Abstract: A semiconductor light emitting device including a first type doped semiconductor layer, a light emitting layer, a second type doped semiconductor layer, and a reflection layer is provided. The first type doped semiconductor layer has a mesa portion and a depression portion. The light emitting layer is disposed on the mesa portion and has a first surface, a second surface and a first side surface connecting the first surface with the second surface. The second type doped semiconductor layer is disposed on the light emitting layer and has a third surface, a fourth surface and a second side surface connecting the third surface with the fourth surface. Observing from a viewing direction parallel to the light emitting layer, the reflection layer covers at least part of the first side surface and at least part of the second side surface. A flip chip package device is also provided.

Abstract: The present invention provides a pattern substrate structure for light emitting angle convergence and a light emitting diode device using the same. The pattern substrate structure has a plurality of enclosed geometric regions defined by at least three stripe-shaped parts on a substrate to provide the light reflection effect through the uneven surface of the substrate and thereby converge the light emitting angle of the light emitting diode element into 100˜110 degrees. Therefore, the illuminant efficiency of the light emitting diode device using the pattern substrate structure is substantially raised because of the improved directivity.

Abstract: A photoelectric device package and a detachable package structure are provided. The photoelectric device package includes a bottom-plate, a top-plate, at least one photoelectric device, and at least one light-guiding element. The bottom-plate has a first carrying part and a first substrate part on the first carrying part. The first carrying part has first alignment portions. The first substrate part has second alignment portions. The top-plate has a second carrying part and a second substrate part on the second carrying part. The second carrying part has third alignment portions. The second substrate part has fourth alignment portions. The top-plate and the bottom-plate are assembled by the first and third alignment portions. The first and second substrate parts are positioned by the second and fourth alignment portions. Each photoelectric device is disposed on the first substrate part. Each light-guiding element is disposed between the first and second substrate parts.

Abstract: Embodiments are directed to laser emitter modules and methods and devices for making the modules. Some module embodiments are configured to provide hermetically sealed enclosures that are convenient and cost effective to assemble and provide for active alignment of optical elements of the module.

Abstract: Methods and apparatus are provided for using a renewable source of energy such as solar, wind, or geothermal energy. In some embodiments, the method may include generating electric energy from a renewable form of energy at a plurality of locations at which reside an electric power line associated with an electric power grid. The electric energy generated at each location may be transferred to the electric power line to thereby supply electric energy to the electric power grid.

Abstract: A semiconductor light-emitting device and a manufacturing method thereof are provided, wherein the semiconductor light-emitting device includes a substrate, a first type doped semiconductor layer, a light-emitting layer, a second type doped semiconductor layer and an optical micro-structure layer. The first type doped semiconductor layer is disposed on the substrate and includes a base portion and a mesa portion. The base portion has a top surface, and the mesa portion is disposed on the top surface of the base portion. The light-emitting layer is disposed on the first type doped semiconductor layer. The second type doped semiconductor layer is disposed on the light-emitting layer. The optical micro-structure layer is embedded in the first type doped semiconductor layer.

Abstract: A multi-element diffraction grating is disclosed. The multi-element diffraction grating may be configured to diffract incident radiation with high dispersion using at least two holographic optical elements. The multi-element diffraction grating may include a first volume phase grating that is one of the holographic optical elements. The multi-element diffraction grating may also include at least one additional volume phase grating that is the second holographic optical element. The first volume phase grating and each of the additional volume phase gratings may be positioned relative to each other such that the radiation propagates through and is diffracted by the first volume phase grating and each of the additional volume phase gratings.

Abstract: A planar LED lighting apparatus includes a housing and multiple LEDs. The housing includes a reflective face and a light output surface opposing the reflective face. The multiple LEDs are mounted on sidewalls of the housing, and the axial light of the multiple LEDs is incident on the reflective face.

Abstract: A light emitting diode (LED) is revealed. The LED includes a substrate, a first-type-doped layer, a light emitting layer, a second-type-doped layer, a plurality of first grooves, a second groove, an insulation layer, a first contact, and a second contact. The LED features that the second groove is connected to one end of each first groove and penetrates the second-type-doped layer and the light emitting layer to expose a part of the first-type-doped layer. The contact area between the first contact and the first-type-doped layer is increased. Therefore, the LED is worked at high current densities without heat accumulation. Moreover, the light emitting area is not reduced and the light emitting efficiency is not affected. The LED is flipped on a package substrate to form a flip-chip LED package.

Abstract: Apparatus and method of making an improved moisture-resistant package for a MEMS device having movable parts, the package including a substrate, a translucent cover over the substrate, a seal and moisture barrier and a plurality of parallel sidewalls around the periphery of the substrate and cover. The sidewalls have ends and an area between the sidewalls, and the sidewalls separate the substrate and cover by a sufficient distance to provide clearance for the movement of the movable parts. The package is sealed using a glue layer that at least partially fills the area between the sidewalls, and lies between the ends of the sidewalls and one of the substrate or cover. The glue layer causes the substrate or cover, respectively, to adhere to the ends of the sidewalls. The glue layer and the sidewalls together prevent moisture from entering the package.

Abstract: An example embodiment of the present invention is a non-blocking wavelength switching architecture that enables graceful scaling of a network wavelength switching node from small to large fiber counts using fixed size bidirectional 1×N Wavelength Selective Switches (WSS). The architecture uses an intermediate broadcast and select layer implemented using optical splitters and WSSs to eliminate wavelength blocking.

Abstract: A wavelength-tunable, ultrafast laser includes a resonator having an optically-pumped gain-medium. The resonator includes a pair of group-delay-dispersion compensating prisms and a bandwidth limiting stop. Both prisms and stop are fixed in a predetermined position relative to one another. In one embodiment, a movable beam shifting reflector is placed between the prisms. The reflector shifts the dispersed beam with respect to the second prism and the stop. The stop is arranged, cooperative with the second prism, to select a pulse wavelength within the gain-bandwidth. Tuning of the selected pulse-wavelength is accomplished by translating the beam shifting reflector. Alternatively, a two-reflector arrangement may also select pulse-wavelengths, accomplished by a combination of rotation and translation of the two reflectors.

Abstract: An all-fiber optic Faraday rotator and isolator is presented. The device has a multicomponent glass optical fiber having a core having a first doping concentration of 55%-85% (wt./wt.) of a first rare-earth oxide and a cladding having a section doping concentration of 55%-85% (wt./wt.) of a second rare-earth oxide, where the first rare-earth oxide and the second rare earth oxide are one or more of Pr2O3, Nd2O3, Pm2O3, Sm2O3, Eu2O3, Gd2O3, Tb2O3, Dy2O3, Ho2O3, Er2O3, Tm2O3, Yb2O3, La2O3, Ga2O3, Ce2O3, and Lu2O3, and where the refractive index of the cladding is lower than a refractive index of the core. The fiber optic device further includes multiple magnetic cells each formed to include a bore extending there through, where the fiber is disposed in the bore of one of the magnetic cells.

Abstract: A wafer containing a plurality of electro-optical devices, each device being enclosed in chamber that has a translucent cover. An X-Y matrix of pairs of interconnections on the wafer are connected to the circuitry of the electro-optical devices for addressing the electro-optical devices. The pairs of interconnections extend outside of the chambers enclosing the devices to testing areas on the periphery of the wafer. Testing is done by signals applied through the interconnections while simultaneously exposing the devices to light through the translucent covers.

Abstract: A spectrometer capable of eliminating side-tail effects includes a body and an input section, a diffraction grating, an image sensor unit and a wave-guiding device, which are mounted in the body. The input section receives a first optical signal and outputs a second optical signal travelling along a first light path. The diffraction grating receives the second optical signal and separates the second optical signal into a plurality of spectrum components, including a specific spectrum component travelling along a second light path. The image sensor unit receives the specific spectrum component. The wave-guiding device includes first and second reflective surfaces opposite to each other and limits the first light path and the second light path between them to guide the second optical signal and the specific spectrum component. The first and second reflective surfaces are separated from a light receiving surface of the image sensor unit by a predetermined gap.

Abstract: The inventive configurable chiral fiber sensor is readily configurable for use in a variety of applications (such as applications involving pressure and/or temperature sensing), and which is particularly suitable for applications in which the sensing of a presence or absence of the target sensed event (e.g., specific minimum pressure or minimum temperature) is required. Advantageously, the inventive configurable chiral fiber sensor utilizes light sources, photodetectors, and related devices for sensor interrogation.

Abstract: The inventive configurable chiral fiber sensor with a tip-positioned sensing element, is readily configurable for use in a variety of applications (such as applications involving pressure, temperature, and even axial twist sensing), and is particularly suitable for applications requiring highly precise and accurate sensor readings within corresponding predefined limited sensing ranges. Advantageously, the inventive configurable chiral fiber sensor with a tip-positioned sensing element, is operable to utilize a wide variety of light sources, photodetectors, and related devices for sensor interrogation.

Abstract: Methods for increasing the processing speed of computational electromagnetic methods, such as the Method of Moments (MoM), may involve using efficient mapping of algorithms onto a Graphics Processing Unit (GPU) architecture. Various methods may provide speed/complexity improvements to either or both of: (1) direct solution via Lower-Upper (LU) factorization; and (2) iterative methods (e.g., Generalized Minimal Residual (GMRES) method).

Abstract: A planar LED lighting apparatus includes a housing and multiple LEDs. The housing includes a reflective body and a light output surface opposing the reflective body. The multiple LEDs are mounted on sidewalls of the housing, and light from the multiple LEDs is reflected by the reflective body to travel toward the light output surface.

Abstract: A solid state lighting device, including: a housing, which has a reflective cup inside; a solid state light source, placed inside the housing; a transparent adhesive material, used to seal the solid state light source in the housing; and a multi-layer fluorescent structure, placed on the transparent adhesive material and having a fluorescent layer or a phosphor layer sandwiched by two transparent adhesive layers, so as to absorb light beams from the solid state light source and then emit light of longer wavelengths.