Patents Assigned to PsiloQuest
  • Polishing pad and method for in situ delivery of chemical mechanical polishing slurry modifiers and applications thereof
    Patent number: 6575823
    Abstract: The present invention is directed, in general, to polishing pads for chemical mechanical polishing of semiconductor wafers and integrated circuits. More specifically, the invention is directed to polishing pads containing a precursor slurry modifier. In the presence of a polishing slurry during chemical mechanical polishing, the precursor is released to the polishing slurry to form a slurry modifier thereby improving polishing.
    Type: Grant
    Filed: March 4, 2002
    Date of Patent: June 10, 2003
    Assignee: PsiloQuest Inc.
    Inventors: Yaw S. Obeng, Edward M. Yokley
  • Thermal management with filled polymeric polishing pads and applications therefor
    Publication number: 20030031876
    Abstract: The present invention is directed, in general, to a method of planarizing a surface on a semiconductor wafer and, more specifically, to a method of altering the properties of polishing pads to improve thermal management during chemical-mechanical planarization, the resulting heat conductive pad and a polishing apparatus that includes the pad. The pad includes a polishing body composed of a thermoconductive polymer comprising an substrate and filler particle containing a Group II salt and within the substrate.
    Type: Application
    Filed: March 4, 2002
    Publication date: February 13, 2003
    Applicant: PsiloQuest, Inc.
    Inventors: Yaw S. Obeng, Edward M. Yokley