Abstract: The invention relates to an organic light emitting diode device having an electrode sheet of a light emitting area and an electrode contact in contact with the electrode sheet, to a method for forming such OLED device and to method of operating such OLED device. In order to provide such OLED device having a reduced tendency for the occurrence of hot spots, the present invention provides for reducing a local and/or average regional current density of a current flowing in operation of the lighting device through an interface between the electrode sheet and the electrode contact in a corner area of the interface.

Abstract: The invention relates to a fabrication apparatus for fabricating a patterned layer (18) on a substrate (14). Protective material (17) is applied in second regions on the substrate (14) and liquid layer material (18) is then printed in first regions being different to the second regions on the substrate (14). The layer material (18) is dried by heating the layer material (18) to a drying temperature being smaller than a melting temperature of the protective material (17), before removing the protective material (17) from the substrate (14) by using a removing temperature being larger than the melting temperature of the protective material (17). A patterned layer (18) can therefore be produced, without using, for example, a costly photolithography process, and because of the use of the protective material (17) the layer material (18) is present in the desired first regions only and not in the second regions. This improves the quality of the patterned layer, which may be used for producing an OLED.

Abstract: An electroluminescent device (10) comprising a substrate (40) and on top of the substrate (40) a substrate electrode (20), a counter electrode (30) and an electroluminescent layer stack with at least one organic electroluminescent layer (50) arranged between the substrate electrode (20) and the counter electrode (30), characterized in that at least one image carrier body (200) is at least partially arranged on the substrate electrode (20), suitable to influence the appearance of the device (10).

Abstract: The present invention relates to silyl- and heteroatom-substituted compounds selected from carbazoles, dibenzofurans, dibenzothiophenes and disilylbenzophospholes of the formula (I) or (I*), to the use of the compounds of the formula (I) or (I*) in organic electronics applications, preferably in organic light-emitting diodes, to an organic light-emitting diode comprising at least one compound of the formula (I) or (I*), to a light-emitting layer comprising at least one compound of the formula (I) or (I*), to a blocking layer for holes/excitons comprising at least one compound of the formula (I) or (I*), and to an apparatus selected from the group consisting of stationary visual display units, mobile visual display units, illumination units, keyboards, items of clothing, furniture and wallpaper, comprising at least one inventive organic light-emitting diode.

Abstract: The invention relates to a light emitting device (1) comprising a substrate (5), a transparent anode layer (7), a cathode layer (9), a light emitting layer (8) between the anode and cathode layers, and an intermediate layer (4) between the substrate and the anode layer. An electrically conducting element is embedded in the intermediate layer such that it is in contact with the anode layer. Also, scattering particles for scattering the light are embedded in the intermediate layer, increasing the light outcoupling efficiency of the device. Since the electrically conducting element is embedded in the intermediate layer and not, for instance, on top of the anode layer, i.e. not in between the anode and cathode layers, the sheet resistance of the anode layer can be reduced, without requiring a passivation layer which may adversely affect the light emitting material.

Abstract: The invention relates to an illuminant (23) and a socket (20) for a lamp (15). The features of the socket can be implemented also independently of the features of the illuminant (23). The socket has supply terminal areas on multiple sides of the socket housing such that the socket (20) can be selectively supplied with electricity and wired from different sides or also simultaneously from multiple sides. Independently of the number and the arrangement of the supply terminal areas (94), multiple electrical supply terminals (95) having the same polarity are provided on the socket (20). Said supply terminals (95) having the same polarity are electrically short-circuited by means of a shorting connector (116), in particular two identical shorting connectors (116) being arranged in the socket housing. Said socket (20) and illuminant (23) modularly achieve large total illumination surfaces in a lamp (15) and an appealing appearance in a very simple manner.

Abstract: The present invention relates to a method of manufacturing a light emitting device with improved internal out-coupling by providing an intermediate layer (11) with a modulated surface. This is achieved by exposure of a flat glass surface (100) to a saturated etching fluid or by providing local changes in the chemical surface composition of the glass substrate or by depositing locally separated sub-?m particles. By removal of the etching fluid, either ultrafine particles (12) are deposited or defects are generated consisting of glass component areas of sub^m-size extension with a high sticking coefficient with respect to the species deposited later on from the gas phase.

Abstract: The invention relates to an electroluminescent lighting device, which is based on an array of standard electroluminescent tiles (D1-Dn) combined with an array of ballast components (R1-Rn) mounted on a carrier board (30) in such a way that the power loss is evenly spread across the whole board area to minimize local electric power in the ballast components. The unavoidable remaining hot spots and electroluminescent tiles are thermally coupled in such a way that the additional thermal load on the electroluminescent emission layer is as symmetric as possible with respect to the self heating of the electroluminescent device. This can be achieved by a combination of properly designed heat spreading and thermal isolation of the electroluminescent and ballast components. Heat spreading is achieved by a properly designed interconnection structure (40) on the carrier board. Different options are proposed to thermally isolate the electroluminescent tiles from the hot spots.