Patents Assigned to Pulse
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Patent number: 6309340Abstract: The purpose of the present invention is to propose a magnet type medical instrument which can prevent the magnetic flux density from reducing remarkably even at a point distant from a magnetic pole of a core and realize a satisfactory pain-killing effect in a human body even at a point distant from the magnetic pole. The electromagnet for the magnet type medical instrument comprises a first core 1 with first inner space and a first coil 3 which is wound round the first core 1 and which can generate a first magnetic field by applying an alternating current, a commutated current or a pulsating current to the first coil 3.Type: GrantFiled: February 10, 1999Date of Patent: October 30, 2001Assignee: Pulse Medical Co., Ltd.Inventor: Kyoichi Nakagawa
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Publication number: 20010016690Abstract: A method is disclosed for diagnosing, monitoring and treating cardiovascular pathologies. Among the hemodynamic parameters of interest are peripheral resistance, compliance, and cardiac (left ventricular) output. Peripheral resistance determined according to the present invention has been found to be a reliable indicator, not only of hypertension, but also of the cause of the hypertension. The determined peripheral resistance can be compared against a predetermined threshold value. This comparison helps to foster a diagnosis of a hypertensive condition.Type: ApplicationFiled: December 15, 2000Publication date: August 23, 2001Applicant: Pulse Metric, Inc.Inventor: Shiu-Shin Chio
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Patent number: 6270461Abstract: A method is disclosed for diagnosing, monitoring and treating cardiovascular pathologies. Among the hemodynamic parameters of interest are peripheral resistance, compliance, and cardiac (left ventricular) output. Peripheral resistance determined according to the present invention has been found to be a reliable indicator, not only of hypertension, but also of the cause of the hypertension. The determined peripheral resistance can be compared against a predetermined threshold value. This comparison helps to foster a diagnosis of a hypertensive condition.Type: GrantFiled: November 13, 1998Date of Patent: August 7, 2001Assignee: Pulse Metric, Inc.Inventor: Shiu-Shin Chio
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Patent number: 6265952Abstract: A surface mount adapter for a surface mount device is provided that includes a printed circuit board with a top side and a bottom side. The top side includes a footprint for receiving an electrical component and a plurality of input/output lines connected between the footprint and a plurality of first through hole pins. The adapter also includes a ground plane and a power plane and is suitable for use with RF and ECL devices.Type: GrantFiled: August 5, 1999Date of Patent: July 24, 2001Assignee: Pulse Research LabsInventor: David T. Kan
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Publication number: 20010008044Abstract: An advanced microelectronic component package incorporating a specially shaped base element which holds and electrically separates the individual conductors associated with the microelectronic component(s) so that the individual conductors may be bonded to external package leads and other conductors within the package. In a first embodiment, jacketed, insulated wire is used as one winding of a toroidal transformer, while unjacketed insulated wire is used as another winding. The jacketing is stripped from the first winding and the exposed conductors are routed into channels along the sides of the base element. The unjacketed conductors are also routed into the same channels, where both conductors are bonded to the external package leads. Raised elements along the sides of the base provide the required electrical separation between the conductors during both manufacture and operation. A method of manufacturing the improved microelectronic package is also disclosed.Type: ApplicationFiled: February 27, 2001Publication date: July 19, 2001Applicant: Pulse Engineering, Inc.Inventor: Russell Lee Machado
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Patent number: 6252198Abstract: A heating element (2) for an electrically heated panel (22) is provided having a heating conductor (4), a first temperature sensing conductor (6) and a second temperature sensing conductor (8). The first temperature sensing conductor (6) and the second temperature sensing conductor (8) are separated via a layer of material whose impedance varies with temperature. The second temperature sensing connector (8) is straight tinsel conductor whilst the first temperature sensing conductor (6) and the heating conductor (4) are helical wound in opposite senses about the axis of the heating element (2).Type: GrantFiled: July 26, 2000Date of Patent: June 26, 2001Assignee: Pulse Home Products LimitedInventor: Raymond Malkin
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Patent number: 6223419Abstract: A monolithic inductor (10) comprises an elongated substrate having opposite distal ends (14) and (16), each end having an end cap extending from the opposite ends to support the substrate (12) in spaced relation from a PC board, the end caps being formed with non-mounting areas and a deflection area for preventing the substrate resting on the non-mounting area, a substantially steep side wall (16) on the substrate side of the end cap (14) at the non-mounting area, and an inclined ramp extending up to a top of the end cap on the substrate side substantially opposite the non-mounting area, an electrically conductive soldering band (30) extending partially around each end cap, each soldering band having a gap (34) at the non-mounting area for thereby reducing parasitic conduction in the band (30), and an electrically conductive layer formed on the substrate in a helical path extending between the opposite ends and in electrical contact with the conductive soldering bands (30) at the ramps (120).Type: GrantFiled: February 2, 1999Date of Patent: May 1, 2001Assignee: Pulse Engineering, Inc.Inventor: Igor Abramov
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Patent number: 6224425Abstract: A modular microelectronic connector having an electrical component or component package molded directly within the connector body and preformed electrical leads which facilitate rapid and simplified connector assembly. In a first embodiment, the component package is molded directly within a one-piece connector body having a series of grooves on the exterior of the body, and the elongated leads of the package are deformed so as to extend into place within the grooves and ultimately within a modular plug receptacle so as to mate with the contacts of the plug. In a second embodiment, a component package having substantially elongated leads is molded within a rear body element or trailer which is then mated with a front body element (sleeve) having a modular plug receptacle. The leads are inserted through a series of apertures in the sleeve and deformed so as to extend into the cavity of the receptacle to form the electrical contacts for the plug.Type: GrantFiled: April 20, 1999Date of Patent: May 1, 2001Assignee: Pulse Engineering, Inc.Inventor: Ronald A. Shutter
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Patent number: 6225560Abstract: An advanced microelectronic component package incorporating a specially shaped base element which holds and electrically separates the individual conductors associated with the microelectronic component(s) so that the individual conductors may be bonded to external package leads and other conductors within the package. In a first embodiment, jacketed, insulated wire is used as one winding of a toroidal transformer, while unjacketed insulated wire is used as another winding. The jacketing is stripped from the first winding and the exposed conductors are routed into channels along the sides of the base element. The unjacketed conductors are also routed into the same channels, where both conductors are bonded to the external package leads. Raised elements along the sides of the base provide the required electrical separation between the conductors during both manufacture and operation. A method of manufacturing the improved microelectronic package is also disclosed.Type: GrantFiled: September 30, 1998Date of Patent: May 1, 2001Assignee: Pulse Engineering, Inc.Inventor: Russell Lee Machado
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Patent number: 6216618Abstract: An embroidery system having an embroidery machine for automatically stitching embroidery stitch patterns on a garment and a machine controller for selectably controlling the operation of the embroidery machine in response to user provided selections, the improvement involves the use of a Windows CE based graphical user interface, such as a PDA, which is located between the user and the machine controller to provide user selections through the graphical user interface for directing the machine controller. The embroidery system has an associated embroidery functionality and the graphical user interface has a defined system architecture which may selectably enhance the embroidery system functionality by selectably adding software modules to the graphical user interface, such as to control the creation of embroidery lettering, to provide maintenance monitoring either locally or over the Internet, or to enable communication with the embroidery machine over a network.Type: GrantFiled: April 7, 2000Date of Patent: April 17, 2001Assignee: Pulse Microsystems Ltd.Inventors: Brian Goldberg, Anastasios Tsonis, Ben Chia, Jr.
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Patent number: 6196146Abstract: A web based embroidery system capable of creating an automatically fulfilling a user customized embroidery order for a selectable garment over the internet. The system includes the ability to select the garment to be customized over the internet, to selectably locate an embroidery area on that garment, to select a customized embroidery pattern over the internet to be located in the user selected embroidery area, the ability to display an embroided simulation of the user located customized embroidery pattern on the selected garment, and the ability to provide embroidery pattern controlled signals over the internet to a remotely located embroidery machine for automatically stitching the user located customized embroidery pattern on an actual garment corresponding to the selected garment based on the displayed embroided simulation, which maybe a three dimensional simulation. In addition, customized embroidery lettering can be created and may be combined with a preexisting embroidery pattern.Type: GrantFiled: March 23, 2000Date of Patent: March 6, 2001Assignee: Pulse Microsystems Ltd.Inventors: Brian Goldberg, Niranjan Mayya, Anastasios Tsonis, Claude Vlandis
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Patent number: 6193560Abstract: A connector assembly (1) has a lower row of side-by-side terminal arrays (28) having a common dielectric carrier (30), and an upper row of side-by side terminal arrays (34) having a common dielectric carrier (3), each of the carriers (30) has guide sections (40) at opposite lateral ends, the carriers (30) are installed one behind the other, with the guide sections (40) being guided along common guides (19) of the housing (4), and the housing (4) has a resilient latch arm (20) that extends between the side-by-side terminal arrays (28 and 34), and holds the carriers (30) one behind the other.Type: GrantFiled: March 3, 2000Date of Patent: February 27, 2001Assignees: Tyco Electronics Corporation, Pulse Engineering, Inc.Inventors: Frank P. Morana, Aurelio Jaime Gutierrez
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Patent number: 6176741Abstract: A simplified modular microelectronic connector having an internal component cavity and integral crimped leads, and a method of manufacturing same. One or more electrical components are located within the cavity, with their conductors being routed to the crimp leads integral to the connector body. The conductor terminations are completed via crimping or other bonding techniques. The crimped leads are deformed into the desired position to minimize connector size, and the component is sealed within the cavity using an epoxy or other electrically non-conductive material. The connector body may be further mounted to a multi-connector carrier assembly, which utilizes one or more pins to secure the individual connectors to the carrier so that they may be arranged in both vertically-stacked and horizontal (“side-by-side”) configurations, and each connector may be removed separately and replaced in the event of component failure.Type: GrantFiled: April 20, 1999Date of Patent: January 23, 2001Assignee: Pulse Engineering, Inc.Inventor: Ronald A. Shutter
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Patent number: 6165130Abstract: A method is disclosed for diagnosing, monitoring and treating cardiovascular pathologies. Among the hemodynamic parameters of interest are peripheral resistance, compliance, and cardiac (left ventricular) output. Peripheral resistance determined according to the present invention has been found to be a reliable indicator, not only of hypertension, but also of the cause of the hypertension. The determined peripheral resistance can be compared against a predetermined threshold value. This comparison helps to foster a diagnosis of a hypertensive condition.Type: GrantFiled: November 13, 1998Date of Patent: December 26, 2000Assignee: Pulse Metric, Inc.Inventor: Shiu-Shin Chio
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Patent number: 6159050Abstract: The present invention is a modular jack assembly which includes an outer insulative housing having top and bottom walls and opposed lateral walls while defining an interior section. This housing also has front and rear open ends. This assembly also includes an insulative insert having a top section, an upper side and rear section having a base side and a recess. This jack is positioned so that the upper side of its top section is adjacent to top side of the insulative housing such that its terminal end extends into the interior section of the insulative housing and the rear section at least partially covers the rear open end of the insulative housing. This assembly also includes an electronic component mounted in the rear section of the insulative insert. A conductor is mounted in the electrical insert.Type: GrantFiled: July 8, 1999Date of Patent: December 12, 2000Assignees: Berg Technologies, Inc., Pulse Engineering, Inc.Inventors: Yakov Belopolsky, Robert E. Marshall, James A. Somerville, Gary J. Oleynick, Lee W. Potteiger, John M. Spickler, Ronald A. Shutter, Miguel A. Contreras
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Patent number: 6126802Abstract: In a method for regulating and optimizing transport of liquid in a porous structure by means of electroosmosis, a pulse pattern applied to one or more electrode pairs which are used during the electroosmosis is regulated by detecting a potential difference .increment.V.sub.p over the electrode pair or electrode pairs during the duration t.sub.3 of a neutral pulse which forms part of the pulse pattern and subsequently regulating either the duration t.sub.3 of the neutral pulse or the duration T.sub.p of the pulse pattern or both on the basis of the detected potential difference .increment.V.sub.p and any change therein from measuring cycle to measuring cycle.Type: GrantFiled: September 9, 1998Date of Patent: October 3, 2000Assignee: Electro Pulse Technologies of America, Inc.Inventor: Kjell A. Utklev
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Patent number: 6116963Abstract: A multi-piece, low profile microelectronic connector having a simplified, "snap-together" construction requiring no lead carrier. One or more electrical components are located within a rear connector body element, which mates with a front connector body element upon assembly. The leads of the rear body element are shaped so as to cooperate with a series of contour elements ("bumps" in one embodiment) formed inside the plug receptacle cavity in the front connector body element. The shape of the leads and bumps provide a continuous normal force on the distal end of the leads, thereby maintaining them in contact with the corresponding leads of the modular plug. In a second aspect of the invention, a series of mounting pins are provided to permit tandem mounting of multiple connectors to an external device using a minimum number of mounting holes, and maintaining a minimum lateral connector width. A method of manufacturing and assembling the aforementioned connector is also disclosed.Type: GrantFiled: October 9, 1998Date of Patent: September 12, 2000Assignee: Pulse Engineering, Inc.Inventor: Ronald A. Shutter
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Patent number: 6087921Abstract: A monolithic inductor comprises an elongated substrate having opposite distal ends and, each end having an end cap extending radially from the respective end to support the substrate in spaced relation from a PC board, each end cap having a plurality of intersecting planar surfaces defining corners, an electrically conductive layer forming a winding on the substrate and extending between the opposite ends to provide a winding, and an electrically conductive soldering pad extending partially around at least some of the corners of said end caps at each end of the substrate in electrical contact with the conductive layer, each soldering pad providing a terminal on each of the intersecting planar surfaces.Type: GrantFiled: October 6, 1998Date of Patent: July 11, 2000Assignee: Pulse Engineering, Inc.Inventor: Timothy Morrison
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Patent number: D435904Type: GrantFiled: April 30, 1999Date of Patent: January 2, 2001Assignee: Medi-Pulse (Proprietary) LimitedInventor: Stephanus Petrus Naude
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Patent number: D442923Type: GrantFiled: January 17, 2000Date of Patent: May 29, 2001Assignee: PULS Elektronische Stromversorgungen GmbHInventor: Michael Raspotnig