Abstract: A device for polishing digital storage discs including a polishing plate rotatably driven about a vertical axis, the upper side of which has a polishing cloth, wherein the polishing cloth is interrupted by a ring-shaped recess concentric with the axis of the polishing plate, at least one circular load-applying plate from the planar lower side of which a projection centrally protrudes to appropriately engage the central hole of the storage disk, a roller holder which has at least one idling roller and one driven roller against which the circumference of said load-applying plate gets into engagement when said plate is carried along while lying on said polishing plate, a drive for said driven roller, and mechanism for feeding a polishing medium to said polishing cloth.

Abstract: An apparatus for the chemical-mechanical polishing of surfaces of circular flat workpieces, in particular semi-conductor wafers, comprising a loading and unloading station for the workpieces which includes a carrier which is supported for rotation about a vertical axis and is driven by a rotary driving means into a predetermined rotary position, at least two horizontal loading surfaces on the carrier means facing upwardly. With a transfer means the workpieces can be placed on the loading surfaces or removed therefrom.

Abstract: A holder for semiconductor wafers in an apparatus for chemical-mechanical polishing of semiconductor wafers, having a disk-shaped head, a holding plate and a ring-shaped membrane attached to the carrier section and the holding plate which defines a pressure chamber between these components, the bores in the holding plate being connected with the pressure chamber, a contact membrane of elastomeric gas-impermeable material having a peripheral edge which is fixedly connected to a peripheral portion of the holding plate in a gas-tight manner and engages the lower side of the holding plate.

Abstract: A holder for flat workpieces, particularly semiconductor wafers, particularly in an apparatus for chemico-mechanically polishing the semiconductor wafers, comprising a disk-like head which is adapted to be connected to a spindle adjustable in height at the upper surface and has a support plate at the lower side which, via a universal joint, is coupled to a carrier portion disposed above the support plate or the spindle and which has a number of vertical bores which extend to the underside of the support plate and can be optionally connected to a vacuum and/or a fluid source under pressure, where the support plate is guided to be movable in height in the carrier portion and displacing means are provided between the carrier portion and the support plate to displace the support plate with respect to the carrier portion and to exert a predetermined pressure on the workpiece, characterized in that a ring-shaped loading member of limited width is provided which is movably supported in an axially parallel way in the

Abstract: An apparatus for removing semiconductor wafers from within the runner disks in a double-sided polishing machine. The apparatus includes a suction head adapted to be connected to a vacuum, which has a plurality of suction ports such that all semiconductor wafers received by a runner disk may be gripped simultaneously. The apparatus also includes an arm on which the suction head is rotatably supported about a vertical axis and which, in turn, is pivotally supported about a vertical axis at a spacing from the suction head or is supported so as to be linearly adjustable or adjustable in height. The apparatus also includes a rotary drive for the suction head, a drive for the arm, a lifting drive for the arm, and a control device for activating the drives such that the semiconductor wafers may be deposited on a lay-down device in a predetermined, aligned position.

Abstract: A double-disk polishing machine, particularly for tooling semiconductor wafers, comprising a machine housing, an upper and a lower working disk, carrier disks for the lower and upper working disks either of which is connected to a vertical driving shaft which, in turn, are rotatably supported in the machine housing by means of roller bearings and are adapted to be driven by a motor via a gear mechanism wherein cooling channels to which a coolant is fed are formed in each carrier disk, characterized in that each of the carrier disks is mounted with the aid of fastening means on a circumferential ring of a wheel-shaped basic carrier which, in turn, is connected to the driving shaft, the radius on which said fastening means lie which connect said basic carrier to said carrier disk is approximately on half the width of the ring-shaped working disk and said basic carrier for the upper working disk is connected to the shaft or to carrier disk in such a way that the inclination of the upper working disk automaticall

Abstract: A holder for flat subjects, in particular semiconductor wafers, in particular in a device for the chemical-mechanical polishing of semiconductor wafers, with a plate-like head which can be connected on the upper side to a height adjustable spindle and at the lower side comprises a holding plate which is coupled to a carrier section arranged above the holding plate via a universal joint and which comprises a number of vertical bores which extend to the lower side of the plate and can be connected to a vacuum and/or a fluid source, wherein the holding plate is height adjustably guided in the carrier section, between the carrier section and the holding plate there is arranged an annular closed membrane within which there is formed an essentially air-tightly closed inner space which can be selectively connected to atmosphere or vacuum or to a pressure source.

Abstract: A device for the chemical-mechanical polishing of the surface of an object, in particular of semiconductor wafers for the manufacture of semiconductors, with two polishing units with height-adjustable vacuum holders each for a semiconductor wafer, which can be driven by a drive motor about a vertical axis, parallel, approximately horizontally running guides, along which the polishing units are guided independently of one another, drive means by which the polishing units are moved along the guides, at least one polishing plate rotatingly driven below the guides, which is arranged approximately symmetrically on both sides of the longitudinal axes of the guides, by which means the polishing units in their corresponding operational position cooperate with oppositely lying sections of the polishing plate, at least one transfer and take-over device for the semiconductor wafer, at the end of the guides which is opposite to the polishing plate, two depositing and accommodating devices for the semiconductor wafer, whi

Abstract: A polishing machine comprising a frame, an upper and a lower working wheel each having opposing working surfaces, at least one of the working wheels being rotatably supported by the frame and driven by driving means, with a plurality of runner wheels being located between the working surfaces of the upper and the lower working wheel, the runner wheels having aperatures for the accommodation of work pieces and a toothing at the circumference thereof, an outer and an inner circular row of equally spaced pins, the pins being retained by a respective pin ring, the toothing of the runner wheels engaging the outer and the inner row of pins for the forward and rotating movement of the runner wheels if at least one of the row of pins is rotated, second driving means for the rotating row of pins, a source for the supply of working fluid and/or rinsing fluid between the working surfaces, interception means on the outer and the inner side of the working wheels, with the outer of the interception means being formed by a

Abstract: An apparatus for controlling operation of a lapping, honing or polishing machine comprising at least one working disk having an abrasive means for honing, lapping, or polishing the surface of a work-piece and adapted to be driven by a variable working disk drive, at least one planetary gear member for carrying said work-piece and having teeth at its outer periphery, and inner and outer gear members in driving engagement with said planetary gear member, at least said inner gear member being driven by a variable inner gear member drive, said apparatus including a control stage for providing a control signal to said working disk drive and said inner gear member drive for controlling desired drive speeds, the improvement of which includes a computer 44 connected to said control stage for generating input signals for said control stage, which computer is arranged to calculate the speed of said inner gear member drive and the speed of said working disk drive by the following formulas:n.sub.L =K.sub.L .multidot.n.

Abstract: A card clothing for a yarn carder flat has a card fillet and tooth members with tooth shanks projecting from the fillet and the connector between tooth shanks perpendicular to a travel direction of the fiber. According to the invention the relatively large offsets between the tooth members of one diagonal group from gasps in that diagonal group in which tooth shanks from an overlapping diagonal group are positioned in this direction so that, in spite of large offsets, the alleys formed in the card cloth are comparatively narrow. The diagonal groups can have even numbers of tooth rows and thus odd numbers of offsets.

Abstract: A roller for the treatment of fiber masses for the textile industry has a sawtooth wire received in a rectangular cross section helical groove of a steel roll body and indented by a peening or indenting roller to provide, by plastic deformation of the foot portion, the outward forces which clamp the foot portion of the wire against the ribs flanking the groove of the roller body. As a consequence, the roller body as a whole is not deformed.

Abstract: Method for controlling the operation of two-wheel housing machines, the machining wheels of which are pressed towards each other and onto the workpieces by means of a loading device at a predetermined variable loading pressure, wherein during operation the material removal of the work-pieces and eventually the machining wheels is determined by means of a measuring control device and the operation is discontinued when a predetermined value has been reached, wherein the material removal per time unit (actual value) is determined and compared with at least one predetermined value for the material removal per time unit and the loading pressure for the loading device is automatically increased when the actual value is below the predetermined value.

Abstract: A ratchet spanner includes a handle; an arcuate jaw-like head connected with the handle, the jaw-like head including a side wall defining a space therein, an upper wall, a lower wall, a plurality of first apertures in the upper wall and a plurality of second apertures in the lower wall in alignment with the first apertures; a plurality of pawls; a plurality of posts, each secured to a respective one of the pawls for pivotally mounting the respective pawl in a first aperture and second aperture in the jaw-like head adjacent the side wall; a ratchet insert member positioned with the space and rotatable with respect to the jaw-like head, the ratchet insert member including a plurality of teeth engageable by the pawls, and spaced gripping surfaces; and a sheet-like arcuate strip of sheet metal positioned against the side wall and a plurality of leaf spring members partially cut-out from the arcuate strip and biased into engagement with the pawls to pivot the pawls into engagement with the teeth.

Abstract: A honing, lapping or polishing machine includes a central inner gear member and an outer annular gear member each having an annular row of teeth, and a plurality of workpiece holder discs having teeth at their outer peripheries in driving engagement with the teeth on the inner and outer gear members in a planetary gear type fashion. The workpiece holder discs have recesses for receiving workpieces. The number of teeth on the outer gear member is an integral multiple of the number of teeth on each workpiece holder disc. A drive assembly rotates the inner gear member and is arranged to stop the workpiece holder discs in a predetermined loading and unloading position of at least one of the discs in response to a position signal from a detector assembly. The detector assembly includes a position detector movable into the path of the discs to provide the position signal when one of the discs reaches a predetermined relative position with respect to the position detector.

Abstract: A control device for the processing pressure on honing, lapping and polishing machines, in which the tool is driven by motor via a spindle which is in its turn rotatably and essentially axially fixedly supported in a bearing member which is movable in the direction of the axis of the spindle, in which furthermore a double-acting actuation device engages at the bearing member via resilient means, and in which finally an energy sensor measuring the processing pressure transmits actual pressure signals to a program control which, dependent on time, compares the actual pressure signals with different preset pressure signals and from the comparison of the pressure signals generates adjusting signals for the actuation device. At least the resilient means counteracting the own weight of the tool is formed by a pneumatic adjusting means which is connected to a pressure gas source via a control valve.

Abstract: A grinding machine for grinding the peripheral surface of a cylindrical workpiece having a rotatable axle extending from it by a rotating grinding roller has a feeding device which grips the axle of the workpiece and advances the workpiece against the perimeter of the grinding roller. The machine is intended for grinding ordinary spinning cylinders comprising two cylinders of hard rubber material which are rotatably mounted at a distance from each other on a common axle and particularly for regrinding such spinning cylinders, which can experience unequal wear, in order to precisely equalize their diameters.

Abstract: Lapping or polishing machine, wherein for cooling a plurality of zones of its working face the tool comprises for each of these zones separate supply conduits for fluids at different temperatures and/or rates of throughflow, and there are also provided temperature sensing means with an apparatus for controlling the temperature or rate of throughflow of the fluid.

Abstract: A working pressure control mechanism for lapping, honing, and grinding machines having a rotatably mounted shaft bearing the tool within an axially translatable housing such that the shaft is carried along by the housing in the direction of the tool advance, comprising a spring capable of axially translating the housing, a signal producer capable of producing a signal corresponding to the magnitude of axial displacement caused by the workpiece and connected to the spring, and a mechanism advance control capable of receiving a signal from the signal producer, and advancing the housing to compensate for the degree of axial displacement.