Abstract: Optical apparatus includes an acousto-optic medium and an array of multiple piezoelectric transducers attached to the acousto-optic medium. A drive circuit is coupled to apply to the piezoelectric transducers respective drive signals including at least first and second frequency components at different, respective first and second frequencies and with different, respective phase offsets for the first and second frequency components at each of the multiple piezoelectric transducers.

Abstract: A method for manufacturing includes coating a substrate (22) with a matrix (28) containing a material to be patterned on the substrate. A pattern is fixed in the matrix by directing a pulsed energy beam to impinge on a locus of the pattern so as to cause adhesion of the material to the substrate along the pattern without fully sintering the material in the pattern. The matrix remaining on the substrate outside the fixed pattern is removed, and after removing the matrix, the material in the pattern is sintered.

Abstract: An optical inspection system including a first multiplicity of cameras operative to image a second multiplicity of regions on an object, a third multiplicity of illumination sources and at least one illumination manager operative to combine illumination from the third multiplicity of illumination sources and thereafter to direct illumination therefrom to the second multiplicity of regions, the at least one illumination manager including a beam distributor receiving a composite input beam of a multiplicity of non-mutually coherent, spatially concentrated laser pulses and directing a multiplicity of composite output beams of a plurality of the non-mutually coherent, spatially concentrated laser pulses to a corresponding plurality of spatially distinct locations corresponding to the second multiplicity of regions.

Abstract: A non-mechanical contact signal measurement apparatus includes a first conductor on a structure under test and a gas in contact with the first conductor. At least one electron beam is directed into the gas so as to induce a plasma in the gas where the electron beam passes through the gas. A second conductor is in electrical contact with the plasma. A signal source is coupled to an electrical measurement device through the first conductor, the plasma, and the second conductor when the plasma is directed on the first conductor. The electrical measurement device is responsive to the signal source.

Abstract: A direct imaging system comprises an illumination unit comprising a plurality of light sources, the plurality of light sources configured to emit a plurality of beams, an optical system for forming the plurality of beams to be aligned in position or angle, an acoustic optical modulator positioned to receive the plurality of beams aligned in one of position or angle and to consecutively diffract different portions of the plurality of beams as an acoustic wave propagates in an acoustic direction, and a scanning element adapted to scan an exposure plane with the plurality of beams modulated by the acoustic optical modulator at a scanning velocity, wherein the scanning velocity is selected to incoherently unite the different portions of the plurality of beams into a single exposure spot.

Abstract: An apparatus and method for recovery and cleaning of broken substrates, especially beneficial for fabrication systems using silicon wafer carried on trays. Removal of broken wafers and particles from within the fabrication system is enabled without requiring disassembly of the system and without requiring manual labor. A placing mechanism moves a suction head to location of the broken substrate and a suction pump coupled to a flexible hose is used to remove the broken pieces. A hood is positioned at the inlet of the suction head, and setback extensions are provided at the bottom of the hood to allow air flow into the inlet and prevent thermal conductance from the tray to the hood. Pins are extendable about the inlet of the suction head to enable breakage of the wafer to smaller pieces for easy removal.

Abstract: A method for material deposition includes providing a transparent donor substrate (56, 60) having opposing first and second surfaces and multiple donor films (62, 64) including different, respective materials on the second surface. The donor substrate is positioned in proximity to an acceptor substrate (41), with the second surface facing toward the acceptor substrate. Pulses of laser radiation are directed to pass through the first surface of the donor substrate and impinge on the donor films so as to induce ejection of molten droplets containing a bulk mixture of the different materials from the donor films onto the acceptor substrate.

Abstract: An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.

Abstract: A method for auto-sequencing of plasma processing system for concurrent processing of several substrates. The method autonomously sequence processing and move substrates in different directions as necessary. The method moves two substrate trays together into the processing chamber for substrate exchange, and remove the trays from the chamber one at a time. When needed, the method moves one tray into the processing chamber for removal of the susceptor without exposing the chamber to atmospheric environment.

Abstract: Optical apparatus includes a mount, which holds a workpiece. An array of optical heads project respective patterns of radiation onto the workpiece. A calibration assembly captures images of the respective patterns. A motion assembly, on which the calibration assembly is mounted, transports the calibration assembly among a plurality of different positions between the array of the optical heads and the mount so as to intercept and image, at each of the different positions, a respective pattern projected by a different one of the optical heads. A processor processes the images captured by the calibration assembly at the different positions so as to monitor operation of the apparatus.

Abstract: A distance measuring system is provided for auto focusing a camera of an inspection system for inspecting a planar surface that is patterned. The system includes a pattern generator, an image sensor, an optical element(s) and a processor. The pattern generator projects a spatially random pattern toward the planar surface at an oblique angle. The optical element(s) forms the image of the reflected pattern on the image sensor and the image sensor captures an image of the spatially random pattern reflected off the planar surface. The processor processes the image of the spatially random pattern and provides auto-focus information.

Abstract: An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.

Abstract: Optical apparatus includes a mount, which holds a workpiece. An array of optical heads project respective patterns of radiation onto the workpiece. A calibration assembly captures images of the respective patterns. A motion assembly, on which the calibration assembly is mounted, transports the calibration assembly among a plurality of different positions between the array of the optical heads and the mount so as to intercept and image, at each of the different positions, a respective pattern projected by a different one of the optical heads. A processor processes the images captured by the calibration assembly at the different positions so as to monitor operation of the apparatus.

Abstract: An optical inspection system including a first multiplicity of cameras operative to image a second multiplicity of regions on an object, a third multiplicity of illumination sources and at least one illumination manager operative to combine illumination from the third multiplicity of illumination sources and thereafter to direct illumination therefrom to the second multiplicity of regions, the at least one illumination manager including a beam distributor receiving a composite input beam of a multiplicity of non-mutually coherent, spatially concentrated laser pulses and directing a multiplicity of composite output beams of a plurality of the non-mutually coherent, spatially concentrated laser pulses to a corresponding plurality of spatially distinct locations corresponding to the second multiplicity of regions.

Abstract: A direct imaging system comprises an illumination unit comprising a plurality of light sources, the plurality of light sources configured to emit a plurality of beams, an optical system for forming the plurality of beams to be aligned in position or angle, an acoustic optical modulator positioned to receive the plurality of beams aligned in one of position or angle and to consecutively diffract different portions of the plurality of beams as an acoustic wave propagates in an acoustic direction, and a scanning element adapted to scan an exposure plane with the plurality of beams modulated by the acoustic optical modulator at a scanning velocity, wherein the scanning velocity is selected to incoherently unite the different portions of the plurality of beams into a single exposure spot.

Abstract: To provide a processor and a processing method to make the operation to load and unload workpieces to and from a processing chamber more efficient, and improve workpiece processing efficiency.

Abstract: A direct imaging system comprises an illumination unit comprising a plurality of light sources, the plurality of light sources configured to emit a plurality of beams, an optical system for forming the plurality of beams to be aligned in position or angle, an acoustic optical modulator positioned to receive the plurality of beams aligned in one of position or angle and to consecutively diffract different portions of the plurality of beams as an acoustic wave propagates in an acoustic direction, and a scanning element adapted to scan an exposure plane with the plurality of beams modulated by the acoustic optical modulator at a scanning velocity, wherein the scanning velocity is selected to incoherently unite the different portions of the plurality of beams into a single exposure spot.

Abstract: A method of producing a conductive path on a substrate including depositing on the substrate a layer of material having a thickness in the range of 0.1 to 5 microns, including metal particles having a diameter in the range of 10 to 100 nanometers, employing a patterning laser beam to selectably sinter regions of the layer of material, thereby causing the metal particles to together define a conductor at sintered regions and employing an ablating laser beam, below a threshold at which the sintered regions would be ablated, to ablate portions of the layer of material other than at the sintered regions.

Abstract: An LED-based high power uniform light engine including an array of LEDs having a common anode and a fill factor which exceeds 0.85, the common anode having heat spreading functionality and an active heat sink which is thermally connected to the common anode.

Abstract: A vacuum hold-down system for use with workpieces of various shapes and/or sizes is disclosed. The system comprising a vacuum hold-down table defining a mask support plane and an apertured vacuum table mask which is selectably positionable on said mask support plane, wherein said vacuum hold-down table and said vacuum table mask is configured to define a plurality of selectable different contiguous arrays of vacuum apertures, by suitable relative positioning of said vacuum table mask and said vacuum hold-down table in said mask support plane.