Abstract: A method for operating a dynamic random access memory device includes providing a clock signal to a clock terminal of the dynamic random access memory device, selecting one of a first operating mode and a second operating mode of the dynamic random access memory device, the first operating mode, when selected, corresponding to the DRAM periodically refreshing a first number of word lines, and the second operating mode, when selected, corresponding to the DRAM periodically refreshing a second number of word lines different from the first number, and providing a self-refresh command to a command terminal of the dynamic random access memory device.

Abstract: A device including first and second semiconductor chips, each of first and second semiconductor chips including first to M-th penetration electrodes, M being an integer equal to or greater than 3, each of the first to M-th penetration electrodes penetrating through a semiconductor substrate, and the first semiconductor chip including a first input circuit coupled to the M-th penetration electrode of the first semiconductor chip at an input node thereof, the first and second semiconductor chips being stacked with each other in which the first to M-th penetration electrodes of the second semiconductor chip are vertically arranged respectively with the first to M-th penetration electrodes of the first semiconductor chip, in which the first to (M?2)-th penetration electrodes of the second semiconductor chip are electrically coupled to the second to (M?1)-th penetration electrodes of the first semiconductor chip, respectively.

Abstract: To include first and second data input/output terminals allocated to first and second memory circuit units, respectively, and an address terminal allocated in common to these memory circuit units. When a first chip selection signal is activated, the first memory circuit unit performs a read operation or a write operation via the first data input/output terminal based on an address signal regardless of an operation of the second memory circuit unit. When a second chip selection signal is activated, the second memory circuit unit performs a read operation or a write operation via the second data input/output terminal based on the address signal regardless of an operation of the first memory circuit unit. With this configuration, a wasteful data transfer can be prevented, and the effective data transfer rate can be increased.

Abstract: An output signal generation device in accordance with disclosed embodiments includes: a phase adjustment unit that generates an output signal on the basis of an input signal and is capable of executing an adjustment operation of setting the phase difference between the input signal and the output signal to a predetermined value; a holding unit that holds a reference voltage; a comparison voltage generation unit that generates a comparison voltage that is dependent on a power supply voltage; and a control unit that intermittently compares the comparison voltage with the reference voltage held in the holding unit, causes the phase adjustment circuit to execute the adjustment operation when the comparison result satisfies a predetermined condition representing a variation in the power supply voltage, and changes the reference voltage held in the holding unit in accordance with the power supply voltage.

Abstract: Disclosed herein a device that includes a memory cell array including plurality of word lines, a plurality of bit lines each intersecting the word lines and a plurality of memory cells each disposed at an associated one of intersections of the word and bit lines, and the device further includes a driver configured to drive a selected one of the word lines from an inactive level to an active and to drive the selected one of the word lines from the active level to an intermediate level at a first rate and from the intermediated level to the inactive level at a second rate. The intermediate level is between the active and inactive levels, and the first rate is greater than the second rate.

Abstract: According to the system of the present invention, data (DQ) signals are outputted/received between a controller 100 and a memory 200 based on a data strobe signal sent out from the controller 100. The data strobe signal is independently and completely separated from a clock signal. The data strobe signal has a frequency different from a clock signal. Therefore, the memory 200 is not required to generate a read data strobe signal from the clock signal nor to send the read data strobe signal in synchronization with the clock signal.

Abstract: A photomask has a mask blank and a light shielding film formed on the mask blank. The light shielding film includes a plurality of opening traces extending in a first direction. An end of a first opening trace in the first direction and an end of a second opening trace in the first direction are in different positions in the first direction. The second opening trace adjoins the first opening trace.

Abstract: A method of manufacturing a device includes: forming a fifth insulating film on a semiconductor substrate having a peripheral circuit region and a memory cell region in which a contact pad is formed; forming a second sacrifice film in the memory cell region in which the fifth insulating film is formed; forming, after the forming of the second sacrifice, a second insulating film in the peripheral circuit region on the semiconductor substrate to have a sidewall coming into contact with the second sacrifice film; forming a third insulating film to cover an upper surface of the second sacrifice film and an upper surface of the second insulating film; forming a hole penetrating through the third insulating film, the second sacrifice film and the fifth insulating film in the memory cell region; forming a lower electrode in the hole; and removing all of the second sacrifice film.

Abstract: Disclosed herein is a semiconductor device comprising local bit lines, a global bit line, local switch control lines, main switch control lines, hierarchical switches controlling electrical connections between the local bit lines and the global bit line in response to potentials of the local switch control lines, local switch drivers driving the local switch control lines in response to potentials of the main switch control lines, and main switch drivers selectively activating the main switch control lines.

Abstract: A device includes a voltage converter circuit that includes an output node, a voltage drop circuit, and a first transistor. The first transistor is electrically coupled between the output node and the voltage drop circuit.

Abstract: A method for calibrating an output buffer including adjusting a first impedance code applied to a first plurality of first transistor units connected in parallel between a calibration terminal and a first power supply potential so that the potential on the calibration terminal substantially equals a reference potential, applying the first impedance code to a second plurality of first transistor units connected in parallel between a node and the first power supply potential, adjusting a second impedance code applied to a second transistor unit connected between the node and a second power supply potential so that the potential on the node substantially equals the reference potential, applying the first impedance code to a third plurality of first transistor units connected in parallel between a data terminal and the first power supply potential, and applying the second impedance code to a fourth plurality of second transistor units.

Abstract: A system, includes a controller comprising a plurality of first external terminals configured to supply a command and an address, and communicate a data, and communicate a strobe signal related to the data; and a semiconductor memory device including a plurality of second external terminals corresponding to the plurality of first external terminals, at least one of the plurality of first external terminals and at least one of the plurality of second external terminals each being capable of supplying an information specifying a length of a preamble of the strobe signal before the semiconductor memory device communicates the data between the controller and the semiconductor memory device, the semiconductor memory device further including a preamble register configured to be capable of storing the information.

Abstract: A supply voltage generating circuit that enables a reduction in chip area includes: a booster for outputting a boosted voltage upon generating the boosted voltage by charge pumping of a capacitor element; a power-supply step-down unit for stepping down voltage of an external power supply to a voltage within a breakdown-voltage range of the capacitor element, and applying the stepped-down voltage to the power supply of the booster; and a switch element for switching between application of the external power supply to the power supply of the booster directly or via the power-supply step-down unit. The booster comprises multiple stages of booster circuits. The thicknesses of gate oxide films of capacitor elements constituted by MOS transistors included in respective ones of the booster circuits are the same and are made smaller than the thickness of a gate oxide film of a MOS transistor included in a load circuit having the output of the booster at its power supply.

Abstract: A semiconductor device includes the following elements. An element isolation portion separates first and second diffusion regions in a semiconductor substrate each other. A first insulating film is formed over the element isolation portion and the first and second diffusion regions. First and second contact plugs are formed over the first and second diffusion regions, respectively. The first and second contact plugs penetrate the first insulating film. A first conductive layer is formed over the first insulating film over the element isolation portion. A second insulating film is formed over the first conductive layer. A third contact plug penetrates the second insulating film, the third contact plug connecting the first contact plug. A second conductive layer is formed over the second insulating film contacting the third contact plug. The first and second conductive layers partly overlap the element isolation portion.

Abstract: A semiconductor device comprises a first pair of signal lines and a first control circuit. The first control circuit precharges each of the first pair of signal lines to a first voltage in response to a precharge signal, and changes the voltage level of each of the first pair of signal lines to a second voltage different from the first voltage when a deep power down signal is input.

Abstract: A device includes first and second regions including first and second amplifiers, respectively and a memory cell array region formed between the first and second regions and includes first and second conductive layers each extending in a first direction, and a plurality of first pillar elements arranged in line in the first direction on the first conductive layer, each of the first pillar elements being coupled to the first conductive layer at one end thereof, and the first pillar elements comprising a plurality of first elements and a second element, and a plurality of second pillar elements arranged in line in the first direction on the second conductive layer, each of the second pillar elements being coupled to the second conductive layer at one end thereof, and the second pillar elements comprising a plurality of third elements and a fourth element.

Abstract: A method for carrying out read and write operations in a synchronous memory device having a shared I/O, includes receiving a read command directed to a first internal memory bank during a first timeslot, activating the first internal memory bank to access read data at a read address requested by the read command, receiving a write command directed to a second internal memory bank during a second timeslot later than the first timeslot, determining whether a data collision between the read data for output to the shared I/O with normal read latency and write data to be received on the shared I/O with normal write latency would occur, and receiving the write data on the shared I/O with the normal write latency during a third timeslot later than the second timeslot.

Abstract: A device includes a decoder, a selector, and a plurality of registers. The decoder is configured to generate a plurality of test signals. The selector is coupled to the decoder. The selector is configured to sequentially select a test signal from the plurality of test signals and to sequentially output the test signal selected. The plurality of registers is coupled in series to each other. The plurality of registers includes a first stage register. The first stage register is coupled to the selector to sequentially receive the test signal from the selector.

Abstract: Disclosed herein is a device that includes: a memory cell array including a plurality of memory cells, the memory cell array operates on a first internal voltage; a peripheral circuit accessing selected one or ones of the memory cells, the peripheral circuit operates on a second internal voltage; a first internal voltage generation circuit that supplies the first internal voltage to the memory cell array; and a second internal voltage generation circuit that supplies the second internal voltage to the peripheral circuit. The second internal voltage generation circuit sets the second internal voltage to a first voltage value in a first mode, and to a second voltage value that is different from the first voltage value in a second mode. The first internal voltage generation circuit sets the first internal voltage to a third voltage value in both the first and second modes.

Abstract: A semiconductor device comprises a memory cell, a bit line, a sense amplifier operating between a first voltage and a second voltage higher than the first voltage, a transfer control circuit including a transfer transistor, and a write circuit writing data into the memory cell through the bit line based on the first voltage and a third voltage. The sense amplifier receives and amplifiers the signal voltage at a sense node when the transfer transistor controls the connection between the bit line and the sense node in response to a transfer control voltage. The third voltage is set to a voltage lower than the second voltage and higher than the transfer control voltage, and the sense node is set to a voltage higher than the transfer control voltage in an initial period of a read operation before the data of the memory cell is read out to the bit line.