Abstract: An improved process for producing a composite nickel-containing electroplate on a substrate including an inner nickel-containing layer, of an average sulfur content of less than about 0.03 percent by weight, an intermediate nickel-containing layer of an average sulfur content of about 0.05 to about 0.5 percent by weight and an adjacent adherent outer nickel layer of an average sulfur content of about 0.02 to about 0.15 percent but less in sulfur than the intermediate layer and higher in sulfur than the inner layer. The controlled amount of sulfur is introduced into at least the intermediate layer by employing an aqueous acidic nickel solution containing a controlled amount of a thiazole and/or thiazoline additive compound so as to provide an intermediate nickel-containing deposit containing the specified average sulfur content.

Abstract: A palladium electroplating bath capable of plating highly ductile palladium metal. The bath comprises a palladium amine complex salt as a source of the palladium metal, ammonium sulfate, an ammonium halide, an alkali metal pyrophosphate, a stress reducing agent, and a minor amount of cyanide ions. In general, the cyanide ions are furnished to the bath by the addition of alkali metal cyanide. The pH of the bath will range from about 7 to 9. Electrolytic deposition will be carried out at a temperature of from about 50 to 80 degrees C. at high current densities up to about 3000 ASF. The method of depositing ductile palladium foil on a variety of substrates is also described and claimed.

Abstract: An aqueous acidic electrolyte and process for electrodepositing zinc alloys comprising zinc-nickel, zinc-cobalt and zinc-nickel-cobalt on a conductive substrate incorporating a brightener system including a ductilizing agent present in an amount sufficient to reduce stress and fracturing of the zinc alloy electrodeposit providing for improved corrosion resistance of the deposit. The ductilizing agents are sulfonates of an aldehyde or ketone.

Abstract: An improved aqueous acidic zinc electrolyte and process for electrodepositing zinc on a conductive substrate in which the electrolyte contains a brightening amount of a bath soluble anionic sulfated polyoxyalkylene surfactant derived from the sulfation of:(a) the polymerization of alkylene oxides selected from the group consisting of ethylene oxide, propylene oxide, glycidol, butylene oxide and mixtures thereof; and(b) the alkoxylation of mono and polyhydroxy compounds having radicals selected from the group consisting of hydroxyl containing alkyl, alkenyl, alkynyl, aryl, and carboxylic derivatives thereof as well as mixtures thereof.The zinc electrolyte can further contain conventional additives and agents of the types employed in acid zinc electrolytes to provide modifications and desired characteristics of the zinc electrodeposit.

Abstract: An improved aqueous cyanide-free electrolyte and process for depositing ductile, fine-grained adherent copper deposits on conductive substrates in which the electrolyte contains copper ions in an amount sufficient to electrodeposit copper, a complexing agent present in an amount sufficient to complex an effective amount of the copper ions present, a bath soluble and compatible buffering agent present in an amount sufficient to stabilize the pH of the electrolyte, hydroxyl and/or hydrogen ions present in an amount to provide a pH of about 6 to about 10.5, and sulfamic acid and the bath soluble and compatible salts thereof present in an amount effective to increase the anode efficiency during the electrodeposition of copper from said electrolyte. The electrolyte can optionally, but preferably further contain ammonium ions in combination with the sulfamic acid constituent to further enhance the anode efficiency and a wetting agent present in an amount up to about 2 g/l.

Abstract: An aqueous acid electroplating solution and process for electrodepositing an adherent, ductile zinc, zinc-cobalt, zinc-nickel, zinc-cobalt-nickel alloy deposit on a conductive substrate which contains a comparatively low concentration of boric acid to inhibit formation of bath insoluble polyborate compounds and contains an effective amount of a polyhydroxy additive agent containing at least 3 hydroxyl groups and at least 4 carbon atoms of the structural formula: ##STR1## as hereinafter more specifically defined. The electroplating solution further contains conventional acid zinc and zinc alloy bath constituents and supplemental additive agents of the types known in the art.

Abstract: An aqueous concentrate adapted for dilution with water for use in the make-up and replenishment of zinc or zinc alloy electroplating baths of the chloride and the mixed chloride types comprising an aqueous solution containing zinc chloride in an amount of about 10 to about 400 g/l, a hydrophobic organic brightening agent selected from the group consisting of aryl aldehydes, halo aryl aldehydes, aryl alkenyl ketones, aryl alkenyl aldehydes, heterocyclic alkenyl ketones and aldehydes as well as mixtures thereof generally present in an amount of about 10 up to about 200 g/l and a solubilizing agent comprising an alkyl phenyl sulfonate compound present in an amount of at least about 10 g/l up to an amount in consideration of the concentration of the zinc chloride and organic brightening agent present in the concentrate.

Abstract: A plating cell for plating edge connector tabs of printed circuit boards comprises a pair of anode structures 119, each of which has a pair of elongate anodic platinized titanium plates 131 spaced apart by an anode divider 150. Castellations in the anode structures give rise to holes 132 through which electrolyte can flow. By means of this configuration of the anode structures an even deposit of plated metal may be obtained.

Abstract: An aqueous bath suitable for electrodepositing zinc and alloys of zinc including zinc-nickel, zinc-cobalt, zinc-nickel-cobalt, zinc-iron, zinc-iron-nickel, and zinc-iron-cobalt containing a brightening amount of an AB-type polyamide brightener in an amount effective to produce an electrodeposit of the desired brightness. The invention further contemplates the process of electrodepositing zinc and zinc alloys of the foregoing types on a conductive substrate employing the aqueous electrolyte.

Abstract: Particular electroplating baths suitable for obtaining white deposits of palladium metal. The bath comprises (a) palladosamine chloride; (b) an ammonium salt such as ammonium sulfate or ammonium chloride; (c) chloride ions; and (d) a brightener selected from the group of organic brighteners, inorganic brighteners, and mixtures thereof. The process of using such electroplating baths to produce white deposits of palladium metal on substrates is also disclosed and claimed.

Abstract: A plating barrel is constructed of a perforated cylindrical side section clamped between a pair of end plates. The end plates are provided with positioning grooves that receive edge portions of the side section. Each end plate includes a plurality of concentric grooves so that the same end plates may be used with side sections of different diameters. The barrel is rotatably mounted on a support disposed within a seamless tank containing a plating bath. The support has adjustable upstanding arms which rotatably support the barrel and permit the height thereof to be adjusted for controlling the extent to which the barrel is immersed in the plating bath, with such adjustment being dictated in part by the extent of the areas to be plated and the number of work pieces in the barrel.

Abstract: An improved aqueous electroless nickel plating bath and process for chemically depositing nickel on a substrate comprising an aqueous solution containing nickel ions, hypophosphite ions, a complexing agent, preferably a buffering agent and a wetting agent, and a small but effective amount of a sulfonium betaine compound sufficient to control the rate of nickel deposition and the concentration of phosphorus in the nickel deposit, preferably, in further combination with supplemental organic and/or inorganic rate stabilizers. The invention further contemplates a process for rejuvenating an electroless nickel bath which has been rendered inoperative due to the presence of excessive concentrations of supplemental stabilizing agents by the addition of a controlled effective amount of a sulfonium betaine compound sufficient to restore the bath to an operative plating condition.

Abstract: An improved composition for selectively stripping gold from a metal substrate, especially copper metal, wherein the gold deposit is rapidly and effectively stripped without an attendant attack on the metal substrate. A minor amount of an organo mercapto compound, e.g. mercaptobenzothiazole, is added to the stripping composition to inhibit attack on the metal substrate.

Abstract: An aqueous acidic trivalent chromium electrolyte and process for electrodepositing chromium platings comprising an electrolyte containing trivalent chromium ions, a complexing agent, halide ions, ammonium ions and a reducing agent comprising an ion selected from the group consisting of scandium, yttrium, lanthanum, titanium, zirconium, hafnium, molybdenum, arsenic, selenium, tellurium, cerium, uranium, and tin present in an amount effective to maintain the concentration of hexavalent chromium ions formed in the bath at a level at which satisfactory chromium electrodeposits are obtained.

Abstract: An aqueous acidic trivalent chromium electrolyte and process for electrodepositing chromium platings comprising an electrolyte containing trivalent chromium ions, a complexing agent, halide ions, ammonium ions and a reducing agent comprising a metal ion selected from the group consisting of Gold, Silver, Platinum, Palladium, Rhodium, Iridium, Osmium, Ruthenium, Rhenium, Gallium, Germanium, Indium, Samarium, Europium, Gadolinium, Terbium, Dysprosium, Holmium, Erbium, Thulium, Ytterbium, Lutetium, and Praseodymium present in an amount effective to maintain the concentration of hexavalent chromium ions formed in the bath at a level at which satisfactory chromium electrodeposits are obtained.

Abstract: Electroless gold plating baths for plating metallized ceramics wherein the bath comprises (a) alkali metal gold cyanide, (b) alkali metal fluoride, and (c) alkali metal hydroxide. The baths may optionally contain a buffering agent and/or ammonium hydroxide and/or an organic chelating agent. The metallized ceramics contain tungsten, molybdenum, electroless nickel, copper and the like. The gold constituent in the alkali metal gold cyanide may be monovalent, trivalent or mixtures thereof. The method of utilizing such electroless or autocatalytic plating baths is also described and claimed.

Abstract: Improved electroplating ternary gold alloy plating baths wherein the gold ingredient is an alkali metal auricyanide, the gold metal being in the plus three oxidation state, and the alloying metals are both cobalt and molybdenum. The electroplating baths also contain citric acid. A wetting agent or surfactant as well as a stress reducer-brightener are also advantageously utilized in the bath. The ternary alloys may be deposited on various electronic and decorative substrates, and the deposits were characterized by unique physical and mechanical properties. Most importantly, there is a substantial improvement in wear resistance. The method of utilizing such improved electroplating baths on various substrates is also described and claimed.

Abstract: A cyanide-free electrolyte and process for depositing a ductile, fine-grained, adherent copper plate usually of a thickness of about 0.015 to about 5 mils on ferrous-base, copper-base, zinc-base and the like conductive substrates. The electrolyte contains controlled effective amounts of cupric ions complexed with an organo-phosphonate chelating agent, an alkali carbonate as a bath stabilizing and buffering agent, hydroxyl ions to provide a pH on the alkaline side and preferably, a wetting agent. The copper plate is applied by electrolyzing the aforementioned electrolyte employing a combination of a bath soluble copper anode and an insoluble ferrite anode to provide a copper to ferrite anode surface area ratio within a range of about 1:2 to about 1:6.

Abstract: A process for electrodepositing chromium on a conductive substrate employing an electrolyte containing trivalent chromium ions, a complexing agent, and hydrogen ions to provide an acidic pH in which a conductive substrate to be electroplated is immersed in the electrolyte and is cathodically charged and current is passed between the substrate and an anode at least a portion of the surfaces of which is comprised of ferrite whereby the formation of detrimental hexavalent chromium ions in the electrolyte is inhibited and the stability of the pH of the electrolyte is improved.

Abstract: A process for depositing a ductile, fine-grained adherent copper plate on a conductive substrate employing an electrolyte containing controlled effective amounts of cupric ions, a complexing agent for the cupric ions, a bath stabilizing and buffering agent, and hydroxyl and/or hydrogen ions to provide a pH from about 6 to about 10.5. The process includes electrolyzing the aforementioned electrolyte employing a combination of a bath soluble copper anode and an insoluble nickel-iron alloy anode containing about 10 percent to about 40 percent by weight iron and about 0.005 to about 0.06 percent sulfur to provide a copper anode area to nickel-iron alloy anode surface area ratio within a range of about 1:2 to about 4:1. The invention further contemplates a novel nickel-iron alloy anode for use in the practice of the disclosed process.