Patents Assigned to Polytronics Technology Corporation
  • Patent number: 7229575
    Abstract: The conductive polymer composition used in an over-current protection device blends a polymer substrate (for instance, PVDF) with the polyolefin and the conductive filler of carbon black alike. The polyolefin comprises of two monomers along the carbon chain to form its principal chemical structure. The first monomer includes four hydrogen atoms to bond with the carbon chain, and the second monomer includes at least one fluorine atom and at least one non-fluorine halogen atom. The non-fluorine halogen atom may be selected from chlorine, bromine and iodine elements.
    Type: Grant
    Filed: May 13, 2004
    Date of Patent: June 12, 2007
    Assignee: Polytronics Technology Corporation
    Inventors: David Shau-Chew Wang, En-Tien Yang
  • Patent number: 7205878
    Abstract: An over-current protection device comprises at least one PTC component, at least one thermal dissipation layer, at least one adhesive layer and at least two isolation layers, wherein the PTC component is formed by interposing a PTC material between two electrode layers. The at least one adhesive layer as a thermal conductive medium is interposed between the PTC component and at least one thermal dissipation layer to combine them. The at least two isolation layers separate the thermal dissipation layer, adhesive layer and electrode layers into two electrical independent portions.
    Type: Grant
    Filed: November 1, 2004
    Date of Patent: April 17, 2007
    Assignee: Polytronics Technology Corporation
    Inventors: Zack Lin, Ching Han Yu
  • Patent number: 7203049
    Abstract: The over-current protection device of the present invention uses the unbalanced properties of the thermal expansion coefficients between the outer and inner sides for an upper metallic conductive sheet and a lower metallic conductive sheet to generate a torque to deform outwardly. The torque is used to pull a current-sensing element and present with at least a cracking face, so as to introduce an electrically open effect similar to a fuse. Thus, the present invention can achieve the object for preventing the danger of circuit system by the short circuit during the burning of over-current protection device.
    Type: Grant
    Filed: September 8, 2004
    Date of Patent: April 10, 2007
    Assignee: Polytronics Technology Corporation
    Inventors: Edward Fu-Hua Chu, David Shau-Chew Wang, Yun-Ching Ma
  • Patent number: 7071810
    Abstract: An over-current protection apparatus comprises a plurality of over-current protection devices and a bonding sheet. Each over-current protection device comprises at least one current-sensitive element, two outer electrode layers and at least one insulating layer disposed on a surface of the current-sensitive element. The bonding sheet penetrates and connects the plurality of over-current protection devices, and is disposed on a surface of the at least one current-sensitive element for insulation.
    Type: Grant
    Filed: December 6, 2004
    Date of Patent: July 4, 2006
    Assignee: Polytronics Technology Corporation
    Inventors: Yun Ching Ma, Ching Han Yu
  • Publication number: 20050232334
    Abstract: A temperature sensor comprises at least one temperature sensing device and a sensing circuit. The temperature sensing device comprises a first electrode layer, a second electrode layer and a current-sensitive layer, wherein at least one of the first and second electrode layers comprises two electrically separated electrode plates, and the current-sensitive layer is laminated between the first and second electrode layers. The current-sensitive layer is made of PTC or NTC material, and the sidewalls are not plated with conductive films. The sensing circuit is electrically coupled to the temperature sensing device to read temperatures.
    Type: Application
    Filed: January 6, 2005
    Publication date: October 20, 2005
    Applicant: Polytronics Technology Corporation
    Inventors: Yun-Ching Ma, Zack Lin, Ching-Han Yu
  • Patent number: 6898063
    Abstract: The over-current protection device of the present invention uses the unbalanced properties of the thermal expansion coefficients between the outer and inner sides for an upper metallic conductive sheet and a lower metallic conductive sheet to generate a torque to deform outwardly. The torque is used to pull a current-sensing element and present with at least a cracking face, so as to introduce an electrically open effect similar to a fuse. Thus, the present invention can achieve the object for preventing the danger of circuit system by the short circuit during the burning of over-current protection device.
    Type: Grant
    Filed: July 8, 2003
    Date of Patent: May 24, 2005
    Assignee: Polytronics Technology Corporation
    Inventors: Edward Fu-Hua Chu, David Shau-Chew Wang, Yun-Ching Ma
  • Patent number: 6895660
    Abstract: The present invention discloses a manufacturing method of an over-current protection device, characterized in that the PTC plaque is conducted by punching under frozen state to form the over-current protection devices so as to reduce the heating and temperature rising in the PTC plaque due to punching and temperature difference between the metal foil and the conductive composite material. Relatively, the deformation and stress of the over-current protection device caused by punching will also be reduced. Therefore, there is no need for additional process to increase the temperature sensitivity and electrical property stability of the over-current protection device.
    Type: Grant
    Filed: December 30, 2002
    Date of Patent: May 24, 2005
    Assignee: Polytronics Technology Corporation
    Inventors: Edward Fu-Hua Chu, David Shau-Chew Wang, Chih-Ming Yu
  • Patent number: 6853527
    Abstract: The present invention discloses an over-current protection apparatus for high voltage, which connects the ceramic current-sensing element and polymer current-sensing element in series to form a novel over-current protection apparatus. By the characteristic of the polymer current-sensing element having higher switching off speed, the invention first responds to the over-current by raising its temperature, and then the heat is thermally conducted through the adhesive layer to the ceramic current-sensing element, resulting in a voltage drop produced by the over-current partially or predominantly received by the ceramic current-sensing element. Thus, the over-current protection device of the invention not only can endure high voltage (>600V), but also will not exhibit a negative temperature coefficient phenomenon.
    Type: Grant
    Filed: October 31, 2002
    Date of Patent: February 8, 2005
    Assignee: Polytronics Technology Corporation
    Inventors: Edward Fu-Hua Chu, David Shau-Chew Wang, Yun-Ching Ma
  • Patent number: 6809626
    Abstract: An over-current protection device comprises a positive temperature coefficient material layer, an upper electrode foil, a lower electrode foil, a first metal terminal layer, a second metal terminal layer and at least one insulating layer. The upper electrode foil is disposed on the upper surface of the positive temperature coefficient material layer, and the lower electrode foil is disposed on the lower surface of the positive temperature coefficient material layer. The first metal terminal layer electrically connects the upper electrode foil with at least one non-full-circular conductive through hole and at least one full-circular conductive through hole, and the second metal terminal layer electrically connects the lower electrode foil with at least one non-full-circular conductive through hole and at least one full-circular conductive through hole. The insulating layer isolates the upper electrode foil from the second metal terminal layer and the lower electrode foil from the first metal terminal layer.
    Type: Grant
    Filed: July 8, 2003
    Date of Patent: October 26, 2004
    Assignee: Polytronics Technology Corporation
    Inventors: Edward Fu-Hua Chu, David Shau-Chew Wang, Yun-Ching Ma
  • Patent number: 6806519
    Abstract: The present invention discloses a surface mountable device comprising a current-sensitive element and two electrodes. The current-sensitive element is composed of a PTC conductive composite, comprising at least one polymer and a conductive filler. The feature of the present invention is that the current-sensitive element is a three-dimensional bent structure so that the shape, length and height of the device can be varied according to the space of the circuit board and the resistance of the surface mountable device. Therefore, the mountable surface of the circuit board can be used more efficiently. Moreover, the area of the current-sensitive element of the present invention is larger than that of the conventional surface mountable device. Consequently, the normal resistance of the surface mountable device of the present invention is smaller than that of the conventional surface mountable device and the voltage endurance of the surface mountable device of the present invention is increased.
    Type: Grant
    Filed: October 7, 2002
    Date of Patent: October 19, 2004
    Assignee: Polytronics Technology Corporation
    Inventors: Edward Fu-Hua Chu, David Shau-Chew Wang, Yun-Ching Ma
  • Patent number: 6794980
    Abstract: The present invention discloses an over-current protection apparatus, comprising a current-sensitive element, a first electrode and a second electrode. The over-current protection apparatus of the present invention is a three-dimensional multi-layer structure, and can be formed by heating, pressing, etching, cutting and multi-stage deformation to prevent it from breakage during the bending process. Therefore, the over-current protection apparatus with at least one bend is formed.
    Type: Grant
    Filed: October 7, 2002
    Date of Patent: September 21, 2004
    Assignee: Polytronics Technology Corporation
    Inventors: Edward Fu-Hua Chu, David Shau-Chew Wang, Yun-Ching Ma
  • Publication number: 20040134599
    Abstract: An over-current protection device and manufacturing method thereof are revealed. The method for manufacturing an over-current protection device comprises the steps of: (1) providing at least two polymer current-sensing elements, the at least two polymer current-sensing elements comprise flame retardant, and the switching temperatures of adjacent polymer current-sensing elements differ from each other by at least 5° C.; (2) irradiating the at least two polymer current-sensing elements; (3) annealing the at least two polymer current-sensing elements; and (4) combining a first electrode foil and a second electrode foil with the at least two polymer current-sensing elements as a laminate. The at least two polymer current-sensing elements can be irradiated of less than 50 Mrads by Cobalt 60, and be annealed 6-20 hours with a temperature between 100-120° C. Moreover, the flame retardant may be composed of magnesium hydroxide or talc.
    Type: Application
    Filed: December 18, 2003
    Publication date: July 15, 2004
    Applicant: Polytronics Technology Corporation
    Inventors: David Shau-Chew Wang, Yun-Ching Ma, Edward F. Chu
  • Patent number: 6750754
    Abstract: The present invention reveals an over-current protection apparatus comprising a first electrode plate, a second electrode plate, a third electrode plate, a conductive element and a high resistance material layer, where the high resistance material layer may contact the first electrode plate to form a conducting path, the conductive element is connected to the first electrode plate and the second electrode, the thermally expanded conductive element can cut off current, the high resistance material layer is connected to the third electrode plate and the second electrode plate, and the thermal expansion coefficient of the high resistance layer is less than that of the conductive element. By virtue of the thermal expansion of the conductive element due to an over-current, the first electrode plate is departed from the third electrode plate so as to enforce the current flows through the high resistance material layer for current reduction.
    Type: Grant
    Filed: May 5, 2003
    Date of Patent: June 15, 2004
    Assignee: Polytronics Technology Corporation
    Inventors: David Shau-Chew Wang, Chih-Ming Yu, Yi-Nuo Chen
  • Patent number: 6665164
    Abstract: The present invention relates to an over-current protecting apparatus, which comprises at least one PTC over-current protecting component and a body. The PTC over-current protecting component has a PTC material, electrodes covering the PTC material, and metal terminations electrically connected to the electrodes. The body has an insulating layer and a first conductive and second conductive regions covering the insulating layer. An end of the first conductive region and second conductive region are electrically connected to the metal terminations, and another ends of the first conductive and second conductive regions are mounted to a PCB. The metal material occupies over 20% area of the sidewall of the first conductive and second conductive regions for increasing solderability. Besides, the top of the PTC over-current protecting component can be adhered to another body to form a symmetrical bodies.
    Type: Grant
    Filed: March 19, 2002
    Date of Patent: December 16, 2003
    Assignee: Polytronics Technology Corporation
    Inventors: Edward Fu-Hua Chu, David Shau-Chew Wang, Yun-Ching Ma
  • Patent number: 6512446
    Abstract: The present invention discloses an over-current protection apparatus, which comprises a current-sensitive element and at least two electrodes. The current-sensitive element is composed of a positive temperature coefficient (PTC) conductive composition, which includes at least one polymer, a conductive filler and a non-conductive filler. The melting point of the polymer is greater then 110° C., and the vicat softening point of the polymer is smaller than 110° C. for improving the conductivity and thermal stabilization of the over-current protection apparatus.
    Type: Grant
    Filed: November 28, 2001
    Date of Patent: January 28, 2003
    Assignee: Polytronics Technology Corporation
    Inventors: David Shau-Chew Wang, Yun-Ching Ma, Chiung-Huei Shieh
  • Patent number: 6487084
    Abstract: A PCB comprising a substrate, at least one circuit layer and at least one insulating layer, characterized in that the PCB further comprises at least one embedded functional material such as a PTC, and NTC and ZTC material. If the PTC material is applied in the present invention, a normal resistance of the present invention will be substantially smaller than that of the conventional PTC protection apparatus since the area of the PTC material of the present invention is larger than that of the conventional PTC protection apparatus. Moreover, through an electrically conductive hole, an upper electrode and a lower electrode respectively lying on top and bottom surfaces of the functional material are respectively connected with an apparatus mounted on a surface of the PCB to form a conductive circuit. Thus, at least one over-current protection apparatus which is usually mounted on the surface of the PCB is eliminated, and the surface utilization rate of the PCB is improved.
    Type: Grant
    Filed: February 5, 2002
    Date of Patent: November 26, 2002
    Assignee: Polytronics Technology Corporation
    Inventors: Edward Fu-Hua Chu, Yun-Ching Ma, David Shau-Chew Wang
  • Patent number: 6479575
    Abstract: Conductive polymer blend composites exhibiting PTC (positive temperature coefficient of resistance) behavior, comprising at least two types of polymers and preferably at least two types of conductive particulate materials (e.g., carbon blacks), and electrical devices containing such composites. The two polymers are selected to have different melt flow index values, while the two particulate materials are selected to have different average particle sizes and DBP values.
    Type: Grant
    Filed: April 19, 1999
    Date of Patent: November 12, 2002
    Assignee: Polytronics Technology Corporation
    Inventors: Fu-Hua Chu, Yun-Ching Ma
  • Publication number: 20020109576
    Abstract: The present invention discloses an over-current protection apparatus, which comprises a current-sensitive element and at least two electrodes. The current-sensitive element is composed of a positive temperature coefficient (PTC) conductive composition, which includes at least one polymer, a conductive filler and a non-conductive filler. The melting point of the polymer is greater then 110° C., and the vicat softening point of the polymer is smaller than 110° C. for improving the conductivity and thermal stabilization of the over-current protection apparatus.
    Type: Application
    Filed: November 28, 2001
    Publication date: August 15, 2002
    Applicant: Polytronics Technology Corporation
    Inventors: David Shau-Chew Wang, Yun-Ching Ma, Chiung-Huei Shieh
  • Patent number: 6377467
    Abstract: The present invention relates to a novel thermal-sensitive resistive apparatus, such as PTC and NTC, which allocates planar electrode films on the top and bottom surfaces of a prior art thermal-sensitive resistive apparatus, such as a PTC apparatus, to laminate with an outer electrode layer. A plurality of interconnection vias are electroplated with conductive material to connect to any plane. It is convenient to surface mount the apparatus of the present invention on a printed circuit board. The present invention can largely increase the dimensional stability of components and overcome the disadvantage that thermal diffusion of the prior are surface mounted resistive apparatus is affected easily by line width and environments.
    Type: Grant
    Filed: April 4, 2000
    Date of Patent: April 23, 2002
    Assignee: Polytronics Technology Corporation
    Inventors: Fu-Hua Chu, Yun-Ching Ma, David Shau-Chew Wang