Abstract: A method of preparing a sample for examination in a TEM, where the sample is attached to a probe tip point, uses a TEM sample holder form embodied in a TEM sample holder coupon. The probe-tip points and the TEM sample holder coupon are oriented with each other so that the sample is approximately centered in the TEM sample holder form. The probe-tip points are embedded in the TEM sample holder form by means of a press, simultaneously cutting off that portion of every probe-tip point outside the boundary of the TEM sample holder form and cutting the TEM sample holder free from the TEM sample holder coupon. The operation can be formed inside or outside of a focused ion-beam instrument.

Abstract: We disclose an apparatus and method for detecting probe-tip contact with a surface, generally inside a focused ion-beam instrument, where the probe tip is attached to a capsule, and the capsule is movably secured in a probe shaft. There is a fiber-optic cable having a first end and a second end; a beam splitter having first and second output ports; and a light source connected to the beam splitter. The first output port of the beam splitter is connected to the first end of the fiber-optic cable, and the second output port of the beam splitter is connected to a photodiode. The second end of the fiber-optic cable has a mirror for reflecting incident light at approximately a ninety-degree angle to the axis of the optical path in the fiber-optic cable and onto the capsule, so that the intensity of the light reflected back from the capsule through the fiber-optic cable is proportional to the deflection of the capsule as the probe tip makes contact with the surface.

Abstract: The preferred embodiment further includes a press for cutting a TEM sample holder from a TEM coupon and joining a probe-tip point with an attached sample to the TEM sample holder. The press includes: an outer die; an inner die situated inside the outer die; a former rod opposing the inner and outer dies; and, a shear punch situated coaxially with the former rod. A hold-down spring biases the former rod toward the inner die. A trigger or other mechanism responsive to the contact of the former rod and the inner die, and an actuator responsive to the trigger, drive the shear punch toward the inner and outer dies. This press can be located either inside or outside the vacuum chamber of the FIB or other analytical instrument.

Abstract: A kit for preparing TEM sample holders includes at least one TEM coupon made of a sheet of material and having one or more paths from its edge to a TEM sample holder form embodied in the TEM coupon. There is at least one hole in the coupon defining the outer boundary of the TEM sample holder form. This hole has a mouth that defines a land of material. This land connects the TEM sample holder form to the edge of the sheet. The kit preferably includes at least one probe tip, where the probe tip has a probe-tip point, and finally, a press. The press has inner and outer dies and a former rod opposing the inner and outer dies. A shear punch is situated coaxially with the former rod. Thus, when an actuator drives the shear punch toward the inner and outer dies, the shear punch severs the land and cuts an opening in the TEM sample holder form, and simultaneously the former rod presses the probe tip point or points into the sheet of material.

Abstract: A TEM sample holder is formed by cutting the TEM sample holder form from a coupon in a press. The cutting at the same time joins the tip point of a nano-manipulator probe tip with the formed TEM sample holder. The tip point of the probe has a sample attached for inspection in a TEM. The cutting process also creates a gap in the sample holder to allow for FIB milling of the specimen.

Abstract: A coupon for preparing a TEM sample holder comprises a sheet of material that includes a TEM sample holder form. There is at least one section of the sheet connecting the TEM sample holder form to other portions of the sheet. A TEM sample holder is formed by cutting the TEM sample holder form from the coupon in a press. The cutting joins the tip point of a nano-manipulator probe tip with the formed TEM sample holder. The tip point of the probe has a sample attached for inspection in a TEM.

Abstract: We disclose a method for analyzing the composition of a microscopic particle resting on a first sample surface. The method comprises positioning a micro-manipulator probe near the particle; attaching the particle to the probe; moving the probe and the attached particle away from the first sample surface; positioning the particle on a second sample surface; and, analyzing the composition of the particle on the second sample surface by energy-dispersive X-ray analysis or detection of Auger electrons. The second surface has a reduced or non-interfering background signal during analysis relative to the background signal of the first surface. We also disclose methods for adjusting the electrostatic forces and DC potentials between the probe, the particle, and the sample surfaces to effect removal of the particle, and its transfer and relocation to the second sample surface.

Abstract: A sample (180) is separated from an integrated circuit chip or a semiconductor wafer (100) for examination so that the resulting sample (180) can be moved to a location for examination by TEM, SEM or other means. A sample (180) portion of the chip or wafer (100) containing an area of interest is separated with a two cuts (140, 160) at two different angles (130, 170) by a focused ion-beam (120). Only after the sample (180) is separated is it fixed to a micromanipulator probe (190). The sample (180) is then moved by the probe (190) to the location for examination.

Abstract: When a desired portion is separated from an integrated circuit chip or a semiconductor wafer, the portion is separated so that the resulting sample can be moved to a location for examination by TEM, SEM or other means. A sample portion of the chip or wafer containing an area of interest is separated with a single cut by a focused ion-beam. Prior to separation, the sample is fixed to a micromanipulator probe. The sample is moved by the probe to the location for examination and fixed there. The probe is then detached from the sample by the focused ion-beam.