Patents Assigned to Nuvotronics, LLC
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Patent number: 8703603Abstract: Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second surface to the layer, the via hole having a first perimeter at the first surface; (d) forming an aperture in the layer, wherein the aperture has a second perimeter within the first perimeter; and (e) providing a conductive structure for sealing the via structure. Also provided are sealed via structures, methods of detecting leakage in a sealed device package, sealed device packages, device packages having cooling structures, and methods of bonding a first component to a second component.Type: GrantFiled: November 11, 2010Date of Patent: April 22, 2014Assignee: Nuvotronics, LLCInventors: David W. Sherrer, Larry J. Rasnake, John J. Fisher
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Patent number: 8698577Abstract: An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.Type: GrantFiled: July 5, 2011Date of Patent: April 15, 2014Assignee: Nuvotronics, LLCInventors: David Sherrer, Jean-Marc Rollin, Kenneth Vanhille, Marcus Oliver, Steve Huettner
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Patent number: 8659371Abstract: A system is provided for three dimensional coaxial transmission of signals in a micro-machined component, the system having, a micro-machined component matrix with a first metallic sheet having a plurality of first access holes disposed therein; a second metallic sheet having a plurality of second access holes disposed therein; a plurality of metal posts disposed between the first and second metallic sheets such that the metallic sheets are maintained at a desired distance; walls defining a coaxial transmission channel; and a coaxial transmission core disposed within the channel.Type: GrantFiled: February 26, 2010Date of Patent: February 25, 2014Assignees: BAE Systems Information and Electronic Systems Integration Inc., Nuvotronics, LLCInventors: Daniel L. Fonataine, David Sherrer
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Publication number: 20140015623Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.Type: ApplicationFiled: September 17, 2013Publication date: January 16, 2014Applicant: NUVOTRONICS, LLCInventor: David Sherrer
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Publication number: 20130333820Abstract: A process to form devices may include forming a seed layer on and/or over a substrate, modifying a seed layer selectively, forming an image-wise mold layer on and/or over a substrate and/or electrodepositing a first material on and/or over an exposed conductive area. A process may include selectively applying a temporary patterned passivation layer on a conductive substrate, selectively forming an image-wise mold layer on and/or over a substrate, forming a first material on and/or over at least one of the exposed conductive areas and/or removing a temporary patterned passivation layer. A process may include forming a sacrificial image-wise mold layer on a substrate layer, selectively placing one or more first materials in one or more exposed portions of a substrate layer, forming one or more second materials on and/or over a substrate layer and/or removing a portion of a sacrificial image-wise mold layer.Type: ApplicationFiled: August 13, 2013Publication date: December 19, 2013Applicant: NUVOTRONICS, LLCInventor: David Sherrer
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Patent number: 8542079Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.Type: GrantFiled: January 28, 2011Date of Patent: September 24, 2013Assignee: Nuvotronics, LLCInventors: David W. Sherrer, Jean-Marc Rollin
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Patent number: 8031037Abstract: Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.Type: GrantFiled: October 29, 2009Date of Patent: October 4, 2011Assignee: Nuvotronics, LLCInventors: David W. Sherrer, William D. Houck
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Patent number: 7948335Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.Type: GrantFiled: June 20, 2008Date of Patent: May 24, 2011Assignee: Nuvotronics, LLCInventors: David W. Sherrer, John J. Fisher
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Patent number: 7898356Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.Type: GrantFiled: March 20, 2008Date of Patent: March 1, 2011Assignee: Nuvotronics, LLCInventors: David W. Sherrer, Jean-Marc Rollin
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Patent number: 7888793Abstract: Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second surface to the layer, the via hole having a first perimeter at the first surface; (d) forming an aperture in the layer, wherein the aperture has a second perimeter within the first perimeter; and (e) providing a conductive structure for sealing the via structure. Also provided are sealed via structures, methods of detecting leakage in a sealed device package, sealed device packages, device packages having cooling structures, and methods of bonding a first component to a second component.Type: GrantFiled: October 31, 2006Date of Patent: February 15, 2011Assignee: Nuvotronics, LLCInventors: David W. Sherrer, Larry J. Rasnake, John J. Fisher
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Patent number: 7781727Abstract: Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.Type: GrantFiled: March 25, 2008Date of Patent: August 24, 2010Assignee: Nuvotronics, LLCInventors: David W. Sherrer, Noel A. Heiks
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Patent number: 7597488Abstract: Provided are optical assemblies which allow for optical and mechanical connection between an optical bench and an optical fiber connector. The invention finds particular applicability in the optoelectronics industry in forming micro-optical components.Type: GrantFiled: June 1, 2006Date of Patent: October 6, 2009Assignee: Nuvotronics LLCInventor: John J. Fisher
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Patent number: 7508065Abstract: Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second surface to the layer, the via hole having a first perimeter at the first surface; (d) forming an aperture in the layer, wherein the aperture has a second perimeter within the first perimeter; and (e) providing a conductive structure for sealing the via structure. Also provided are sealed via structures, methods of detecting leakage in a sealed device package, sealed device packages, device packages having cooling structures, and methods of bonding a first component to a second component.Type: GrantFiled: October 31, 2006Date of Patent: March 24, 2009Assignee: Nuvotronics, LLCInventors: David W. Sherrer, Larry J. Rasnake, John J. Fisher
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Patent number: 7449784Abstract: Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second surface to the layer, the via hole having a first perimeter at the first surface; (d) forming an aperture in the layer, wherein the aperture has a second perimeter within the first perimeter; and (e) providing a conductive structure for sealing the via structure. Also provided are sealed via structures, methods of detecting leakage in a sealed device package, sealed device packages, device packages having cooling structures, and methods of bonding a first component to a second component.Type: GrantFiled: October 31, 2006Date of Patent: November 11, 2008Assignee: Nuvotronics, LLCInventors: David W. Sherrer, Larry J. Rasnake, John J. Fisher