Patents Assigned to Polytronics Technology Corp.
  • Patent number: 11800895
    Abstract: A vaporizer comprises an absorber and a heating element. The absorber is configured to absorb the material to be vaporized and comprises a plurality of first pores of a 100-500 nm diameter and a plurality of second pores of a 20-100 nm diameter. A ratio of the number of the second pores N2 to the number of the first pores N1 in a unit area, i.e., N2/N1, is 10-50%. The heating element heats and vaporizes the material to be vaporized in the absorber.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: October 31, 2023
    Assignee: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Po-Chih Shen, Tong-Cheng Tsai, David Shau-Chew Wang, Yu-Sian Jhuo
  • Patent number: 11778739
    Abstract: A thermally conductive board includes a metal substrate, a metal layer, a thermal conductive insulating polymer layer, and a ceramic material layer. The thermal conductive insulating polymer layer is located between the metal layer and the metal substrate. The ceramic material layer includes an upper ceramic layer or a lower ceramic layer, or includes both the upper ceramic layer and the lower ceramic layer. The upper ceramic layer is disposed between the metal layer and the thermal conductive insulating polymer layer, and the lower ceramic layer is disposed between the thermal conductive insulating polymer layer and the metal substrate.
    Type: Grant
    Filed: March 1, 2021
    Date of Patent: October 3, 2023
    Assignee: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Kuo Hsun Chen, Cheng Tsung Yang, Feng-Chun Yu, Kai-Wei Lo
  • Patent number: 11694825
    Abstract: A radial-leaded over-current protection device comprises a PTC element, a first electrode lead, a second electrode lead and an electrically insulating encapsulation layer. The PTC element comprises a first conductive layer, a second conductive layer and a PTC material layer laminated therebetween. The PTC material layer comprises crystalline polymer and conductive filler dispersed therein. The first electrode lead has an end connecting to the first conductive layer, whereas the second electrode lead has an end connecting to the second conductive layer. The electrically insulating encapsulation layer includes a fluorine-containing polymer, and wraps around an entire outer surface of the PTC element and the ends of the first and second electrodes connecting to the PTC element. The electrically insulating encapsulation layer has a thickness of 102˜105 nm, and the radial-leaded over-current protection device has an initial resistance Rbf of 0.0017˜0.0027?.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: July 4, 2023
    Assignee: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Feng Ji Li, Yi-Hsuan Lee, Yung Hsien Chang
  • Patent number: 11626220
    Abstract: A surface-mountable over-current protection device comprises at least one PTC material layer, a first conductive layer, a second conductive layer, a first electrode, a second electrode, an insulating layer, and a cover layer. The PTC material layer comprises crystalline polymer and conductive fillers dispersed therein. The first conductive layer and the second conductive layer are disposed on a first surface and a second surface of the PTC material layer, respectively. The first electrode and the second electrode are electrically connected to the first conductive layer and the second conductive layer, respectively. The insulating layer is disposed between the first electrode and the second electrode for insulation. The cover layer includes a fluorine-containing polymer, and wraps around an entire outer surface of the surface-mountable over-current protection device.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: April 11, 2023
    Assignee: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Feng Ji Li, Yi-Hsuan Lee, Yung Hsien Chang
  • Patent number: 11594877
    Abstract: An over-current protection device comprises first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer comprises a polymer matrix and carbon black. The polymer matrix comprises a fluoropolymer having a melting point higher than 150° C. The carbon black is dispersed in the polymer matrix. A resistance jump Rjump_1000@16V/50A of the over-current protection device at 16V/50 A by 1000 cycles is 0.80-1.20. A resistance jump Rjump_1000@25V/50A of the over-current protection device at 25V/50 A by 1000 cycles is 0.90-1.30.
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: February 28, 2023
    Assignee: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Zhen Yu Dong, Yung Hsien Chang, Hsiu Che Yen, Yao Te Chang, Fu Hua Chu, Takashi Hasunuma
  • Patent number: 11574750
    Abstract: An over-current protection device comprises first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer comprises a polymer matrix, a conductive ceramic filler, a carbon-containing conductive filler, and an inner filler. The polymer matrix comprises a fluoropolymer having a melting point higher than 150° C. The inner filler is selected from one of aluminum nitride, silicon carbide, zirconium oxide, boron nitride, graphene, aluminum oxide, or any mixtures thereof, and comprises 2-10% by volume of the PTC material layer. The over-current protection device is able to mitigate negative temperature coefficient (NTC) behavior after trip of device, and achieves high hold current and high endurable power.
    Type: Grant
    Filed: August 20, 2021
    Date of Patent: February 7, 2023
    Assignee: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Hsiu Che Yen, Yung Hsien Chang, Zhen Yu Dong, Yao Te Chang, Fu Hua Chu
  • Patent number: 11511521
    Abstract: An insulated metal substrate (IMS) and a method for manufacturing the same are disclosed. The IMS includes an electrically conductive line pattern layer, an encapsulation layer, a first adhesive layer, a second adhesive layer, and a heat sink element. The encapsulation layer fills a gap between a plurality of electrically conductive lines of the electrically conductive line pattern layer. An upper surface of the encapsulation layer is flush with an upper surface of the electrically conductive line pattern layer. The first and second adhesive layer are disposed between the electrically conductive line pattern layer and the heat sink element. A bonding strength between the first adhesive layer and the second adhesive layer is greater than 80 kg/cm2.
    Type: Grant
    Filed: May 3, 2021
    Date of Patent: November 29, 2022
    Assignee: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Feng-Chun Yu, Kai-Wei Lo, Wen Feng Lee, Ru-Yi Cai
  • Patent number: 11201026
    Abstract: A protection device comprises a substrate, a fusible element and a heating element. The substrate comprises a first electrode and a second electrode on its surface. The fusible element is disposed on the substrate and connects to the first electrode and the second electrode at two ends. The fusible element comprises a first metal layer and a second metal layer disposed on the first metal layer. The second metal layer has a lower melting point than that of the first metal layer. The heating element is disposed on the substrate. In the event of over-voltage or over-temperature, the heating element heats up to melt and blow the fusible element. The second metal layer is 40-95% of the fusible element in thickness.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: December 14, 2021
    Assignee: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Tsung Min Su, Chia-Mao Chen, David Shau-Chew Wang
  • Patent number: 11044817
    Abstract: A thermally conductive board comprises a metal substrate, a foil containing copper, a thermally conductive and insulating layer and a barrier layer. The thermally conductive and electrically insulating layer is disposed on the metal substrate. The barrier layer is laminated between the foil containing copper and the thermally conductive and electrically insulating layer. The barrier is in direct contact with the foil containing copper, and the interface between the barrier layer and the foil containing copper comprises a microrough surface. The barrier layer has a Redox potential between 0 and ?1V. The microrough surface has a roughness Rz of 2-18 ?m.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: June 22, 2021
    Assignee: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Kuo-Hsun Chen, Chia-Hsiung Wu, Kai-Wei Lo, Yu-Hsuan Tseng
  • Patent number: 11018502
    Abstract: A cable comprises a power conductor, a data conductor and a first PTC device. The power conductor is configured to transmit electrical power between a source and a sink. The data conductor is configured to transmit data between the source and the sink. The first PTC device is coupled to the data conductor and its resistance increases drastically to decrease current flowing through the data conductor if a temperature of the first PTC device exceeds a first trip temperature. The first trip temperature is 55-80° C. The resistance of the PTC device is larger than 20 k? at 85° C. and larger than 80 k? at 100° C. A current flowing through the data conductor does not exceed 20 mA.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: May 25, 2021
    Assignee: Polytronics Technology Corp.
    Inventors: Zhen Yu Dong, Yung Hsien Chang, Hsiu Che Yen, Yao Te Chang, Pin Syuan Li
  • Patent number: 10943755
    Abstract: A protection device comprises a substrate, a fusible element, a flux and an insulating cover. The fusible element is disposed on the substrate and connects to a power line of an apparatus to be protected. The flux is disposed on the fusible element. The insulating cover is secured on the substrate to form a room for receiving the fusible element. The insulating cover has a bottom surface facing the substrate, and a plurality of protrusions are formed and distributed on the bottom surface to hold the flux in place.
    Type: Grant
    Filed: October 4, 2019
    Date of Patent: March 9, 2021
    Assignee: Polytronics Technology Corp.
    Inventors: Tsung Min Su, Chia Mao Chen, David Shau Chew Wang
  • Patent number: 10902980
    Abstract: An over-current protection device comprises first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer comprises a polymer, an electrically conductive filler and a metal compound filler. The PTC material layer comprises the polymer of 50-70% by volume, and the electrically conductive filler and the metal compound filler are distributed in the polymer. The metal compound filler has a particle size D50 of 2-15 ?m and 5-20% by volume and is selected from the group consisting of aluminum nitride, aluminum hydroxide, aluminum oxide, titanium oxide and zirconium oxide. The over-current protection device has a resistivity of 0.7-1.2 ?·cm.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: January 26, 2021
    Assignee: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Zhen-Yu Dong, Yung-Hsien Chang, Hsiu-Che Yen, Yao-Te Chang, Fu-Hua Chu
  • Patent number: 10892130
    Abstract: A protection device comprises a first planar substrate, a second planar substrate, a heating element and a fusible element. The second planar substrate is attached to the underside of the first planar substrate to form a composite structure. The heating element comprises an insulating layer and a heating layer disposed thereon. The heating element is disposed on the first planar substrate, and the insulating layer is disposed between the first planar substrate and the heating layer. The fusible element is disposed above the heating element. The heating element heats up to blow the fusible element in the event of over-voltage or over-temperature.
    Type: Grant
    Filed: March 19, 2018
    Date of Patent: January 12, 2021
    Assignee: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Tsungmin Su, Tongcheng Tsai, David Shau Chew Wang
  • Patent number: 10892072
    Abstract: A PTC device comprises a laminated substrate, a first PTC material layer, a second PTC material layer, a first metal layer and a second metal layer. The laminated substrate comprises a first conductive layer, a second conductive layer and an insulating layer laminated between the first and second conductive layers. The first PTC material layer is disposed on the first conductive layer, and the second PTC material layer is disposed on the second conductive layer. The first metal layer is disposed on the first PTC material layer, and the second metal layer is disposed on the second PTC material layer. The insulating layer has a through hole filled with PTC material to form a PTC connecting member of which one end connects to the first PTC material layer and another end connects to the second PTC material layer.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: January 12, 2021
    Assignee: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Chun-Teng Tseng, Yao-Te Chang, Wen Feng Lee
  • Patent number: 10804013
    Abstract: An over-current protection device is a hexahedron comprising an upper surface, a lower surface and four lateral surfaces. The over-current protection device comprises a PTC device, a first insulating layer, a first electrode layer and a second electrode layer. The PTC device comprises a first conductive layer, a second conductive layer and a PTC material layer laminated therebetween. The first conductive layer comprises a first conductive section and a second conductive section separated by at least one trench. The first insulating layer is disposed on the first conductive layer. The first electrode layer is disposed on the first insulating layer and electrically coupled to the first conductive section. The second electrode layer is disposed on the first insulating layer and electrically coupled to the second conductive section. The trench comprises a primary portion not parallel to a longitudinal direction of the first and second electrode layers.
    Type: Grant
    Filed: October 1, 2019
    Date of Patent: October 13, 2020
    Assignee: Polytronics Technology Corp.
    Inventors: Chun-Teng Tseng, David Shau Chew Wang
  • Patent number: 10614935
    Abstract: A PTC device comprises a current and temperature sensing element, a first insulating layer, a second insulating layer, a first electrode layer and a second electrode layer. The current and temperature sensing device is a laminated structure comprising a first conductive layer, a second conductive layer and a PTC material layer. The first and second conductive layers are disposed on first and second surfaces of the PTC material layer, respectively. The second surface is opposite to the first surface. The first and second insulating layers are disposed on the first and second conductive layers, respectively. The first electrode layer is disposed on the first insulating layer and electrically connects to the first conductive layer. The second electrode layer is disposed on the second insulating layer and electrically connects to the second conductive layer. Corners of the current and temperature sensing device are provided with insulating members.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: April 7, 2020
    Assignee: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Chun Teng Tseng, David Shau Chew Wang, Wen Feng Lee
  • Patent number: 10498092
    Abstract: A connector comprises a terminal and a layered circuit substrate. The layered circuit substrate connects to an end of the terminal, and comprises a PTC material layer, a first electrode layer forming an upper layer of the layered circuit substrate, and a second electrode layer forming a lower surface of the layered circuit substrate. The PTC material layer is disposed between the first and second electrode layers. The first and second electrode layers comprise first and second electrode pads which connect to a power supply, and the PTC material layer electrically connects to the first and second electrode pads to form an electrically conductive path in which the PTC material layer serves as a PTC resistor in series connection between the first and second electrode pads. When over-current or over-temperature occurs in the electrically conductive path, the PTC resistor will trip to a high resistance state.
    Type: Grant
    Filed: September 28, 2016
    Date of Patent: December 3, 2019
    Assignee: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Chun Teng Tseng, David Shau Chew Wang
  • Patent number: 10453594
    Abstract: A PTC device comprises a current and temperature sensing element, a first insulating layer, a second insulating layer, a first electrode layer and a second electrode layer. The current and temperature sensing element is a laminated structure comprising a first electrically conductive layer, a second electrically conductive layer and a PTC material layer. The first and second electrically conductive layers are disposed on first and second surfaces of the PTC material layer. The first and second insulating layers are disposed on the first and second electrically conductive layers. The first electrode layer is disposed on the first insulating layer and electrically connects to the first electrically conductive layer. The second electrode layer is disposed on the second insulating layer and electrically connects to the second electrically conductive layer. The first and second electrode layers serve as solder attach surfaces for soldering the PTC device onto a circuit board.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: October 22, 2019
    Assignee: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Chun Teng Tseng, David Shau Chew Wang
  • Patent number: 10395876
    Abstract: A protection device comprises a first planar substrate, a second planar substrate, a heater and a fusible element. The first planar substrate comprises a first surface, and the second planar substrate comprises a second surface facing the first surface. The heater comprises a first heating element and a second heating element in parallel connection, and the first heating element is disposed on the first surface. The fusible element is disposed on the first surface and adjacent to the first and second heating elements, thereby the fusible element is melted by absorbing the heat generated by the first heating element and/or second heating element. The second heating element has a resistance at least twice that of the first heating element.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: August 27, 2019
    Assignee: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Tsung Min Su, Chia Mao Chen, David Shau Chew Wang
  • Patent number: 10181715
    Abstract: A protection device comprises a first planar substrate, a second planar substrate, a heating element, a fusible element and an absorbent element. The first substrate comprises a first surface, and the second substrate comprises a second surface facing the first surface. The heating element is disposed on the first surface, and the fusible element is disposed above the heating element. The absorbent element is disposed on the second surface and above the fusible element. When over-current or over-temperature occurs, the heating element heats up to melt and blow the fusible element and the absorbent element absorbs melted metal of the fusible element.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: January 15, 2019
    Assignee: Polytronics Technology Corp.
    Inventors: Tsungmin Su, Tongcheng Tsai, David Shau Chew Wang