomari, Isamu Akiba
  • Publication number: 20070054148
    Abstract: This invention provides an organic EL material useful for the emissive layer of an organic EL element which deteriorates little in luminance when operated over a prolonged period of time and shows excellent durability. The material is an aluminum chelate complex which is represented by general formula (1) in which Ar1 is a mono- or bicylic arylene group, Ar2 is a mono- or bicyclic aryl group, R1—R6 are hydrogen or hydrocarbon groups containing 1-8 carbon atoms and contains a compound represented by general formula (1) in which Ar2 is a halogen as an impurity in an amount of 350 wt ppm or less.
    Type: Application
    Filed: August 6, 2004
    Publication date: March 8, 2007
    Applicants: NIPPON STEEL CHEMICAL CO., LTD., PIONEER CORPORATION
    Inventors: Shinji Matsuo, Hiroshi Miyazaki, Taishi Tsuji
  • Publication number: 20070012935
    Abstract: This invention provides an organic electroluminescent element (organic EL element) utilizing phosphorescence which emits light efficiently with high luminance at low current density, shows good driving stability and is applicable to display devices such as flat panel displays and illuminating devices. The element comprises an anode, organic layers and a cathode piled one upon another on a substrate, at least one of the organic layers is a light-emitting layer containing a host material and a dopant material and a pyrazole-derived compound having 2-4 pyrazole structures represented by the following formula I in the same molecule is used as said host material; wherein, Ar1-Ar3 are independently hydrogen or substituted or unsubstituted aromatic hydrocarbon groups and at least one of Ar1-Ar3 is a group other than hydrogen.
    Type: Application
    Filed: September 21, 2004
    Publication date: January 18, 2007
    Applicant: NIPPON STEEL CHEMICAL CO., LTD.
    Inventors: Osamu Yoshitake, Hiroshi Miyazaki, Daisuke Suzaki, Yu Yamada
  • Patent number: 7141229
    Abstract: This invention relates to a graphite material for negative electrode of lithium secondary battery. This graphite material is obtained by carbonizing the pulverized green coke to yield coke, adding one kind or more of boron or a compound thereof to the coke, graphitizing the resulting mixture and controlling the particle size of the product graphite. This graphite material for negative electrode is characterized by showing a tap density of 0.95 g/cm3 or more after tapping 20 times or 1.15 g/cm3 or more after tapping 300 times and a BET specific surface area of 1.5 m2/g or less. A lithium secondary battery made by the use of this graphite material for negative electrode has a large discharge capacity and suffers little loss during charging and discharging.
    Type: Grant
    Filed: February 28, 2002
    Date of Patent: November 28, 2006
    Assignee: Nippon Steel Chemical Co., Ltd.
    Inventors: Yoichi Kawano, Tetsusei Fukuda, Tsutomu Sugiura, Takeshi Hamada, Hiromasa Shoji, Taro Kohno