Abstract: An edge gripping device grips and ungrips a substrate, such as a semiconductor wafer. A blade extends in a distal direction from a base of the device. At least one distal contact member is provided at the tip of the blade. Two proximal lever arms are pivotally coupled for synchronized, oppositely directed rotation to the base. Each lever arm has at least one proximal contact member at an outer end. A biasing member is coupled to the two proximal lever arms and to an actuator to effect pivoting movement of the lever arms. The pivoting motion moves the ends of the arms generally radially toward and away from the center of the substrate to be gripped or ungripped, thereby minimizing sliding of the substrate. The biasing member is biased to retain the lever arms in a closed position in the event of a power failure. Ramps are provided next to each contact member. The contact members and ramps are profiled to minimize the zone of the substrate edge that is contacted.

Abstract: A modular frame assembly for a wafer fabrication system comprising at least one base casting and at least one upstanding pod door opening casting. The at least one base casting and at least one upstanding pod door opening casting are self registering and allow frames for wafer fabrication systems of any normally desired configuration to be produced out of a small number of cast modules. More specifically, in a preferred embodiment, frames configured to mate with one to four commercially available loaders may be readily assembled out of the aluminum castings.

Abstract: A system is provided for sensing, orienting, and transporting wafers in an automated wafer handling process that reduces the generation of particles and contamination so that the wafer yield is increased. The system includes a robotic arm for moving a wafer from one station to a destination station, and an end-effector connected to an end of the robotic arm for receiving the wafer. The end-effector includes a mechanism for gripping the wafer, a direct drive motor for rotating the wafer gripping mechanism, and at least one sensor for sensing the location and orientation of the wafer. A control processor is provided for calculating the location of the center and the notch of the wafer based on measurements by the sensor(s). Then, the control processor generates an alignment signal for rotating the wafer gripping mechanism so that the wafer is oriented at a predetermined position on the end-effector while the robotic arm is moving to another station.

Abstract: An improved automated material handling system that allows an overhead hoist supported by a suspended track to access Work-In-Process (WIP) parts from storage locations beside the track. The automated material handling system includes an overhead hoist transport vehicle for transporting an overhead hoist on a suspended track, and one or more storage bins for storing WIP parts located beside the track. Each storage bin is either a movable shelf or a fixed shelf. To access a WIP part from a selected shelf, the overhead hoist transport vehicle moves along the suspended track to a position at the side of the shelf. Next, the movable shelf moves to a position underneath the overhead hoist. Alternatively, overhead hoist moves to a position above the fixed shelf. The overhead hoist is then operated to pick a desired WIP part directly from the shelf, or to place one or more WIP parts directly to the shelf.

Abstract: A fast serial interface including a three-wire network connection between a bus controller and one or more bus devices is disclosed. The bus controller processes and issues data packets across the three-wire network that include a command code, a bus device selection code, and a bus device register selection code. If the command code corresponds to write code, then the selected bus device stores the data contained within the packet in the selected register. If the command code corresponds to a read command, the selected bus device retrieves the data stored in the selected register, forms a read data packet and transfers the read data packet to the bus controller.

Abstract: A horizontal door system is used in conjunction with an interfloor vertical transport system that penetrates an opening in a floor. The vertical transport system has vertical elements that define a fixed horizontal cross-section within the opening, and the door system includes a leading edge profile having a configuration matching the fixed horizontal cross-section of the vertical transport system. The door system is particularly suitable as a fire door system to seal upper and lower fire zones.

Abstract: In brief, the present invention provides a system for the interconnection of semiconductor fabrication tools (“process tools”) in a semiconductor fabrication facility by use of a data network and microprocessor based interface (“browser”) associated with each process tool. The data network and microprocessor based interface provide communication in accordance with known standards via Intranet or Internet data transfer links to one or more remotely disposed browsers. Data is immediately available in real time on all aspects of the operation of the fabrication facility. Equipment engineers and process engineers can browse the various process tools from any location. Host communications to and from the tools can be monitored without affect on factory operation. The interface is compatible with standard process tools and factory automation or management software systems.

Abstract: A modular frame assembly for a wafer fabrication system comprising at least one base casting and at least one upstanding pod door opening casting. The at least one base casting and at least one upstanding pod door opening casting are self registering and allow frames for wafer fabrication systems of any normally desired configuration to be produced out or a small number of cast modules. More specifically, in a preferred embodiment, frames configured to mate with one to four commercially available loaders may be readily assembled out of the aluminum castings.

Abstract: A coaxial inductive power transfer and distribution apparatus includes a stationary primary conductor and a mobile secondary coil magnetically coupled together to provide for inductive power transfer therebetween. A return conductor that is stationary is mechanically coupled to the primary conductor and ensures the position stability of the primary conductor with respect to the moveable secondary coil. The return conductor also includes an air gap in which a support member for the mobile secondary coil is disposed within. The mobile secondary winding includes a high permeability toroidal core that is coaxially disposed about, and spaced apart from, the primary conductor. A multi-turn coil is radially disposed about the high permeability toroidal core. The support member for the mobile secondary winding extends through the air gap in the return conductor to the exterior of the return conductor, where it may be coupled to an electric vehicle.

Abstract: A traffic management system for an automatic material handling system (AMHS) divides time into a series of discrete time periods and analyzes a plurality of move requests that are to be executed within a particular time period is disclosed. The traffic management system receives a plurality of move requests from the AMHS and determines how many move requests are to be executed and selects which move requests in particular will be executed in the next time period. The traffic management system prioritizes the selected move requests by analyzing each source node and destination node contained in a move request in conjunction with other node traffic data. The traffic management system analyzes this data to ensure that a move request is not executed if a material transport vehicle would be dispatched to a node having a node traffic balance value that exceeds a predetermined value and a node traffic density value that exceeds a predetermined value.

Abstract: A coaxial inductive power transfer and distribution apparatus is disclosed that includes a primary conductor that is stationary and a mobile secondary coil magnetically coupled to the stationary primary conductor to provide an inductive power transfer therebetween. The primary and secondary coils are disposed within a return conductor that is stationary and acts as a return path for current flowing in the primary center conductor. The primary conductor is mechanically connected to the interior surface of the return conductor to ensure the position stability of the primary conductor with respect to the secondary coil. The return conductor also includes an air gap in which a support member for the mobile secondary coil and structure is disposed within. The mobile secondary coil and structure includes a toroidal core composed of a high permeability material that is coaxially disposed about, and spaced apart from, the primary conductor.

Abstract: An edge gripping device for a robot arm grips and ungrips substrates, such as semiconductor wafers. A base is fixed to an end of the robot arm. A blade, having a distal contact location thereon, and a pusher bar, having preferably two proximal contact locations thereon, are movably mounted to the base via a linkage mechanism. The linkage mechanism includes two four-bar linkages. The first four-bar linkage has a stationary link and three movable links connected in a parallelogram configuration. The pusher bar is fixed to one of the movable links of the first linkage for movement therewith. The second four-bar linkage has a stationary link and three movable links connected in a trapezoidal configuration. The blade is fixed to one of the movable links of the second linkage for movement therewith. The two linkages share a stationary pivot point.

Abstract: A handler for transporting planar substrates, in particular wafers, used in the semiconductor industry, between at least two stations. The handler includes a movable flat support arm for receiving a substrate and means for defining the location of the substrate in the area of a predetermined point on the support arm. A vibration generator for generating a longitudinal ultrasonic vibration is provided, that the vibration generator interacts with the support arm in such a way that a substantially stationary vibration with at least one antinode can be set on the flat support arm, which permits a levitation of a substrate placed thereon. A means for defining the location of the substrate provide a lateral positioning exclusively by an interaction with the edge area of a substrate.

Abstract: An edge gripping device grips and ungrips a substrate, such as a semiconductor wafer. A blade extends in a distal direction from a base of the device. At least one distal contact member is provided at the tip of the blade. Two proximal lever arms are pivotally coupled for synchronized, oppositely directed rotation to the base. Each lever arm has at least one proximal contact member at an outer end. A biasing member is coupled to the two proximal lever arms and to an actuator to effect pivoting movement of the lever arms. The pivoting motion moves the ends of the arms generally radially toward and away from the center of the substrate to be gripped or ungripped, thereby minimizing sliding of the substrate. The biasing member is biased to retain the lever arms in a closed position in the event of a power failure. Ramps are provided next to each contact member. The contact members and ramps are profiled to minimize the zone of the substrate edge that is contacted.

Abstract: A storage and retrieval system is provided for safely and efficiently storing reticles in a clean environment. An enclosed storage unit is provided for storing the reticles, and other items such as wafers and the like, in an environment which minimizes the amount of contaminants and is suitable for use in a semiconductor fabrication clean room. A retrieval unit is provided separate from the enclosed storage unit for accessing and staging the reticles before they enter and leave the storage unit for minimizing exposure of the storage unit. The storage unit includes a movable storage matrix having a plurality of bays for storing the reticles. The movable storage matrix is selectively moved or rotated by a drive mechanism that is located external to the storage unit so that the storage unit is substantially free of contaminant generating components.

Abstract: A person-guided vehicle (PGV) is provided for transporting and manipulating at least one carrier containing items such as semiconductor wafers to be loaded or unloaded at a load port. The PGV includes a wheeled cart having a frame configured to align with the load port. A carrier support assembly is mounted to the frame. The carrier support assembly includes a cradle configured to support the carrier, a lifting mechanism operative to raise and lower the cradle vertically, and a horizontal slide mechanism operative to move the cradle horizontally to and from a position outboard of the cart. A damping system is coupled to the cart and operative to dampen vibrations of the carrier in the carrier support assembly. One side of the cart is free of structural members to allow operator access to the carrier support assembly and to allow ready manipulation of the cart by the operator.

Abstract: A method for a run-to-run (R2R) control system includes processing materials using a process input and producing a process output, storing the process input in a database, the storing including using a timestamp, storing at least one measurement of the process output in the database aligned with each process input using the timestamp, iterating over the data from the database to estimate a process state, and, if one or more of the measurements is missing from the database, predicting the missing measurements for the database based on a model, and determining an error for calculating a next process input, the error based on the data in the database.

Abstract: An edge gripping device for a robot arm grips and ungrips substrates, such as semiconductor wafers. A base is fixed to an end of the robot arm. A blade, having a distal contact location thereon, and a pusher bar, having preferably two proximal contact locations thereon, are movably mounted to the base via a linkage mechanism. The linkage mechanism includes two four-bar linkages. The first four-bar linkage has a stationary link and three movable links connected in a parallelogram configuration. The pusher bar is fixed to one of the movable links of the first linkage for movement therewith. The second four-bar linkage has a stationary link and three movable links connected in a trapezoidal configuration. The blade is fixed to one of the movable links of the second linkage for movement therewith. The two linkages share a stationary pivot point.

Abstract: A substrate handling system with integrated door removal assembly for an environmentally controlled substrate processing chamber is provided. The system includes a robot positioned within the chamber. A drive mechanism is connected to the robot. A door interface mechanism is attached to the drive mechanism and includes a door key and a door key control assembly. The drive mechanism provides mechanical control of the door key control assembly such that that door key is manipulated to couple a substrate carrier door to a port door. The coupled doors are storable within the chamber or on the robot. The drive mechanism may also include a substrate end effector, thereby allowing the robot to transport substrates within the chamber. The robot is movable within the chamber to multiple processing stations.

Abstract: A person-guided vehicle (PGV) is provided for transporting and manipulating at least one carrier containing items such as semiconductor wafers to be loaded or unloaded at a load port. The PGV includes a wheeled cart having a frame configured to align with the load port. A carrier support assembly is mounted to the frame. The carrier support assembly includes a cradle configured to support the carrier, a lifting mechanism operative to raise and lower the cradle vertically, and a horizontal slide mechanism operative to move the cradle horizontally to and from a position outboard of the cart. A damping system is coupled to the cart and operative to dampen vibrations of the carrier in the carrier support assembly. One side of the cart is free of structural members to allow operator access to the carrier support assembly and to allow ready manipulation of the cart by the operator.