Abstract: An improved process for purifying a nickel plating bath including a pyridine composition as an additive and which bath contains a breakdown product of the pyridine composition. The process has the following steps:a. adjusting the pH of the nickel plating bath to a pH of equal to or greater than 5.0;b. adding an effective amount of an oxidizing agent; andc. removing the breakdown product from the nickel plating bath.

Abstract: The present invention relates to compositions and methods for providing a corrosion-resistant coating on a zinc-cobalt alloy surface said surface with a hexavalent chromium-containing treatment solution. In a preferred embodiment, the solution comprises:(a) about 2 to about 30 g/l of CrO.sub.3 ;(b) 0 to about 25 g/1 of dichromate ion such that the total Cr.sup.+6 is about 1 to about 35 g/l;(c) about 0.5 to about 20 g/l of NH.sub.4.sup.+ ; and(d) about 5 to about 30 g/l of formate ion.The solution additionally comprises:(e) about 2 to about 25 g/l of Cl.sup.- ; and has a pH controlled by the addition of HCl or NaOH of about 0.8 to about 2.5. The solution is substantially-free of sulfate, chlorate and nitrate. In one embodiment, the formate is optional and low levels of Cr.sup.+6 are employed.

Abstract: The production of uniformly blackened nickel deposits for decorative or functional purposes can be achieved by depositing nickel from an electroless nickel plate composition or electrolytically followed by forming a conversion coating on the electroless nickel deposit in a chromate bath which includes nitrate ions.

Abstract: A process for electroplating copper from an aqueous alkaline non-cyanide bath has improved resistance to degradation. At least a portion of the plating bath is subjected to electrolysis by an insoluble anode to which the current is controlled independently from the current to the soluble copper anode in order to reduce the level of bath impurities and maintain the quality of the deposit.

Abstract: An improved aqueous acidic electrolyte suitable for electrodepositing zinc alloys comprising a combination of zinc and at least one metal selected from the group consisting of nickel, cobalt, iron, and mixtures thereof incorporating an effective amount of an additive agent for providing improved grain-refinement and enhancing the adjustment of the codeposition of the alloying metals in the zinc alloy deposit. The additive agent comprises a bath soluble polyhydroxy compound having three or more hydroxyl groups at least one of which is substituted with a polyoxyalkylene group.The present invention further encompasses the process of employing the aforementioned electrolyte for the deposition of functional and decorative zinc alloy electrodeposits.

Abstract: An aqueous composition is provided for treating a laminate in the manufacture of a printed circuit board, the composition comprising a wetting agent, which has a positively charged quaternary nitrogen atom, and a reducing agent which is compatible with the wetting agent. Preferably the reducing agent is hydroxylamine or one or more of its salts, but oxalic acid or one or more oxalates may, alternatively or as well, be used. The compatibility of the wetting and reducing agents enables the number of process steps to be reduced.

Abstract: An aqueous initiator solution and process for rejuvenating such initiator solutions and for prolonging the useful operating life thereof by which copper and copper alloy substrates are treated therein to render them receptive to a subsequent electroless nickel plating step. The detrimental effects of progressive contamination of such aqueous initiator solutions with metal ion complexing agents during commercial use and/or precipitation of the noble metal ions which pregressively impairs the oprativeness of such activator solutions is overcome in accordance with the present invention by the addition of controlled amounts of ferric ions effective to maintain at least a sufficient portion of the noble metal ions in solution in a noncomplexed condition whereby the initiator solution is effective to pretreat the copper substrate prior to electroless nickel plating.

Abstract: A method of passivating a zinc-cobalt alloy, which alloy has a cobalt content of 0.1-2%, by contacting the alloy with an aqueous composition which has a pH of 0.5-2.5 and contains hexavalent chromium, hydrogen ions to provide the pH, chloride ions and sulfate ions and which may also contain nickel and/or cobalt ions.

Abstract: An improved electrolytic apparatus and process particularly applicable for high-speed electrodeposition of a metallic plating on a substrate such as on a printed wiring board of the type employed in the electronic industry. The apparatus employs a manifold assembly adapted to be immersed in the electrolyte and positioned adjacent to each of the anodes immersed therein for withdrawing electrolyte past the anode to provide a controlled rate of flow across the anode surface to achieve a substantially uniform mass transport rate across the fluid film on the surface of the anode. The apparatus is also adapted for returning at least a portion of the withdrawn electrolyte to the tank which can be arranged so as to impinge upon the article being plated.

Abstract: An improved aqueous acidic electrolyte suitable for electrodepositing zinc alloys comprising a combination of zinc and at least one metal selected from the group consisting of nickel, cobalt, iron, and mixtures thereof incorporating an effective amount of an additive agent for providing improved grain-refinement and enhancing the codeposition of the alloying metals in the zinc alloy deposit. The additive agent comprises a bath soluble terminally substituted polyoxyalkylene compound derived from the sulfation, amination, phosphating, chlorination, bromination, phosphonation, and sulfonation as well as combinations thereof;(a) The polymerization of alkylene oxides selected from the group consisting of ethylene oxide, propylene oxide, glycidol, butylene oxide and mixtures thereof; and(b) the alkoxylation of mono and polyhydroxy compounds selected from the group consisting of hydroxyl containing alkyl, alkenyl, alkynyl, aryl, as well as mixtures thereof.

Abstract: An aqueous bath suitable for electrodepositing zinc and alloys of zinc including zinc-nickel, zinc-cobalt, zinc-nickel-cobalt, zinc-iron, zinc-iron-nickel, zinc-iron-cobalt, and zinc-nickel-cobalt-iron containing a brightening amount of an AABB-type polyamide brightener in an amount effective to produce an electrodeposit of the desired brightness. The invention further contemplates the process of electrodepositing zinc and zinc alloys of the foregoing types on a conductive substrate employing the aqueous electrolyte.

Abstract: The difficulties associated with electroplating palladium metal or alloy deposits from palladium diammino dichloride, palladium diamino dinitrite and palladium triammino sulphite baths can be avoided by plating from palladium baths containing oxalate. The palladium and oxalate may be in a single complex, such as palladium diamino oxalate, (Pd(NH.sub.3).sub.2 C.sub.2 O.sub.4), palladium tetraamino oxalate (Pd(NH.sub.3).sub.4 C.sub.2 O.sub.4) or an ammonium or alkali metal salt of palladium dioxalate (M.sub.2 Pd(C.sub.2 O.sub.4)).sub.2), where M represents an ammonium or alkali metal cation.Alloying metal ions may also be present, as may an electrolyte, a brightener and/or a stress reducer.

Abstract: An aqueous acidic electrolyte of the chloride, sulfate and mixed chloride-sulfate types suitable for electrodepositing a zinc-nickel alloy on a conductive substrate comprising an aqueous solution containing zinc ions and nickel ions, and an additive agent of a class selected from the group consisting of (a) aromatic sulfonic acids, (b) aromatic sulfonamides, sulfonimides and mixed carboxamides/sulfonamides, (c) acetylene alcohols as well as the bath soluble and compatible salts and mixtures thereof. The invention further encompasses the process for electrodepositing a zinc-nickel alloy employing the aforementioned electrolyte.

Abstract: An improved electrolytic apparatus and process particularly applicable for high-speed electrodeposition of a metallic plating on a substrate such as on a printed wiring board of the type employed in the electronic industry. The apparatus employs a manifold assembly adapted to be immersed in the electrolyte and positioned adjacent to each of the anodes immersed therein for withdrawing electrolyte past the anode to provide a controlled rate of flow across the anode surface to achieve a substantially uniform mass transport rate across the fluid film on the surface of the anode. The apparatus is also adapted for returning at least a portion of the withdrawn electrolyte to the tank which can be arranged so as to impinge upon the article being plated.

Abstract: An improved process and aqueous electrolyte for imparting improved corrosion resistance to chromium substrates, and particularly nickel-plated substrates having a chromium plating thereover deposited from a trivalent chromium electrolyte. The post-treating solution contains solution soluble and compatible hexavalent chromium compounds including chromates and dichromates present in an amount sufficient to deposit a protective film on the chromium substrate and phosphate ions present in an amount of about 2.5 g/l up to the limit of solubility in the electrolyte. The electrolyte optionally, but preferably, further contains a buffering agent present in an amount to stabilize the pH of the solution within a range from about 2.5 up to about 10.

Abstract: Copper may be deposited non-electrolytically from a composition comprising copper ions, a complexor to keep the copper ions in solution, and glyoxylate ions as a reducing agent. The use of formaldehyde is therefore avoided.

Abstract: A citrate-free electroplating bath for the high speed deposition of gold alloy plates on substrates comprises a source of gold (for example gold (I) potassium cyanide), a source of alloying metal (for example, nickel sulfate), oxalic acid and formic acid. As citrate is not used, higher plating speeds are obtained and precipitates of certain citrate salts (for example, nickel citrate) are avoided.

Abstract: An improved aqueous acidic electrolyte suitable for electrodepositing zinc alloys comprising a combination of zinc and at least one metal selected from the group consisting of nickel, cobalt, iron, and mixtures thereof incorporating an effective amount of an additive agent for providing improved grain-refinement and enhancing the codeposition of the alloying metals in the zinc alloy deposit. The additive agent comprises a bath soluble anionic carboxylated polyoxyalkylene compound derived from the carboxylation of:(a) the polymerization of alkylene oxides selected from the group consisting of ethylene oxide, propylene oxide, glycidol, butylene oxide and mixtures thereof; and(b) the alkoxylation of mono and polyhydroxy compounds selected from the group consisting of hydroxyl containing alkyl, alkenyl, alkynyl, aryl, as well as mixtures thereof.

Abstract: An aqueous acidic peroxide-free solution and process for treating receptive metal surfaces to impart a chromium passivate film thereon containing chromium ions substantially all of which are present in the trivalent state, hydrogen ions to provide a pH of about 1.2 to about 2.5, at least one additional metal ion selected from the group consisting of iron, cobalt, nickel, molybdenum, manganese, aluminum, lanthanum, cerium, lanthanide mixtures as well as mixtures thereof present in an amount effective to activate the formation of the chromate passivate film and nitrate ions as the essential oxidizing agent present in an amount to provide a mol ratio of nitrate ions to chromion ions and activating metal ions of at least about 4:1 and sufficient to activate the hydrated trivalent chromium to form a chromate film on the substrate.

Abstract: An improved electrolyte composition and process for electrodepositing bright, level and ductile copper deposits on a substrate enabling use of conventional electroplating equipment for high-speed copper plating employing average cathode current densities substantially higher than heretofore feasible. The electrolyte contains an additive system comprising carefully controlled relative concentrations of:(a) a bath soluble polyether compound;(b) a bath soluble organic divalent sulfur compound;(c) a bath soluble adduct of a tertiary alkyl amine with epichlorohydrin; and(d) a bath soluble reaction product of polyethyleneimine and an alkylating agent.