Abstract: Carriers suitable for receiving one or more semiconductor wafers for the machining thereof in lapping, grinding or polishing machines, comprise a core of a first material which has a high stiffness, the core being completely or partly coated with a second material, and also at least one cutout for receiving a semiconductor wafer, wherein the second material is a thermoset polyurethane elastomer having a Shore A hardness of 20-90. The carriers are preferably coated with the second material after chemical surface activation and application of adhesion promoter, and may be used for simultaneous double-side material-removing machining of a plurality of semiconductor wafers.

Abstract: The invention relates to an apparatus for the double-sided, grinding machining of flat workpieces with an upper and a lower work disk, each of which has a work surface with a grinding layer, wherein the work surfaces form a work gap amongst themselves, in which workpieces can be ground, wherein at least one of the work disks is rotatably drivable by means of a driving mechanism, and further having a device for guiding the workpieces in the work gap. It is provided according to the invention that debarring means are arranged on at least one of the work disks, which are designed to deburr the workpieces during their machining in the apparatus.

Abstract: The invention relates to a method for machining flat workpieces in a double-sided machining tool, which has an upper and a lower work disk, wherein at least one of the work disks is rotatingly driven and the work disks each have an annular work surface, wherein the work surfaces amongst themselves limit an also annular work gap, in which at least one carrier is located, which guides at least one workpiece in the work gap, so that the at least one workpiece is machined in a double-sided manner between the work surfaces. The distance between the work disks is measured at at least two radially spaced measurement locations of the work gap and in that, from the measured distances, a distance between the work disks is determined at a location of the work gap representing the thickness of the at least one workpiece machined in the work gap.

Abstract: A device for double-sided processing of flat workpieces has upper and lower working discs forming between them a working gap containing a carrier disc with cutout(s) for workpiece(s), the carrier disc having circumferential teeth by means of which it rolls on an inner and an outer gear wheel or pin ring, wherein the gear wheels or pin rings have a multiplicity of gear or pin arrangements which engage the teeth of the carrier discs during rolling, at least one of the pin arrangements having a guide which delimits movement of the margin of the carrier disc in at least one axial direction, the guide formed by a circumferential shoulder or a circumferential groove.

Abstract: A device for determining the position of a working surface of a working disc of a double-sided machine tool, a double sided grinder in particular, wherein the double-sided machine tool has two working discs, which form a working gap for double sided machining of work pieces between working surfaces facing each other, and of which at least one is rotatingly drivable, wherein the device comprises an optical measurement device having a radiation source, an optical detector device, and an analysis device, designed for being disposed outside of the working gap.

Abstract: The invention relates to a device for the double-sided processing of flat work pieces, comprising an upper working disc and a lower working disc, wherein the working discs between the working surfaces thereof facing each other, form a working gap for processing the work pieces, and wherein at least one of the working discs comprises a plurality of bores extending through the working surface for feeding a liquid working medium into the working gap, wherein the bores are combined in several groups, wherein each group of bores is connected to a separate pressurized supply line for the working medium, and at least one pressure control apparatus is provided, which makes it possible to control the pressure of the working medium in the supply lines separately from one another.

Abstract: The invention relates to a method for machining flat workpieces in a double-sided machining tool, which has an upper and a lower work disk, wherein at least one of the work disks is rotatingly driven and the work disks each have an annular work surface, wherein the work surfaces amongst themselves limit an also annular work gap, in which at least one carrier is located, which guides at least one workpiece in the work gap, so that the at least one workpiece is machined in a double-sided manner between the work surfaces. The distance between the work disks is measured at least two radially spaced measurement locations of the work gap and in that, from the measured distances, a distance between the work disks is determined at a location of the work gap representing the thickness of the at least one workpiece machined in the work gap.

Abstract: The invention relates to a method for machining by grinding or polishing of very thin work pieces which are releasably fastened each to thin carriers. The work pieces are arranged together with the carriers in the recesses of at least on rotor disc of a double sided processing machine and are moved along cycloid paths between the working surfaces of the double sided processing machine. Thereby, the removal rate on the working surfaces of the double sided processing machine is either the same or the removal rate on a working surface is substantially less than the one on the opposing working surface, or on one of the working surfaces no material removal takes place. In one embodiment two work pieces are on carrier, that is, releasably fastened on upper and lower side.

Abstract: Simultaneous double-side grinding of a plurality of semiconductor wafers involves positioning each wafer freely in a cutout of one of plural carriers which rotate on a cycloidal trajectory, wherein the wafers are machined between two rotating ring-shaped working disks, each disk having a working layer of bonded abrasive, wherein the form of the working gap between working layers is determined during grinding and the form of the working area of at least one disk is altered such that the gap has a predetermined form. The wafers, during machining, may temporarily overhang the gap. The carrier is optionally composed only of a first material, or is completely or partly coated with the first material such that during machining only the first material contacts the working layer, and the first material does not reduce the machining ability of the working layer.

Abstract: The invention relates to an apparatus for the double-sided, grinding machining of flat workpieces with an upper and a lower work disk, each of which has a work surface with a grinding layer, wherein the work surfaces form a work gap amongst themselves, in which workpieces can be ground, wherein at least one of the work disks is rotatably drivable by means of a driving mechanism, and further having a device for guiding the workpieces in the work gap. It is provided according to the invention that debarring means are arranged on at least one of the work disks, which are designed to deburr the workpieces during their machining in the apparatus.

Abstract: The invention relates to a method for measuring the thickness of a discoidal workpiece, which serves as a substrate for electronic components, comprising the steps: infrared radiation is directed at the top side of the workpiece, wherein a first radiation portion is reflected on the top side and a second radiation portion penetrates the workpiece thickness, is reflected on the bottom side of the workpiece and emerges again on the top side of the workpiece, the first and the second radiation portion interfere under formation of an interference pattern and the optical workpiece thickness between the top side of the workpiece and the bottom side of the workpiece is determined using the interference pattern. It is provided according to the invention that the mechanical workpiece thickness is determined from a measurement of the intensity of the infrared radiation reflected and/or transmitted from the workpiece.

Abstract: A machining machine with an upper rotatingly drivable machining disc, the annular machining plane of which has a machining coating and is facing a lower machining plane, wherein the machining planes form a machining gap between each other. Plural rotor discs are arranged in the gap, which accommodate workpieces in recesses and which can be brought into rotation by means of a roll-off device, wherein the workpieces move along a cycloid path, wherein plural sensor elements for acquiring at least one machining parameter are arranged in the upper machining disc, distributed across its cross section, the sensor elements are each one coupled to an active or passive RFID chip and a reading device is assigned to the upper machining disc for reading out the RFID chips.

Abstract: A method for the simultaneous double-side grinding of a plurality of semiconductor wafers, involves a process wherein each semiconductor wafer lies such that it is freely moveable in a cutout of one of a plurality of carriers caused to rotate by means of a rolling apparatus and is thereby moved on a cycloidal trajectory, wherein the semiconductor wafers are machined in material-removing fashion between two rotating working disks, wherein each working disk comprises a working layer containing bonded abrasive. The method according to the invention makes it possible, by means of specific kinematics, to produce extremely planar semiconductor wafers.

Abstract: A device for double-sided processing of flat workpieces has upper and lower working discs forming between them a working gap containing a carrier disc with cutout(s) for workpiece(s), the carrier disc having circumferential teeth by means of which it rolls on an inner and an outer gear wheel or pin ring, wherein the gear wheels or pin rings have a multiplicity of gear or pin arrangements which engage the teeth of the carrier discs during rolling, at least one of the pin arrangements having a guide which delimits movement of the margin of the carrier disc in at least one axial direction, the guide formed by a circumferential shoulder or a circumferential groove.

Abstract: A machining machine with an upper rotatingly drivable machining disc, the annular machining plane of which has a machining coating and is facing a lower machining plane, wherein the machining planes form a machining gap between each other. Plural rotor discs are arranged in the gap, which accommodate workpieces in recesses and which can be brought into rotation by means of a roll-off device, wherein the workpieces move along a cycloid path, wherein plural sensor elements for acquiring at least one machining parameter are arranged in the upper machining disc, distributed across its cross section, the sensor elements are each one coupled to an active or passive RFID chip and a reading device is assigned to the upper machining disc for reading out the RFID chips.

Abstract: A two-side working machine, comprising an upper and a lower working disc which hold on, and are fixed to, an upper and a lower carrier disc, and which are disposed coaxially with each other and are adapted to be rotationally driven relative to each other by a working motor via a driving shaft, wherein the working discs have formed therebetween a working gap in which flat workpieces are processed on both sides, and a distance measuring device which measures the distance between working discs in at least two radially spaced points of the working gap, whereby the upper carrier disc is suspended on a supporting ring which is connected to the upper working shaft so as to be fixed for rotation, an annular portion of the carrier disc and means which are externally controllable by the supporting ring and via which a radial force is applied to the circumference of the carrier disc about the circumference of the supporting ring by means of a force generator, and control means are provided which adjust the force on the

Abstract: A two-side working machine, comprising an upper and a lower working disc which hold on, and are fixed to, an upper and a lower carrier disc, and which are disposed coaxially with each other and are adapted to be rotationally driven relative to each other by a working motor via a driving shaft, wherein the working discs have formed therebetween a working gap in which flat workpieces are processed on both sides, and a distance measuring device which measures the distance between working discs in at least two radially spaced points of the working gap, whereby the upper carrier disc is suspended on a supporting ring which is connected to the upper working shaft so as to be fixed for rotation, an annular portion of the carrier disc and means which are externally controllable by the supporting ring and via which a radial force is applied to the circumference of the carrier disc about the circumference of the supporting ring by means of a force generator, and control means are provided which adjust the force on the

Abstract: The device comprises a carrier for a workpiece; the carrier can be moved along a vertical and a horizontal axis by use of a drive mechanism and has an approximately planar contact surface for the workpiece, whereby the workpiece can be held on the contact surface by a contact mechanism of the carrier, especially vacuum, a retaining ring on the carrier encircling the contact surface and projecting downwards beyond the contact surface and having an inner diameter which is slightly larger than the outer diameter of the workpiece. At least three centering cams are arranged on a circle, the centering cams can be moved synchronously and in a radial direction by use of a centering drive, the centering cams having a supporting surface oriented on the top.

Abstract: A method and apparatus for automatically loading and unloading wafer crystals to and from a double-sided polishing machine of the type having an upper and a lower polishing plate, runner disks with reception openings for the wafer crystals, and a drive to move runner disks to a predetermined loading and unloading position. The position of the centers of the reception openings in a runner disk located in the loading position is measured and stored by means of an optical identification system. A gripping means of a robot arm is successively oriented towards the measured center positions of the reception openings, and the position of the centers of the individual openings is determined and stored by first and second optical identification systems. The individual wafer crystals are tilted while being inserted by the gripping means of the loading arm into the reception openings.

Abstract: A device for polishing digital storage discs including a polishing plate rotatably driven about a vertical axis, the upper side of which has a polishing cloth, wherein the polishing cloth is interrupted by a ring-shaped recess concentric with the axis of the polishing plate, at least one circular load-applying plate from the planar lower side of which a projection centrally protrudes to appropriately engage the central hole of the storage disk, a roller holder which has at least one idling roller and one driven roller against which the circumference of said load-applying plate gets into engagement when said plate is carried along while lying on said polishing plate, a drive for said driven roller, and mechanism for feeding a polishing medium to said polishing cloth.