Abstract: A phase-change memory cell may be formed with a carbon-containing interfacial layer that heats a phase-change material. By forming the phase-change material in contact, in one embodiment, with the carbon containing interfacial layer, the amount of heat that may be applied to the phase-change material, at a given current and temperature, may be increased. In some embodiments, the performance of the interfacial layer at high temperatures may be improved by using a wide band gap semiconductor material such as silicon carbide.

Abstract: An apparatus comprising a volume of memory material and a pair of spacedly disposed conductors. An electrode coupled to the volume of memory material and disposed between the volume of memory material and one conductor comprises a first material having a first resistivity value and a second material having a different second resistivity value formed by exposing the first material to a gaseous ambient.

Abstract: A technique includes, in response to a request to write data to memory cells of a phase change memory device, placing the memory cells in a state that is shared in common among the memory cells. Also, in response to this request, the data is written to the memory cells.

Abstract: The invention relates to a process of forming a phase-change memory device. The process includes forming a salicide structure in peripheral logic portion of the substrate and preventing forming salicide structures in the memory array. The device may include a double-wide trench into which a single film is deposited but two isolated lower electrodes are formed therefrom. Additionally a diode stack is formed that communicates to the lower electrode.

Abstract: The invention relates to a phase-change memory device that uses SOI in a chalcogenide volume of memory material. Parasitic capacitance, both vertical and lateral, are reduced or eliminated in the inventive structure.

Abstract: In an aspect, an apparatus is provided that sets and reprograms the state of programmable devices. In an aspect, a method is provided such that an opening is formed through a dielectric exposing a contact formed on a substrate. The resistivity of the contact is modified by at least one of implanting ions into the contact, depositing a material on the contact, and treating the contact with plasma. In an aspect, a spacer is formed within the opening and programmable material is formed within the opening and on the modified contact. A conductor is formed on the programmable material and the contact transmits to a signal line.

Abstract: In an aspect, an apparatus is provided that sets and reprograms the state of programmable devices. In an aspect, a method is provided such that an opening is formed through a dielectric exposing a contact, the contact formed on a substrate. An electrode is conformally deposited on a wall of the dielectric, utilizing atomic layer deposition (ALD). A programmable material is formed on the electrode and a conductor is formed to the programmable material. In an aspect, a barrier is conformally deposited utilizing ALD, between the electrode and the programmable material.

Abstract: A memory array is operated by increasing a number of currents through a number of corresponding cells of the array, where each cell has a structural phase-change material to store data for that cell. Each of the currents are increased to an upper level that is sufficiently high that can cause the corresponding cell to be in a first state. Some of the currents are decreased to lower levels at sufficiently high rates that cause their corresponding cells to be programmed to the first state, while others are decreased at sufficiently low rates that cause their corresponding cells to be programmed to a second state.

Abstract: To provide equal cell programming conditions, the integrated circuit device has a number of bitline compensation elements each coupled in series with a separate bitline, and a number of wordline compensation elements each coupled in series with a separate wordline. The resistances in these compensation elements are such that a variation in a sum of (1) the resistance along the corresponding bitline of a cell between the first terminal of the cell and a far terminal of the bitline compensation element that is coupled to the corresponding bitline and (2) the resistance along the corresponding wordline of the cell between a second terminal of the cell and a far terminal of the wordline compensation element that is coupled to the corresponding wordline, is minimized across the cells of the array.

Abstract: A memory system comprising memory cells and reference cells each including a programmable resistance element. The resistance state of a memory cell is determined by comparing a sense signal developed by the memory cell with a reference signal developed by one or more of the reference cells. The programmable resistance elements may comprise a phase-change material.