Abstract: A plasma processing apparatus for performing a plasma process on a target substrate includes a process container configured to accommodate the target substrate and to reduce pressure therein. A first electrode is disposed within the process container. A supply system is configured to supply a process gas into the process container. An electric field formation system is configured to form an RF electric field within the process container so as to generate plasma of the process gas. A number of protrusions are discretely disposed on a main surface of the first electrode and protrude toward a space where the plasma is generated.

Abstract: A plasma processing apparatus for performing a plasma process on a target substrate includes a process container configured to accommodate the target substrate and to reduce pressure therein. A first electrode is disposed within the process container. A supply system is configured to supply a process gas into the process container. An electric field formation system is configured to form an RF electric field within the process container so as to generate plasma of the process gas. A number of protrusions are discretely disposed on a main surface of the first electrode and protrude toward a space where the plasma is generated.

Abstract: A wiring substrate for mounting electronic parts and a method for manufacturing the same are provided. The wiring substrate includes a substrate that includes a first surface, a second surface and a plurality of through-holes that extend through the substrate from the first surface to the second surface so as to define a plurality of inner walls respectively. The wiring substrate further includes an external conductor that is formed on at least one of the first surface or the second surface of the substrate. A through-hole conductor is formed on one of the plurality of inner walls so as to define a through-hole conductor space and so as to be electrically connected to the external conductor. Also included is a conductive post with first and second post ends, the first post end being positioned in the through-hole conductor space such that the first post end is in contact with and is electrically connected to the through-hole conductor, and the second post end projects out of the conductor space.

Abstract: The present invention relates to a semiconductor device in which an electrode of a device formed on a substrate such as a semiconductor wafer and an electrode of a wiring structure such as an interposer are connected to each other through a connecting electrode extending through the substrate, and a method of manufacturing the same. A semiconductor device according to the present invention comprises a first substrate including a front surface and a back surface, a first device having a first electrode being formed on the front surface; and a wiring structure formed with a second electrode, the wiring structure having a principal surface. The first electrode of the first device and the second electrode of the wiring structure are connected to each other by a connecting electrode extending through the first substrate from the front surface to the back surface thereof. Substantially all the back surface of the first substrate is bonded to the principal surface of the wiring structure.

Abstract: Test sound wave is outputted from a speaker. A movable part of a three-axis acceleration sensor, which is a micro structure of a chip to be tested TP, moves due to the arrival of the test sound wave which is compression wave outputted from the speaker, that is, due to air vibrations. A change in the resistance value that changes in accordance with this movement is measured on the basis of an output voltage that is provided via a probe needles. A control part determines the property of the three-axis acceleration sensor on the basis of the measured property values, that is, measured data.

Abstract: An opening 22d of a supply/withdrawal passage 22b is positioned at the center part of the internal wall surface 22c of the operating chamber 26 (concave area 22a), and a pin 24 that protrudes toward the diaphragm 23 is provided in a position that is offset from the center of the wall surface 22c. When the diaphragm 23 is deformed toward the operating chamber 26 by the suction of an operation air into the operating chamber 26 during drawing in the chemical liquid, a part of the diaphragm 23 opposing to the pin 24 rides on the pin 24 and this part becomes a slightly convex shape toward the pump chamber 25. When the operation air is supplied from the opening 22d into the operating chamber 26 during the discharge of the chemical liquid, the deformation begins first from the part of the diaphragm 23 riding on the pin 24.

Abstract: The invention has an object to provide a flow path block capable of reducing pressure loss, providing an extremely long flow path and a complex flow path, and achieving weight reduction, and a manufacturing method thereof. A flow path block (1) comprises a block body (11) formed with through holes (21) and a groove (22) communicating with the through holes (21) and a lid member (12) which covers the groove (22). The groove (22) can be formed with any depth and width by a cutting tool to reduce pressure loss. The groove (22) can also be formed in a long shape by the cutting tool, so that a very long flow path can be provided when the groove (22) is covered with the lid member (12). The groove (22) can be made freely by the cutting tool to provide a complex flow path. Further, the thickness of the block body (11) can be reduced to achieve weight reduction.

Abstract: An opening 22d of a supply/withdrawal passage 22b is positioned at the center part of the internal wall surface 22c of the operating chamber 26 (concave area 22a), and a cross-shaped venting groove 22e extending from the opening 22d of the passage 22b to the periphery of the wall surface 22c is formed in the wall surface 22c. Thus, an operating air in the chamber 26 is discharged (sucked) through the passage 22b during drawing in the chemical liquid.

Abstract: A chemical liquid supply system that prevents the generation of heat during operation in a pump and allows downsizing the discharge pump for instilling a chemical liquid from a tip nozzle. Compressed air is supplied to an upper space of a resist bottle and the chemical liquid is conferred positive pressure and sent out to a pump chamber of a discharge pump, thereby the pump chamber is filled with a resist liquid. This eliminates the need of a conventional construction where a spring or others are used to drive a flexible membrane of the discharge pump to the operation chamber side to take in the resist liquid. As a result, no electric motor is used, so there is obviously no risk of heat damage to a semiconductor wafer and the discharge pump itself can be further downsized.

Abstract: [Problem] To always perform accurate pressure feedback control, and control the discharge flow rate of liquid chemical with high precision, even in situations in which the pressure setting value of the operation pressure differs due to changes in the type of liquid chemical, etc. [Means of solution] A pump 11 has a pump chamber 13 and an operation chamber 14 separated by a diaphragm 12 comprised of a flexible membrane, and performs the intake and discharge of liquid chemical in accordance with the change in pressure inside the operation chamber 14. An electro-pneumatic regulator 32 supplies operation air to the operation chamber 14. In addition, in the present system, a plurality of pressure sensors 51, 63 having different pressure detection ranges is provided as pressure detection means for detecting the operation air pressure.

Abstract: A semiconductor device that improves the heat cycle resistance and power cycle resistance of a power module. An electrode member in which copper posts are formed in a plurality of perforations cut in a support made of a ceramic material is soldered onto a side of an IGBT where an emitter electrode is formed. By soldering the copper posts onto the electrode, heat generated in the IGBT is transferred to the electrode member and is radiated. In addition, even if a material of which the IGBT is made and copper differ in thermal expansivity, stress on a soldered interface is reduced and distortion is reduced. This suppresses the appearance of a crack. As a result, the heat cycle resistance and power cycle resistance of a power module can be improved.

Abstract: The present invention relates to a semiconductor device in which an electrode of a device formed on a substrate such as a semiconductor wafer and an electrode of a wiring structure such as an interposer are connected to each other through a connecting electrode extending through the substrate, and a method of manufacturing the same. A semiconductor device according to the present invention includes a first substrate including a front surface and a back surface, a first device having a first electrode being formed on the front surface; and a wiring structure formed with a second electrode, the wiring structure having a principal surface. The first electrode of the first device and the second electrode of the wiring structure are connected to each other by a connecting electrode extending through the first substrate from the front surface to the back surface thereof. Substantially all the back surface of the first substrate is bonded to the principal surface of the wiring structure.

Abstract: A zero-point detecting method of this invention is performed prior to testing the electrical characteristics of a wafer by bringing an object to be tested on a stage and probes of a probe card into contact with each other. The surface of a zero-point detection plate is made of a conductive material (e.g., copper). The zero-point detection plate is used to detect a zero point as a position where the surface of the object to be tested comes into contact with the probe pins.

Abstract: A plasma processing apparatus for performing a plasma process on a target substrate includes a process container configured to accommodate the target substrate and to reduce pressure therein. A first electrode is disposed within the process container. A supply system is configured to supply a process gas into the process container. An electric field formation system is configured to form an RF electric field within the process container so as to generate plasma of the process gas. A number of protrusions are discretely disposed on a main surface of the first electrode and protrude toward a space where the plasma is generated.

Abstract: An object of the present invention is to provide to an electron beam tube and electron beam extraction window capable of generating high output electron beam by effectively releasing heat generated when an electron beam passes through a window whereby temperature rise of the window is controlled and breakage of the window is prevented. The electron beam tube comprises first projections continuously provided on a first surface of the window, and second projections which are continuously formed on a second surface of the window and are located in positions corresponding to areas between the first projections wherein a projection height of the second projection, a projection width of the second projection and a distance between the adjacent second projections are smaller than those of the first projections, respectively.