Abstract: A bus driver circuit divides an internal data bus for an integrated circuit memory into at least two groups, designated by speed. A faster group of data lines and a slower group of data lines are placed in an interleaved fashion in order to provide a two group shielding solution. At the earliest opportunity following the reception of a read command, the data from memory banks in the memory is sorted into these two groups. For a DDR3 memory, the sorting method is based on the A2 column address, known as C2. All of the data is brought out of the banks in parallel and sorted as it enters the main amplifiers. These main amplifiers are also divided into two groups, faster and slower. Each amplifier then connects to a data line (G-line) of the same group. The clock assigned to the fast group fires right away, thereby connecting the data associated with the fast amplifiers to the fast data group. This data group then proceeds to the output buffers through the entire data path as fast as possible.

Abstract: A dual bit line precharge architecture and method for low power DRAM which provides the low operating voltage of a non-half supply voltage (VCC/2) precharge with the low memory array current consumption and low memory array noise spike of VCC/2 precharge techniques. The architecture and technique of the present invention provides both reference voltage (VSS) precharged sub arrays and VCC precharged sub arrays on the same DRAM memory either with or without the novel charge sharing or charge recycling circuitry between these two different sub arrays as disclosed herein.

Abstract: Performance of field effect transistors and other channel dependent devices formed on a monocrystalline substrate is improved by carrying out a high temperature anneal in a nitrogen releasing atmosphere while the substrate is coated by a sacrificial oxide coating containing easily diffusible atoms that can form negatively charged ions and can diffuse deep into the substrate. In one embodiment, the easily diffusible atoms comprise at least 5% by atomic concentration of chlorine atoms in the sacrificial oxide coating and the nitrogen releasing atmosphere includes NO. The high temperature anneal is carried out for less than 10 hours at a temperature less than 1100° C.

Abstract: A memory device includes a cell stack and a select gate formed adjacent to the cell stack. The cell stack includes a tunneling dielectric layer, a charge storage layer, a blocking dielectric layer, and a control gate. Applying a positive bias to the control gate, the select gate and the source of the device injects negative charges from a channel region of a substrate by hot electron injection through the tunneling dielectric layer at a location near a gap between the select gate and the control gate into the charge storage layer to store negative charges in the charge storage layer. Applying a negative bias to the control gate directly tunnels positive charges from the channel region of the substrate through the tunneling dielectric layer and into the charge storage layer to store positive charges in the charge storage layer.

Abstract: A dual bit line precharge architecture and method for low power DRAM which provides the low operating voltage of a non-half supply voltage (VCC/2) precharge with the low memory array current consumption and low memory array noise spike of VCC/2 precharge techniques. The architecture and technique of the present invention provides both reference voltage (VSS) precharged sub arrays and VCC precharged sub arrays on the same DRAM memory either with or without the novel charge sharing or charge recycling circuitry between these two different sub arrays as disclosed herein.

Abstract: A dual bit line precharge architecture and method for low power DRAM which provides the low operating voltage of a non-half supply voltage (VCC/2) precharge with the low memory array current consumption and low memory array noise spike of VCC/2 precharge techniques. The architecture and technique of the present invention provides both reference voltage (VSS) precharged sub arrays and VCC precharged sub arrays on the same DRAM memory either with or without the novel charge sharing or charge recycling circuitry between these two different sub arrays as disclosed herein.

Abstract: A twin cell architecture for dynamic random access memory (DRAM) devices and those devices incorporating embedded DRAM utilizing an open bitline configuration is disclosed. The twin cell architecture disclosed has significant advantages over conventional designs in terms of power, radiation hardness and speed and does not require intermediate supply voltage bitline precharge while allowing for 6F2 memory cell layouts.

Abstract: A data capture circuit includes strobes that track input data even when conditions arise that cause the differences in skew from interpreting data state ones and zeros. This is accomplished whether these skews arise from reference voltage variation, data pattern loading, power supply droop, process variations within the chip itself, or other causes. The differential input strobes of the data capture circuit are input into individual input buffers, each compared against a reference voltage individually, as well as a data input pin. The outputs from these buffers are maintained separate from each other all the way to the point where the input data is latched. In latching the input data, data ones are latched entirely based on input signals derived from a rising edge (both strobes and data), and zeros are latched entirely based on input signals derived from a falling edge (both strobes and data).

Abstract: A column repair circuit uses a system of circuits that automatically stops the shifting of register contents independently of the number of bits to be shifted. The circuit is only dependent on the number of bits in a column address repair block. By adding shift register positions to one end of each shift register chain, a dedicated block of bits is used to detect the end of the shift chain without explicitly knowing the length of the chain. The shift register positions provide a hard-programmed code that can be used to stop the shifting of data automatically. The shift register positions also provide a space for hard-programmed code bits that can be examined to determine when the shift process ends. A shift chain can be controlled with a controller so long as the information is organized into groups of ‘k’ bits. The controller only requires information regarding the value of the number ‘k’ and the pre-programmed stop code in order to control any number of bits in a shift chain.

Abstract: A configurable architecture, hybrid analog/digital delay locked loop and technique with fast open loop digital locking for integrated circuit dynamic random access memory (DRAM) devices and devices incorporating embedded DRAM. The DLL design and technique disclosed employs a hybrid analog/digital delay line, but does not use conventional closed loop architecture during the digital phase of the locking process.

Abstract: Performance of field effect transistors and other channel dependent devices formed on a monocrystalline substrate is improved by carrying out a high temperature anneal in a nitrogen releasing atmosphere while the substrate is coated by a sacrificial oxide coating containing easily diffusible atoms that can form negatively charged ions and can diffuse deep into the substrate. In one embodiment, the easily diffusible atoms comprise at least 5% by atomic concentration of chlorine atoms in the sacrificial oxide coating and the nitrogen releasing atmosphere includes NO. The high temperature anneal is carried out for less than 10 hours at a temperature less than 1100° C.

Abstract: An asymmetric data path position and delays technique enabling high speed access in integrated circuit memory devices which is asymmetric in terms of the delay from the array to the I/O buffers based on the position relative within a known starting address of a pre-fetch field. In accordance with the technique of the present invention, the delay is not only asymmetric in terms of its physical length, but also in the number of pipeline stages and the clocks that control them and can also be asymmetric in terms of the column address required to access each section of the array and its designated pre-fetch field.

Abstract: A batch of wafers is temporarily stalled during a Double Pattern Technology (DPT) process before a temporary representation of a second of to-be-overlaid patterns is permanently combined with a first of the patterns. Sampled ones of the stalled wafers are inspected to determine if sufficiently close alignment is present between the two patterns. If excessive misalignment is detected (e.g., by SEM microscopy), the second but still temporary pattern representation is erased from all wafers of the batch and the batch is routed for rework and corrected reestablishment of the temporary representation of the second of to-be-overlaid patterns.

Abstract: Charge-trapping dielectric (160) in a nonvolatile memory cell is recessed from under the control gate's edge and/or from an edge of a substrate isolation region. The recessed geometry serves to reduce or eliminate charge trapping in regions from which the charge may be difficult to erase.

Abstract: A floating gate memory cell's channel region (104) is at least partially located in a fin-like protrusion (110P) of a semiconductor substrate. The floating gate's top surface may come down along at least two sides of the protrusion to a level below the top (110P-T) of the protrusion. The control gate's bottom surface may also comes down to a level below the top of the protrusion. The floating gate's bottom surface may comes down to a level below the top of the protrusion by at least 50% of the protrusion's height. The dielectric (120) separating the floating gate from the protrusion can be at least as thick at the top of the protrusion as at a level (L2) which is below the top of the protrusion by at least 50% of the protrusion's height. A very narrow fin or other narrow feature in memory and non-memory integrated circuits can be formed by providing a first layer (320) and then forming spacers (330) from a second layer without photolithography on sidewalls of features made from the first layer.

Abstract: After forming a stack of layers (130, 140, 310) for a transistor or a charge-trapping memory over an active area (110), and before etching isolation trenches (160) in the semiconductor substrate (120) with the stack as a mask, spacers (610) are formed on the stack's sidewalls. The trench etch may include a lateral component, so the top edges of the trenches may be laterally recessed to a position under the spacers or the stack. After the etch, the spacers are removed to facilitate filling the trenches with the dielectric (to eliminate voids at the recessed top edges of the trenches). Other embodiments are also provided.

Abstract: An output driver calibration circuit includes a programmable drive strength output pullup driver including a strongest transistor and a number of other transistors, a programmable drive strength output pulldown driver including a strongest transistor and a number of other transistors, and a calibration circuit for generating a number of control signals for controlling the transistors in the output pullup driver and the transistors in the output pulldown driver, wherein the control signals are generated simultaneously, except for two the strongest driver transistors.

Abstract: In photolithographic exposure, a feature (144) of an optical mask is projected onto a dark area (160). The light intensity inside the dark area is reduced by providing a non-printable clear cutout (410) inside the feature. The optical mask has the same optical pathlength outside the feature (144) adjacent to the entire outer boundary of the feature as at the cutout, the optical pathlength being measured along the optical mask's thickness.

Abstract: A multi-bank block architecture for integrated circuit memory devices which effectively reduces the total length of the datapath for a given input/output (I/O) from the memory cells in the memory array to the actual device I/O pad. In accordance with the present, a memory block in a memory device is effectively divided into two or more banks, and between these banks an additional non-shared sense amplifier band is added as a sense amplifier cannot be shared across a bank boundary. Within this multi-bank block, separate data paths are provided for the banks with the column (Y-Select) lines being common.

Abstract: In a nonvolatile memory cell with charge trapping dielectric (150), the tunnel dielectric (140) includes chlorine adjacent to the charge trapping dielectric but no chlorine (or less chlorine) adjacent to the cell's channel region (120). The chlorine adjacent to the charge trapping dielectric serves to improve the programming and/or erase speed. The low chlorine concentration adjacent to the channel region prevents chlorine from degrading the data retention. Other features are also provided.