Abstract: A connector assembly having a receptacle connector and a plug connector coupled thereto. The plug connector includes: a signal pin having one side in electrical contact with a signal line of a cable and the other side in elastic contact with a clip pin of the receptacle connector; a shield can enclosing the signal pin; a first insulating member coupled to the signal pin; and a plug shell enclosing an upper surface and a side surface of the shield can. The receptacle connector includes: a clip pin having a lower portion contacting a signal pad of a circuit board and an upper portion in elastic contact with the other side of the signal pin; a receptacle base installed on the circuit board and providing a space for the clip pin; and a second insulating member coupled to the clip pin and enclosing the side surfaces of the clip pin.

Abstract: A pogo pin whose elastic force can be adjusted according to a contacting direction is disclosed. According to an aspect of the present invention, provided is a pogo pin with adjustable elastic force, including: a housing; plunger pins mounted on ends of the housing to directly contact a measurement object; and a spring installed inside the housing to provide elastic force so that the plunger pin contacts the measurement object, wherein a local fixing part protruding inward is formed on one side of the housing so that a first position of the spring can be pressed and fixed.

Abstract: A plug connector according to the present invention is a plug connector coupled to a receptacle connector, the plug connector comprising: a conductor for signals; a ring-shaped conductor for ground, the conductor surrounding the conductor for signals; a ring-shaped insulator surrounding the conductor for signals and being surrounded by the conductor for ground, and insulating between the conductor for signals and the conductor for ground; a lower body; and an upper body coupled onto the lower body, wherein the conductor for signals includes a lower portion protruding below a first portion on the insulator, a middle portion inserted into a hollow portion of the first portion, and an upper portion protruding above the first portion, and the conductor for ground includes a lower portion protruding below the first portion and an upper portion surrounding the first portion, and the lower body includes a lower housing having a hollow portion that is vertically opened, wherein the upper portion of the conductor for

Abstract: A microelectromechanical system (MEMS) film for a test socket is arranged between a semiconductor device and a test apparatus for performing an electrical test of the semiconductor device and includes a flexible bare film and a plurality of round-type MEMS bumps on the bare film, each of the MEMS bumps being formed on the bare film by using a MEMS processing technique, having an electrical contact with an electrode pad of the test apparatus or a conductive ball of the semiconductor device, and having a contact surface rounded from an edge side toward a center side in a convex manner in a direction toward the electrode pad or the conductive ball.

Abstract: In order to provide an anisotropic conductive sheet which can be applied to more finely and more narrowly pitched electrodes and also to provide spring electrodes applied for the anisotropic conductive sheet, the spring electrodes manufactured as follows. A part having a bending leaf spring shape is formed out of a monocrystal silicon by anisotropic etching and gold is plated on the surface of the part so as to obtain a silicon spring electrode 1. The silicon spring electrodes 1 are inserted in through holes formed on a silicone rubber sheet and fixed to the through holes.

Abstract: In order to provide an anisotropic conductive sheet which can be applied to more finely and more narrowly pitched electrodes and also to provide spring electrodes applied for the anisotropic conductive sheet, the spring electrodes manufactured as follows. A part having a bending leaf spring shape is formed out of a monocrystal silicon by anisotropic etching and gold is plated on the surface of the part so as to obtain a silicon spring electrode 1. The silicon spring electrodes 1 are inserted in through holes formed on a silicone rubber sheet and fixed to the through holes.