Abstract: An advanced modular plug connector assembly incorporating an insert assembly disposed in the rear portion of the connector housing. In one embodiment, the connector has a plurality of ports in multi-row configuration, and the insert assembly includes a substrate adapted to receive one or more electronic components such as choke coils, transformers, or other signal conditioning elements or magnetics. The substrate also interfaces with the conductors of two modular ports of the connector, and is removable from the housing such that an insert assembly of a different electronics or terminal configuration can be substituted therefor. In this fashion, the connector can be configured to a plurality of different standards (e.g., Gigabit Ethernet and 10/100). In yet another embodiment, the connector assembly comprises a plurality of light sources (e.g., LEDs) received within the housing. Methods for manufacturing the aforementioned embodiments are also disclosed.

Abstract: An advanced electronic signal conditioning circuit and associated housing elements. In one embodiment, the circuit comprises a plurality of coupled inductors and capacitors arranged in a signal filtering configuration which achieves enhanced voice- and DSL-band performance through the use of complex-impedance modeling during the circuit design phase. Free-standing and fixed device housings are also disclosed. Methods for manufacturing the aforementioned components are also described.

Abstract: Improved inductive apparatus having controlled core saturation which provides a desired inductance characteristic with low cost of manufacturing. In one embodiment, a pot core having a variable geometry gap is provided. The variable geometry gap allows for a “stepped” inductance profile with high inductance at low dc currents, and a lower inductance at higher dc currents, corresponding for example to the on-hook and off-hook states of a Caller ID function in a typical telecommunications line. In other embodiments, single- and multi-spool drum core devices are disclosed which use a controlled saturation element to allow for selectively controlled saturation of the core. Exemplary signal conditioning circuits (e.g., dynamically controlled low-capacitance DSL filters) using the aforementioned inductive devices are disclosed, as well as cost-efficient methods of manufacturing the inductive devices. An improved gapped toroid and an associated method of manufacturing is also disclosed.

Abstract: A dual-core inductive device having one or more core elements and a sleeve adapted to fit over the core element(s). The device is significantly less expensive to produce than prior art transformers having similar characteristics. In one exemplary embodiment, the device includes two cylindrical cores forming a first (end) gap used to adjust the device's differential inductance independent of its common mode inductance. Similarly, a second gap is provided to adjust the device's common mode (leakage) inductance independent of its differential inductance. The substantially independent control afforded by these gaps allows for devices to be designed to simultaneously meet different sets of requirements; e.g., signal-path specifications and longitudinal inductance requirements. Methods for manufacturing the device(s), and telecommunications filter and splitter circuit applications, are also disclosed.

Abstract: Improved inductive apparatus having controlled core saturation which provides a desired inductance characteristic with low cost of manufacturing. In one embodiment, a pot core having a variable geometry gap is provided. The variable geometry gap allows for a “stepped” inductance profile with high inductance at low dc currents, and a lower inductance at higher dc currents, corresponding for example to the on-hook and off-hook states of a Caller ID function in a typical telecommunications line. In other embodiments, single- and multi-spool drum core devices are disclosed which use a controlled saturation element to allow for selectively controlled saturation of the core. Exemplary signal conditioning circuits (e.g., dynamically controlled low-capacitance DSL filters) using the aforementioned inductive devices are disclosed, as well as cost-efficient methods of manufacturing the inductive devices.

Abstract: An improved system and associated components for providing reliable power supply and interconnectivity for digital subscriber line (DSL) applications at sites remote from the central office (CO). The system comprises a line power unit in communication with a subscriber-installable gateway module, the latter incorporating a power extraction circuit adapted to extract power from the Telco line. Home phone network (HPN), homeplug, and wireless modules are also provided within the gateway to permit connectivity between other electronic components within the subscriber's site. Subscriber-installable adapter modules which extract power and perform line interface functions for the various jacks throughout the site are also disclosed. Methods for installing and operating the aforementioned components are also described.

Abstract: An advanced modular plug connector assembly incorporating a substrate disposed in the rear portion of the connector housing, the substrate adapted to receive one or more electronic components such as choke coils, transformers, or other signal conditioning elements or magnetics. In one embodiment, the connector assembly comprises a single port pair with a single substrate disposed in the rear portion of the housing. In another embodiment, the assembly comprises a multi-port “row-and-column” housing with multiple substrates (one per port) received within the rear of the housing, each substrate having signal conditioning electronics which condition the input signal received from the corresponding modular plug before egress from the connector assembly. In yet another embodiment, the connector assembly comprises an indicator assembly having a plurality of optically transmissive conduits, the assembly being disposed largely outside the external noise shield of the connector and removable therefrom.

Abstract: A device for electrically interconnecting and packaging electronic components. A non-conducting base member having a component recess and a set of specially shaped lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the conductors of the component are routed through the lead channels. A set of insertable lead terminals, adapted to cooperate with the specially shaped lead channels, are received and captured within the lead channels, thereby forming an electrical connection between the lead terminals and the conductors of the electronic component(s). A method of fabricating the device is also disclosed.

Abstract: An advanced multi-connector electronic assembly incorporating a variety of different noise shield elements which reduce noise interference and increase performance. In one embodiment, the connector assembly comprises a plurality of connectors with associated electronic components arranged in two parallel rows, one disposed atop the other such that modular plug recesses of all connectors are accessible by the user. The assembly utilizes a substrate shield which mitigates noise transmission through the bottom surface of the assembly, as well as an external “wrap-around shield to mitigate noise transmission through the remaining external surfaces.

Abstract: A method of making a microelectronic package. The advanced microelectronic component package incorporates a specially shaped base element which holds and electrically separates the individual conductors associated with the microelectronic component(s) so that the individual conductors may be bonded to external package leads and other conductors within the package. In a first embodiment, jacketed, insulated wire is used as one winding of a toroidal transformer, while unjacketed insulated wire is used as another winding. The jacketing is stripped from the first winding and the exposed conductors are routed into channels along the sides of the base element. The unjacketed conductors are also routed into the same channels, where both conductors are bonded to the external package leads. Raised elements along the sides of the base provide the required electrical separation between the conductors during both manufacture and operation. A method of manufacturing the improved microelectronic package is also disclosed.

Abstract: An advanced shielded modular plug connector assembly incorporating a removable insert assembly disposed in the connector housing, the insert assembly adapted to optionally receive one or more electronic components. In one exemplary embodiment, the connector assembly comprises a single port connector with integral shielded housing and dual-substrate insert assembly. The housing is advantageously formed using a metal casting process which inherently shields the connector (and exterior environment) from EMI and other noise while allowing for a reduced housing profile. In another embodiment, a plurality of light sources are disposed within (and shielded by) the metallic housing. In yet another embodiment, the connector assembly comprises a multi-port “1×N” device. In yet another embodiment, a bail mechanism is provided to permit easy insertion/removal of the connector assembly from an external structure such as a rack or enclosure. Methods for manufacturing the aforementioned embodiments are also disclosed.

Abstract: An improved connector assembly for use on, inter alia, a printed circuit board or other device is disclosed. The assembly comprises a connector housing having one or more modular plug recesses for receiving a modular plug such as an RJ-type plug; a plurality of conductors disposed within the recess for contact with the terminals of the modular plug; and an electrical pathway between the conductors and a corresponding set of circuit board leads. The connector assembly also includes at least one other recess for receiving a light source sub-assembly. Each light source sub-assembly provides one or more light sources (e.g., light-emitting diodes) adapted to permit viewing of status indications during operation. Each light source sub-assembly is constructed to substantially reduce electromagnetic coupling between the light source and the connector's signal paths. The light source sub-assembly further simplifies the manufacturing of the connector assembly.

Abstract: An advanced modular plug connector assembly incorporating a substrate disposed in the rear portion of the connector housing, the substrate adapted to receive one or more electronic components such as choke coils, transformers, or other signal conditioning elements or magnetics. In one embodiment, the connector assembly comprises a single port pair with a single substrate disposed in the rear portion of the housing. In another embodiment, the assembly comprises a multi-port “row-and-column” housing with multiple substrates (one per port) received within the rear of the housing, each substrate having signal conditioning electronics which condition the input signal received from the corresponding modular plug before egress from the connector assembly. In yet another embodiment, the connector assembly comprises a plurality of light sources (e.g., LEDs) received within the housing. Methods for manufacturing the aforementioned embodiments are also disclosed.

Abstract: An advanced modular plug connector assembly incorporating a substantially planar, low profile removable insert assembly with associated substrate disposed in the rear portion of the connector housing, the substrate adapted to optionally receive one or more electronic components. In one embodiment, the connector assembly comprises a single port with a single insert assembly. The conductors and terminals of the connector are retained within respective molded carriers which are received within the insert assembly. A plurality of light sources (e.g., LEDs) are also received within the housing, the conductors of the LEDs mated with conductive traces on the substrate of the insert assembly. In another embodiment, the connector assembly comprises a multi-port “1×N” device. Methods for manufacturing the aforementioned embodiments are also disclosed.

Abstract: A device for electrically interconnecting and packaging electronic components and method for manufacturing the device. A non-conducting base member having a component recess and a plurality of specially shaped lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the wire leads of the component are routed through the lead channels. A plurality of lead terminals, adapted to cooperate with the specially shaped lead channels, are received within the lead channels, thereby forming an electrical connection between the lead terminals and the wire leads of the electronic component(s). The special shaping of the lead channels and lead terminals restricts the movement of the lead terminals within the lead channels in multiple directions during package fabrication, thereby allowing for the manufacture of larger, more reliable devices.

Abstract: An advanced microelectronic coil device incorporating a toroidal core and a plurality of sets of windings, wherein the windings are separated by one or more layers of insulating material. In one embodiment, the insulating material is vacuum-deposited over the top of a first set of windings before the next set of windings is wound onto the core. In this fashion, the insulating material insulates the entire first winding from the second without the need for individual insulation on each of the windings, or the use of margin tape. The use of the vacuum-deposited insulating layer(s) provides a high degree of dielectric strength, yet consumes a minimum space since the insulation on each winding is minimized. The toroidal core is also optionally provided with a controlled thickness gap for controlling saturation of the core.

Abstract: An impedance blocking filter circuit is provided for use in telecommunication systems for interconnecting between incoming telephone lines and customer's terminal equipment so as to unconditionally block impedances above 20 KHz due to the customer's terminal equipment from an ADSL network unit and/or home networking interface unit. The filter circuit includes first, second, and third inductors connected in series between a first input terminal and a first common point. A first resistor has its one end connected also to the first common point and its other end connected to a first output terminal. Fourth, fifth and sixth inductors are connected in series between a second input terminal and a second common point. A second resistor has its one end also connected to the second common point and its other end connected to a second output terminal. A capacitor has its ends connected across the first and second common points.

Abstract: An impedance blocking filter circuit is provided for use in telecommunication systems for interconnecting between incoming telephone lines and customer's terminal equipment so as to unconditionally block impedances above 20 KHz due to the customer's terminal equipment from an ADSL network unit and/or home networking interface unit. The filter circuit includes first, second, and third inductors connected in series between a first input terminal and a first common point. A first resistor has its one end connected also to the first common point and its other end connected to a first output terminal. Fourth, fifth and sixth inductors are connected in series between a second input terminal and a second common point. A second resistor has its one end also connected to the second common point and its other end connected to a second output terminal. A capacitor has its ends connected across the first and second common points.