Abstract: Disclosed and claimed herein is a hollow core coaxial cable, having a dielectric capillary with an inside wall and an outside wall, an inner conductive layer on the inside wall of the hollow core coaxial cable and an outer conductive layer on the outside wall of the hollow core coaxial cable, the conductive layers may be patterned. Further disclosed is a method of making the hollow core coaxial cable. Further disclosed are holey fiber coaxial cables, having a holey fiber capillary having an inside wall and an outside wall, an inner conductive layer on the inside wall of the hollow core coaxial cable and an outer conductive layer on the outside wall of the hollow core coaxial cable, the conductive layers may be patterned.

Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.

Abstract: An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.

Abstract: Disclosed and claimed herein is a hollow core coaxial cable, having a dielectric capillary with an inside wall and an outside wall, an inner conductive layer on the inside wall of the hollow core coaxial cable and an outer conductive layer on the outside wall of the hollow core coaxial cable, the conductive layers may be patterned. Further disclosed is a method of making the hollow core coaxial cable. Further disclosed are holey fiber coaxial cables, having a holey fiber capillary having an inside wall and an outside wall, an inner conductive layer on the inside wall of the hollow core coaxial cable and an outer conductive layer on the outside wall of the hollow core coaxial cable, the conductive layers may be patterned.

Abstract: Radio frequency (RF) power amplifiers are provided which may include high power, wideband, microwave or millimeter-wave solid state power amplifiers based on waveguide power combiner/dividers.

Abstract: Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated electronic components. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.

Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.

Abstract: Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second surface to the layer, the via hole having a first perimeter at the first surface; (d) forming an aperture in the layer, wherein the aperture has a second perimeter within the first perimeter; and (e) providing a conductive structure for sealing the via structure. Also provided are sealed via structures, methods of detecting leakage in a sealed device package, sealed device packages, device packages having cooling structures, and methods of bonding a first component to a second component.

Abstract: Disclosed and claimed herein is a microwave assembly having a substrate comprising a microwave device; said device having a die, a first layer having a dielectric constant between about 1.00 and about 1.45 and a thickness between about 0.05 and about 2 mm along with one or more layers chosen from an absorbing layer, an EMI blocking layer, a layer comprising conductive material or a metal cover.

Abstract: A power-combined amplifier and method are provided. In one aspect, the power-combined amplifier and method overcome problems associated with decreased output power efficiency caused by phase mismatch between constituent amplifiers.

Abstract: Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.

Abstract: An apparatus may include one or more conductive surfaces, waveguide structures and/or ports. One or more waveguide structures may include a portion disposed above a conductive surface, an outer conductor, and/or an inner conductor. A first portion of an outer conductor may be connected to a conductive surface. A port end of an outer conductor may be connected to an outer conductor port. An inner conductor may be disposed inside and spaced apart from an outer conductor. An inner conductor port may be connected to an inner conductor. An inner conductor of two or more waveguide structures may be connected to each other. A conductive surface may include at least one aperture portion, which may have a width substantially similar to the width of a waveguide structure. A substrate may be disposed between one or more waveguide structures and a conductive surface for a substantial portion of a waveguide structure.

Abstract: Structures, materials, and methods to control the spread of a solder material or other flowable conductive material in electronic and/or electromagnetic devices are provided.

Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

Abstract: Connectors and interconnects for high power connectors which may operate at frequencies up to approximately 110 GHz and fabrication methods thereof are provided.

Abstract: The present invention relates to the fabrication of complicated electronic and/or mechanical structures and devices and components using homogeneous or heterogeneous 3D additive build processes. In particular the invention relates to selective metallization processes including electroless and/or electrolytic metallization.

Abstract: Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second surface to the layer, the via hole having a first perimeter at the first surface; (d) forming an aperture in the layer, wherein the aperture has a second perimeter within the first perimeter; and (e) providing a conductive structure for sealing the via structure. Also provided are sealed via structures, methods of detecting leakage in a sealed device package, sealed device packages, device packages having cooling structures, and methods of bonding a first component to a second component.

Abstract: An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.

Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

Abstract: A transmission line structure, a transmission line thermal manager and/or process thereof. A transmission line thermal manager may include a thermal member. A thermal member may be configured to form a thermal path, for example away from one or more inner conductors of a transmission line. A part of a thermal member may be formed of an electrically insulative and thermally conductive material. One or more inner conductors may be spaced apart from one or more outer conductors in a transmission line. A transmission line and/or a transmission line thermal manager may be configured to maximize a signal through a system, for example by modifying the geometry of one or more transmission line conductors and/or of a thermal manager.