Abstract: In one embodiment, a multi-port SRAM is provided that comprises: a single input port and output port 6-T SRAM; and a multi-port control block circuit that includes: a plurality of input registers corresponding to a plurality of input ports to register corresponding input signals; an input multiplexer to select from the input registers to provide a selected input signal to the 6-T SRAM's single input port; a plurality of output registers corresponding to a plurality of output ports to register corresponding output signals; and an output de-multiplexer to select from the output registers to provide an output signal from the 6-T SRAM's single output port to the selected output register.

Abstract: In one embodiment, a read-only memory (ROM) is provided that includes: a plurality of word lines; a plurality of bit lines; a plurality of memory cell transistors arranged in rows corresponding to the word lines such that if a word line is asserted the corresponding memory cell transistors are conducting, the memory cell transistors also being arranged in columns corresponding to the bit lines; wherein each column of memory cell transistors is arranged into column groups, each column group including an access transistor coupled to the corresponding bit line, the remaining transistors in the column group being coupled in series from the access transistor to a last transistor in the column group, the last transistor in the column group being coupled to a voltage node.

Abstract: In one embodiment, a decoder for decoding an address having a plurality of bits ranging from a first address bit a1 to a last address bit aN, each address bit being either true or false is provided that includes: a pre-charge circuit adapted to pre-charge a dynamic NOR node and a dynamic OR node and then allow the pre-charged dynamic NOR node and pre-charged dynamic OR node to float; a plurality of switches coupled between the dynamic NOR node and ground, each switch corresponding uniquely to the address bits such that the switches range from a first switch corresponding to a1 to an nth switch corresponding to aN, wherein any switch corresponding to a true address bit is configured to turn on only if its corresponding address bit is false, and wherein any switch corresponding to a false address bit is configured to turn on only if its corresponding address bit is true; a (n+1)th switch coupling the dynamic OR node to ground, the (n+1)th switch being controlled such that it turns on if the dynamic OR node is c

Abstract: In one embodiment, a method of leakage control for a memory having an array of memory cells arranged into a plurality of sub-arrays is provided wherein each sub-array has a sleep mode of operation controlled by a sleep signal in which stored data is lost, and wherein each sub-array asserts a local clock if the sub-array is addressed. The method includes the act of asserting a sleep signal while addressing a given one of the sub-arrays such that only the given one of the sub-arrays is placed into the sleep mode.

Abstract: In one embodiment, a hybrid DRAM is provided that includes: a sense amplifier including a differential amplifier and regenerative latch, wherein the differential amplifier and regenerative latch are constructed using core transistors that have a relatively thin gate oxide; and a plurality of memory cells coupled to the sense amplifier through a pair of bit lines, wherein each memory cell includes an access transistor coupled to a storage cell, the access transistor having a relatively thick gate oxide, whereby the storage capacitor is capable of being charged to a VIO power supply voltage that is greater than a VDD power supply voltage for the core transistors.

Abstract: In one embodiment, a dynamic random access memory (DRAM) is provided that includes: a plurality of memory cells arranged into rows and columns, wherein each memory cell comprises an access transistor coupled to a storage transistor, each access transistor being arranged in a rectangular shape having a length greater than a width, the length being aligned with a corresponding column, the access transistor coupling to a storage transistor having a width greater than the width of the rectangular shape, the access transistor having a length aligned with a corresponding row such that each memory cell is L-shaped, and wherein the L-shaped memory cells in each column are staggered with respect to neighboring columns such that the L-shaped memory cells in a given column are interlocked with the L-shaped memory cells in an adjacent column.

Abstract: In one embodiment, a memory is provided that includes: a plurality of memory cells arranged in columns, each column coupled to a corresponding bit line; a sense amplifier adapted to sense the voltage on a pair of the bit lines to determine a binary state of an accessed memory cell coupled to a first one of the bit lines in the pair; and a first trim capacitor having a first terminal directly coupled to one of the bit lines in the pair, the first trim capacitor having an opposing second terminal coupled to a first trim capacitor signal, the memory being adapted to change a voltage of the first trim capacitor signal while the sense amplifier senses the voltage to determine the binary state of the accessed memory cell.

Abstract: In one embodiment, an exclusive-OR (XOR) calculation circuit configured to XOR a plurality of N input signals ranging from a first signal to an Nth signal is provided.

Abstract: A memory is provided that practices global read line sharing by including: a global read line, the memory being adapted to be pre-charge the global read line prior to a read operation; an I/O circuit to receive the global read line; and a plurality of sense amplifiers, each sense amplifier being multiplexed with respect to the global read line such that only a selected one of the sense amplifiers in the plurality is activated during a read operation to determine a bit decision, the memory being adapted to discharge the pre-charged global read line if the bit decision from the activated sense amplifier equals one, the pre-charged global read line thereby staying pre-charged if the bit decision from the activated sense amplifier equals zero.

Abstract: In one embodiment, a multi-port SRAM is provided that comprises: a single input port and output port 6-T SRAM; and a multi-port control block circuit that includes: a plurality of input registers corresponding to a plurality of input ports to register corresponding input signals; an input multiplexer to select from the input registers to provide a selected input signal to the 6-T SRAM's single input port; a plurality of output registers corresponding to a plurality of output ports to register corresponding output signals; and an output de-multiplexer to select from the output registers to provide an output signal from the 6-T SRAM's single output port to the selected output register.

Abstract: In one embodiment, a dynamic random access memory (DRAM) is provided that includes: a plurality of rows of memory cells, each of the memory cell rows being arranged into columns, wherein each of the memory cell rows is crossed by a row of four word lines, and wherein each of the columns is crossed by a bit line; a plurality of sense amplifiers corresponding to the bit lines such that a single sense amplifier corresponds to every four bit lines; and a plurality of 4:1 multiplexers corresponding to the plurality of sense amplifiers, each 4:1 multiplexer coupling its corresponding sense amplifier to its corresponding four bit lines.

Abstract: A one-time-programmable memory cell uses two complementary antifuses that are programmed in a complementary fashion such that only one of the two complementary antifuses is stressed by a programming voltage. The programming voltage stress one a particular one of the complementary antifuses indicates a logical state of the memory cell. For example, a logical high state may correspond to a first one of the complementary antifuses being stressed whereas a logical low state may correspond to the stressing of the remaining one of the complementary antifuses.

Abstract: A non-volatile memory cell includes a floating gate transistor having a floating gate coupled to a metal layer capacitor defined in one or more metal layers. Within each metal layer, the metal layer capacitor includes a first plate coupled to the floating gate and a second plate separated from the first plate by a fringe capacitance junction.

Abstract: A CAM cell is provided that includes: an SRAM cell adapted to store a bit; a data line adapted to provide a corresponding comparand bit; an XOR gate adapted to XOR the stored bit and the comparand bit to provide an XOR output, and a switch adapted to close in response to the XOR output.

Abstract: In one embodiment, a sense amplifier includes: a differential amplifier adapted to amplify a voltage difference between a pair of bit lines; and a self-bias generation circuit adapted to reduce an offset bias in the differential amplifier with regard to the amplification of the voltage difference between the pair of bit lines.

Abstract: In one embodiment, NMOS transistors have their source coupled to a common source node such that the NMOS transistors conduct a leakage current if the common source node is grounded. To reduce this leakage current, the common source node is raised in potential. Similarly, PMOS transistors have their source coupled to a common source node such that the PMOS transistors conduct a leakage current if the common source node is charged to a power supply voltage VDD. To reduce this leakage current, the common source node is lowered in potential.