Patents Assigned to Polyplastics Co. Ltd.
  • Patent number: 7776410
    Abstract: A purpose of the present invention is to obtain a hollow extruded article by easy blow molding or extrusion molding to give a draw down resistance and a uniform wall thickness of the article without damaging low gas permeability which is a characteristic property of a liquid-crystalline polymer. A resin composition for extrusion molding which is prepared by melting and kneading 99-70 wt. % of wholly aromatic polyester amide liquid crystal resin (A) having a melting point of 270-370° C. and a melt viscosity at 1000/sec. shear rate of 20-60 Pa·s at Temperature T1 which is higher than 20° C. from said melting point, and containing (I) 1-15 mole % of 6-hydroxy-2-naphthoic acid residue, (II) 40-70 mole % of 4-hydroxybenzoic acid residue, (III) 5-28.5 mole % of aromatic diol residue, (IV) 1-20 mole % of 4-aminophenol residue, and (V) 6-29.5 mole % of aromatic dicarboxylic acid residue; and 1-30 wt. % of epoxy modified polyolefin type resin (B), and has a melt viscosity at 1000/sec.
    Type: Grant
    Filed: October 27, 2005
    Date of Patent: August 17, 2010
    Assignee: Polyplastics Co. Ltd.
    Inventors: Toshio Nakane, Mineo Ohtake, Toshio Shiwaku, Masato Suzuki
  • Publication number: 20050075429
    Abstract: The polyacetal resin composition contains about 0.01-10 parts by weight of a glyoxyldiureide compound per 100 parts by weight of polyacetal resin. The glyoxyldiureide compound includes glyoxyldiureide and its derivatives (metal salts etc.). Optionally, about 0.01-10 parts by weight of a basic nitrogen-containing compound is further added. The basic nitrogen-containing compound includes melamine, melamine resin, and polyamide resin. Further, an antioxidant may be further added. The above composition contributes to stability, particularly heat stability, of polyacetal resin and suppression of emission of formaldehyde.
    Type: Application
    Filed: September 5, 2003
    Publication date: April 7, 2005
    Applicant: Polyplastics Co. Ltd.
    Inventors: Hatsuhiko Harashina, Hayato Kurita, Tatsuya Yamada
  • Patent number: 6758989
    Abstract: The present invention is to provide a liquid crystal polymer molded article which has an excellent low warpage and is able to be suitably used particularly as a connector or the like. That is, a molded article of a liquid crystal composition in which 100 parts by weight of a liquid crystal polymer (A) and 5-100 parts by weight of a non-fibrous filler (B) are compounded where the non-fibrous filler is so dispersed that, when a diffraction peak of the non-fibrous filler is measured by a transmission method and a reflection method by means of a wide-angle X-ray diffraction, the diffraction peak of the non-fibrous filler which can be confirmed by the reflection method is not confirmed by the transmission method.
    Type: Grant
    Filed: July 18, 2002
    Date of Patent: July 6, 2004
    Assignee: Polyplastics Co. Ltd.
    Inventors: Takayuki Miyashita, Toshio Nakane
  • Patent number: 6180251
    Abstract: A thermoplastic resin having such a sufficient heat shock resistance that it is unbroken by common temperature changes and also exhibiting an excellent flame resistance when applied to an insert molded article, which is obtained by blending a thermoplastic polyester resin (A) with 1-25% by weight to the total amount of the composition of an impact resistance giving agent (B), 1-50% by weight to the total amount of the composition of an inorganic filler (C), 1-25% by weight to the total amount of the composition of a flame retardant (D) and 0.1-10% by weight to the total amount of the composition of an aromatic polyvalent carboxylate (E).
    Type: Grant
    Filed: March 22, 2000
    Date of Patent: January 30, 2001
    Assignee: Polyplastics Co. Ltd.
    Inventors: Hiroyuki Kanai, Kei Aoki, Toru Katsumata
  • Patent number: 5705279
    Abstract: A fibrillar copolyester having excellent heat resistance, a reinforcing effect and a large aspect ratio is produced with high dimensional stability and efficiency. A specific fibrillar copolyester having an aspect ratio of at least 3.0 is produced by polymerizing with shearing specific hydroxy aromatic carboxylic acid monomers as starting materials in a nonpolar solvent having 10 or more carbon atoms. Such hydroxy aromatic carboxylic acid monomers preferably have acetylated hydroxyl groups when copolymerized. Additionally, substituents other than hydrogen atoms optionally may be present on the rings of the aromatic monomers when forming the fibrillar copolyester.
    Type: Grant
    Filed: January 25, 1996
    Date of Patent: January 6, 1998
    Assignee: Polyplastics Co. Ltd.
    Inventors: Ayako Migita, Kenji Hijikata
  • Patent number: 5677392
    Abstract: There is provided a direct method for producing a reinforced composite resin material by polymerizing a specific copolyester having high heat resistance and a reinforcing effect in the presence of a molten preformed thermoplastic polymer. In the production of the reinforced composite resin material, a fibrillar copolyester is produced by the polymerization of specific hydroxy aromatic carboxylic acid monomers and is generated within a molten preformed thermoplastic polymer while undergoing a shearing stress. Such shearing stress causes the formation of the requisite fibrous reinforcement preferably having an aspect ratio of at least 3 within the preformed thermoplastic polymer. Such hydroxy aromatic carboxylic acid monomers preferably have acetylated hydroxyl groups when copolymerized. Additionally, substituents other than hydrogen atoms optionally may be present on the rings of the aromatic monomers at the time of the copolymerization to form the fibrillar copolyester.
    Type: Grant
    Filed: January 25, 1996
    Date of Patent: October 14, 1997
    Assignee: Polyplastics Co. Ltd.
    Inventors: Hajime Serizawa, Ayako Migita, Kenji Hijikata
  • Patent number: 5314326
    Abstract: In a method of injection-molding a thermoplastic resin wherein a weld is formed in the mold cavity by the fusion of separate resin streams, use is made of a mold provided with a resin well protruding from the molded cavity or a runner on at least one of the separate resin streams at a point between where the injected molten resin is separated into streams and the weld. The resin is poured into the resin well after the formation of the weld from the feed of the molten resin into the mold cavity to cause migration of the resin at the weld, thus forcing the resin on one side of the weld into the resin of the other side of the weld to thereby strengthen the weld.
    Type: Grant
    Filed: September 9, 1992
    Date of Patent: May 24, 1994
    Assignee: Polyplastics Co. Ltd.
    Inventors: Yoshihiro Furugohri, Yukihisa Kumagai
  • Patent number: 5160786
    Abstract: A resin material for inserting a lead frame comprises:(A) 100 parts by weight of a polyarylene sulfide resin,(B) 0.1 to 30 parts by weight of an .alpha.-olefin copolymer graft-copolymerized with an unsaturated carboxylic acid or its anhydride, and(C) 10 to 300 parts by weight of a fibrous filler, a nonfibrous inorganic filler or a mixture thereof.The grafted unsaturated carboxylic acid such as maleic anhydride is essential, in comparison with olefin copolymers, preferably in an amount of 1 to 5 percent. The olefin copolymer includes that of ethylene and ethyl acrylate. The addition of (B) effectively works to improve adhesion between the lead frame and the polyarylene sulfide composition, because it does not decompose and give a gas during molding. Heat resistance and the molding performance does not change. An example comprises PPS, a copolymer of ethylene and ethyl acrylate, grafted with 3.0% of maleic anhydride, glass fiber and glass beads.
    Type: Grant
    Filed: December 19, 1990
    Date of Patent: November 3, 1992
    Assignee: Polyplastics Co. Ltd.
    Inventor: Mikio Nakai
  • Patent number: 4525261
    Abstract: The sputtering on polyacetal article is improved by coating the article, before the sputtering step, with a primer solution of a chlorinated polyolefin in a chlorine-containing solvent in respect to adhesion between the article and the sputtering layer.
    Type: Grant
    Filed: November 1, 1983
    Date of Patent: June 25, 1985
    Assignee: Polyplastics Co. Ltd.
    Inventors: Hiroshi Hotta, Yoshiharu Suzuki