Abstract: A monolithic inductor (10) comprises an elongated substrate having opposite distal ends (14) and (16), each end having an end cap extending from the opposite ends to support the substrate (12) in spaced relation from a PC board, the end caps being formed with non-mounting areas and a deflection area for preventing the substrate resting on the non-mounting area, a substantially steep side wall (16) on the substrate side of the end cap (14) at the non-mounting area, and an inclined ramp extending up to a top of the end cap on the substrate side substantially opposite the non-mounting area, an electrically conductive soldering band (30) extending partially around each end cap, each soldering band having a gap (34) at the non-mounting area for thereby reducing parasitic conduction in the band (30), and an electrically conductive layer formed on the substrate in a helical path extending between the opposite ends and in electrical contact with the conductive soldering bands (30) at the ramps (120).

Abstract: A monolithic inductor comprises an elongated substrate having opposite distal ends and, each end having an end cap extending radially from the respective end to support the substrate in spaced relation from a PC board, each end cap having a plurality of intersecting planar surfaces defining corners, an electrically conductive layer forming a winding on the substrate and extending between the opposite ends to provide a winding, and an electrically conductive soldering pad extending partially around at least some of the corners of said end caps at each end of the substrate in electrical contact with the conductive layer, each soldering pad providing a terminal on each of the intersecting planar surfaces.

Abstract: A connector module for mounting on a circuit board includes a housing and at least one plug-receiving opening for receiving an RJ-45 or other similar jack. Each plug-receiving opening includes contact portions that make electrical contact with individual conductors, e.g., twisted pair conductors, connected to the RJ-45 jack. A plurality of connection pins protrude from a bottom surface of the housing and facilitate mounting of the modular connector onto the circuit board. Protection/filtering circuitry, located within vertical space inside of the housing so as to reside adjacent the connection pins, electrically couples and minimizes the electrical distance between the contact portions associated with each plug-receiving opening and the plurality of connection pins. The protection/filtering circuitry includes at least one ring-shaped ferrite core.

Abstract: A trimmable inductor, comprises a supporting substrate (12) having spaced apart lead terminals, a coil (20) defined by an electrically conductive member mounted on the substrate in a continuous path of multiple turns forming a winding about an axis and extending between the lead terminals, and an electric conductive shorting member (30) extending and electrically connected between one or more turns (20) and (22) a terminal of the coil to enable selective inclusion and elimination of at least part of one of the turns of the coil.

Abstract: A device for electrically interconnecting the wire leads of various electronic elements within a microminiature package. A non-conducting base member having a plurality of electronic element barriers and wire lead through-holes is provided. The through-holes are generally located within the interior regions of the base element to minimize potentially detrimental field interactions or capacitive coupling between the leads and the external package terminals. During package assembly, the electronic elements are placed within recesses created within the base member by the aforementioned barriers. These recesses and barriers align the elements and help maintain electrical separation and uniformity during manufacturing. The wire leads from two or more elements are interconnected by twisting them together and inserting them into one of the through-holes.

Abstract: A microelectronic component carrier package and method of its manufacture. A non-conducting component carrier having vertical risers and guide channels permits the rapid and accurate routing of microelectronic component leads with respect to the leadframe. Specially shaped perforations in the leadframe adjacent to and aligned with the guide channels receive the leads, strip away the necessary amount of insulation, and sever the leads to the proper length in one manufacturing process step. The leads are joined to the leadframe by an interference fit, conventional bonding technique (such as solder or thermal compression bonding), or other techniques. The perforations further provide for stress relief of the leads in the assembled package, and permit the joints between the leadframe and leads to reside outside of the package, thereby minimizing the overall volume of the package.

Abstract: The present invention is a modular jack assembly which includes an outer insulative housing having top and bottom walls and opposed lateral walls while defining an interior section. This housing also has front and rear open ends. This assembly also includes an insulative insert having a top section, an upper side and a rear section having a base side and a recess. This jack is positioned so that the upper side of its top section is adjacent to top side of the insulative housing such that its terminal end extends into the interior section of the insulative housing and the rear section at least partially covers the rear open end of the insulative housing. This assembly also includes an electronic component mounted in the recess in the rear section of the insulative insert. A conductor is mounted in the electrical insert.

Abstract: A printed circuit assembly comprises a module with a component secured to a pad on a dielectric substrate using a tin-free metal composition. A terminal of the module is coupled to a second printed circuit board with a solder composition of at least approximately 40% tin. The tin-free solder composition may comprise approximately 90% lead and 10% antimony.

Abstract: A blind hole pot core transformer comprised of a base member having a toroidal channel with a central post and a cover member also having a toroidal channel with a central post. A bobbin winding is positioned within a cavity defined by the toroidal channels of the base and cover members with a core comprised of the central posts of the base and cover member positioned within an opening in the bobbin winding. A compressible alignment member is positioned within an opening formed on outer mating surfaces of the central posts of both the base and cover members to retain the base and cover members in a desired orientation with respect to each other. The compressible alignment member has a cross-sectional area that is greater than the openings in the base and cover members so that any gap between the alignment member and the inner walls of at least one of the openings is eliminated thereby facilitating alignment between the central posts comprising the core of the device.

Abstract: An electronic component mounting holder for surface mounting of an electronic component having a plurality of tape leads, includes a non-conducting three dimensional rectangular frame having vertical peripheral walls formed of nonconducting material for receiving an electronic component having a plurality of tape leads, the peripheral walls having a top peripheral edge and a bottom peripheral edge, a support ledge extending inward from inner surface of said peripheral wall for supporting an electrical component, a coil formed of foil windings having leads formed by extensions of said foil windings, a plurality of tape lead receiving areas formed in at least two sides of said bottom peripheral edge, said receiving areas each positioning a tape lead for surface bonding to a conductor on a PC board, a plurality of lead receiving recesses formed in corresponding sides of said top peripheral edge for receiving an outermost end of a tape lead, and a retainer for mounting in engagement with latch means in said frame

Abstract: A panel of a plurality of circuits to be separated into individual circuits, comprises a panel of conductive foil and insulator laminate formed into a plurality of separate circuits, a shear trace disposed between adjacent circuits, and a pull tab at one end of each of said the shear traces. In the depanelizing operation, the shear traces are pulled for cutting through the insulator to remove the corresponding circuits from the panel.

Abstract: A low profile transformer comprises a support member for supporting a coil winding, a first elongated conductive tape forming at least one conductor having lead terminals formed integral therewith formed into a first coil of multiple turns, a second elongated conductive tape having lead terminals formed integral therewith forming at least one conductor formed into a second coil of at least one turn interleaved with the first coil, and each terminal lead of each of the tapes extending from the support member and having a portion disposed at a base of the transformer for engagement and surface bonding to a PC board.

Abstract: An electronic device comprises a three dimensional electronic element holder of a non-conducting material having at least one cavity in a first surface and a plurality of lead through holes with inlet guides extending from the cavity to a second surface having a circuit thereon, an electronic element mounted in the cavity and having a plurality of leads, a plurality of the leads extending via the through holes from the element to the second surface, and a plurality of lead terminal recesses formed at the second surface for for receiving and forming terminal ends and connections of the leads to the circuit on the second surface.

Abstract: An electronic component adapted for surface mounting on a PC board has an elongate bobbin made of a dielectric material. A coil of wire is wound about the winding support surface of the bobbin. The coil has a pair of lead terminations which are wrapped around a pair of T-shaped lead termination support members extending from the same side of the bobbin. When the bobbin rests on top of a PC board, the support members position the wrapped lead terminations slightly above solder pads.

Abstract: A self leaded holder for surface mounting of a circuit element to a PC board comprises a generally box-like support body having a cavity for mounting a circuit element, the support body having a base and a plurality of lead support members having a generally spool configuration extending generally horizontally outward from the support body adjacent the base, lead ports extending from the cavity through the sides, an inductance coil mounted in the cavity, and a lead extending from the coil via the lead ports to and wound a partial turn around each of the lead support members and disposed for surface bonding to a PC board.

Abstract: A bobbin for surface mounting on a printed circuit board comprises an elongated support body constructed of a non-conducting material having a plurality of curved winding support areas bound on each side by a generally rectangular mounting member having recesses in opposed surfaces thereof, and a combined mounting and lead terminal member having opposed gripping fingers engaging the recesses, one of the fingers having a free end extending outward therefrom for conductively connecting with a lead.

Abstract: A compliant lead structure for mounting a circuit element to a PC board comprises a support body for supporting a circuit element, a plurality of elongated compliant cylindrical conductive lead members secured at an inner end to the support body and extending outward from the support body substantially perpendicular to a mounting plane of a PC board to which the support body is to be mounted and to a position for surface bonding to a PC board, the lead members having an elongated unrestricted section between the inner end and the outer end for enabling relative movement between the support body and a PC board to which the lead member is bonded, and a lead wire extends from a circuit element on the support body and connected to the lead member.

Abstract: A self leaded header for surface mounting of a circuit element to a PC board comprises a generally box-like support body having a cavity for mounting a circuit element, the support body having a base and a plurality of feet extending downward from the base for supporting the same on a PC board, a plurality of lead support members having a generally spool configuration extending generally horizontally outward from the support body adjacent the base, an inductance coil mounted in the cavity, and a lead extending from the coil to and wound multiple turns around each of the lead support members and disposed for surface bonding to a PC board.

Abstract: A single in-line package adapted for surface mounting to a printed circuit board comprises an electronic component, a plurality of leads and a specially configured housing that encloses and protects the electronic component. The outer ends of the leads extend adjacent a tapered lower edge of the housing. The housing further has projections for engaging the upper surface of a printed circuit board to maintain the housing in a stable upright orientation with the outer ends of the leads in physical contact with corresponding solder pads on the printed circuit board during solder re-flow. The tapered edge of the housing is configured to permit subsequent inspection of a plurality of resulting solder joints for acceptable whetting.

Abstract: An electronic device having a plurality of leads comprises a three dimensional electronic element holder of a non-conducting material having at least one cavity therein and a plurality of lead slots extending from the cavity to a base of the holder, an electronic element mounted in the cavity and having a plurality of leads extending therefrom, a plurality of the leads extending within the slots from the element to the base, and a plurality of lead terminals mounted on the holder and each having one end extending into one of the slots into conducting engagement with a lead and a free end extending outward therefrom.