Abstract: A lighting system may be for a vehicle cup holder installed in a vehicle. The lighting system may include a first inductive member to be positioned adjacent a back side of the vehicle cup holder, and a first controller configured to inductively couple power and command signals through the first inductive member. The lighting system may also include a lighting device to be positioned adjacent a front side of the vehicle cup holder. The lighting device, in turn, may include a second inductive member configured for inductive coupling with the first inductive member, at least one light, and a second controller configured to operate the at least one light based upon power and command signals inductively coupled to the second inductive member from the first inductive member.

Abstract: An electrostatic discharging, detachable, overshoe, includes an electrically conductive flexible skeleton with oversized heel and toe regions for placing over footwear, and a conductive element situated to facilitate conducting static electricity between a body of a wearer of the footwear and the overshoe. The overshoe can be worn over a wide variety of street, work, office, and specialty footwear and may support reduction of electro-static discharge buildup on the body of the wearer by safely conducting any electrical charge generated or transferred to the body of the wearer to a grounded surface such as an electrically conductive floor.

Abstract: There is provided a flexible circuit board 22 that, when deposited on another flexible circuit board 40, causes no gap to occur between wiring films 4a, 4a, of the flexible circuit board 40. Moreover, a plurality of flexible circuit boards are deposited on one another to provide a flexible multi-layer wiring circuit board having no gaps between the flexible circuit boards and having less bowing. In the flexible circuit board 22, the thickness of a bonding layer 16, 16a, on the opposed side of a bowing metallic member 2, of an inter-layer insulating film 10 where which bumps 6 are formed is greater than the thickness of a bonding layer on the side of metallic member 2. When the flexible circuit board 22 is deposited on the other flexible circuit board 40 to form a flexible multi-layer wiring circuit board 50, the bonding layer 16, 16a can be filled between the wiring films 4a, 4a, so that the flexible multi-layer wiring circuit board 50 has no gaps and a less bowing.

Abstract: To increase the dimensional accuracy of an interlayer member used for producing a multilayer wiring board which is inserted between two wiring layers to establish interlayer insulation and interlayer electrical connection between the wiring layers, to thereby increase a layout density. A mask film is formed on a main surface of a sheet-like carrier layer. A metal column for interlayer connection is formed on the main surface of the carrier layer by plating a copper using the mask film as a mask. The mask film is removed. An interlayer insulating layer and a protective sheet are laminated on the main surface of the carrier layer in such a manner that the metal column for interlayer connection penetrates them. The interlayer insulating layer and the protective sheet are polished until the upper surface of the metal column for interlayer connection is exposed. Then, the carrier layer is removed. Furthermore, the protective sheet is removed.

Abstract: A connecting member between wiring films is provided in which: a normal copper foil, which is a general-purpose component and not expensive, or the like can be used as a material; formation of bumps is sufficiently achieved by conducting etching one time; and a necessary number of layers can be laminated and pressed collectively at a time. Bumps, which are formed approximately in a cone-shape, for connecting wiring films of a multilayer wiring substrate are embedded in a second resin film that serves as an interlayer insulating film.

Abstract: A connecting member between wiring films is provided in which: a normal copper foil, which is a general-purpose component and not expensive, or the like can be used as a material; formation of bumps is sufficiently achieved by conducting etching one time; and a necessary number of layers can be laminated and pressed collectively at a time. Bumps, which are formed approximately in a cone-shape, for connecting wiring films of a multilayer wiring substrate are embedded in a second resin film that serves as an interlayer insulating film.

Abstract: To provide a multilayer wiring board mainly used for an electronic device, in which a bump passing through an interlayer insulating film allows for interlayer connection between plural wiring films insulated from one another with plural interlayer insulating layers. In the multilayer wiring board, a circuit element such as an electronic part, a semiconductor chip, or a passive element is accommodated in the interlayer insulating films so as to connect its terminal with the corresponding wiring film. In particular, the semiconductor chip is polished to a thickness of 50 ?m or smaller, and the multilayer wiring board itself for the electronic device has the flexibility.

Abstract: The present invention prepares a member having a conductor-circuit-forming copper foil formed on a protrusion-forming copper layer via an etching-barrier layer formed of a different metal. Etching is selectively performed for the protrusion-forming copper foil by using etchant that does not etch the etching-barrier layer, and protrusions are thereby formed. Then, the etching-barrier layer is removed using etchant that does not etch the copper foil and using the protrusions as masks. An interlayer-insulating layer is formed on a surface of the copper foil, on which the protrusions are formed, so that the protrusions are connected to the conductor circuit. Thereby, heights of the protrusions are uniformed, and the reliability of connections can be improved.

Abstract: The present invention prepares a member having a conductor-circuit-forming copper foil 23 formed on a protrusion-forming copper layer 21 via an etching-barrier layer 22 formed of a different metal. Etching is selectively performed for the protrusion-forming copper foil 21 by using etchant that does not etch the etching-barrier layer, and protrusions 25 are thereby formed. Then, the etching-barrier layer 22 is removed using etchant that does not etch the copper foil 23 and using the protrusions as masks. An interlayer-insulating layer 27 is formed on a surface of the copper foil 23, on which the protrusions 25 are formed, so that the protrusions are connected to the conductor circuit. Thereby, heights of the protrusions are uniformed, and the reliability of connections can be improved.

Abstract: The present invention relates to a method for fabricating a wiring substrate by forming an insulating film on a metal base having openings on the metal base at positions corresponding to metal bumps to be formed later; forming at least one layer of wiring on the base made of a metal through the insulating film, the layer of wiring having a wring film formed thereon by electroplating; and selectively etching the base. The insulating film can be a liquid photosensitive polyamide, the wiring layer can be copper and the wiring film can be a conductive layer selected from the group consisting of Ni-P and Ni. In the present invention, the wiring layer can be formed through the insulating film in contact with the metal base at the openings in the insulating film and in contact with the insulating film where there are no openings in the insulating film.

Abstract: The present invention prepares a member having a potrusion-forming copper foil 21 formed on a conductor-circuit-forming copper layer 23 via an etching-barrier layer 22 formed of a different metal. Etching is selectively performed for the protrusion-forming copper foil 21 by using etchant that does not etch the etching-barrier layer, and protrusions 25 are thereby formed. Then, the etching-barrier layer 22 is removed using etchant that does not etch the copper foil 23 and using the protrusions as masks. An interlayer-insulating layer 27 is formed on a surface of the copper foil 23, on which the protrusions 25 are formed, so that the protrusions are connected to the conductor circuit. Thereby, heights of the protrusions are uniformed, and the reliability of connections can be improved.

Abstract: By adopting an electrolytic plating method in forming the bump, the drawbacks of the conventional electrolytic plating method should be avoided. For example, the necessity of adopting a lead wiring for each wiring or the like should be eliminated. On the surface of a metal base, a resist film (first resist film) having a negative pattern for forming a wiring film and a resist film (second resist film) having a negative pattern for forming the bump or the pad is formed. By using these films as masks, electrolytic plating of a bump material film is conducted to form the bump. Subsequently, after only the second film is removed. By using the first resist film as a mask, electrolytic plating is then conducted to form a wiring film.

Abstract: A connecting member between wiring films is provided in which: a normal copper foil, which is a general-purpose component and not expensive, or the like can be used as a material; formation of bumps is sufficiently achieved by conducting etching one time; and a necessary number of layers can be laminated and pressed collectively at a time. Bumps, which are formed approximately in a cone-shape, for connecting wiring films of a multilayer wiring substrate are embedded in a second resin film that serves as an interlayer insulating film.