Abstract: Methods of writing display data to MEMS display elements are configured to minimize charge buildup and differential aging. Prior to writing rows of image data, a pre-write operation is performed. The pre-write operation with either actuate or release substantially all pixels in a row prior to writing the image data. In some embodiments, the selection between actuating or releasing is performed in a random or pseudo-random manner.

Abstract: A support structure within an interferometric modulator device may contact various other structures within the device. Increased bond strengths between the support structure and the other structures may be achieved in various ways, such as by providing roughened surfaces and/or adhesive materials at the interfaces between the support structures and the other structures. In an embodiment, increased adhesion is achieved between a support structure and a substrate layer. In another embodiment, increased adhesion is achieved between a support structure and a moveable layer. Increased adhesion may reduce undesirable slippage between the support structures and the other structures to which they are attached within the interferometric modulator.

Abstract: In various embodiments described herein, a display device includes a front illumination apparatus that comprises a first light guide disposed forward of an array of display elements, such as an array of interferometric modulators, to distribute light across the array of display elements. The light guide panel is edge illuminated by a light source positioned behind the array display elements. The light from such a light source is coupled to a second light guide disposed behind the array of display elements and positioned laterally with respect to the light source. The light in the second light guide is coupled into the first light guide using a small optical coupling element such as a turning mirror. In some embodiments the second light guide may comprise the backplate of the display device.

Abstract: A method and apparatus for displaying data on bi-stable and non-bi-stable displays is provided. The apparatus includes a controller chip capable of being connected to a non-bi-stable display through a first interface channel and also capable of being connected to a bi-stable display via the first interface channel and an additional second interface channel. When connected the non-bi-stable display, the second interface channel is not connected. The second interface channel may carry mode information bits to the bi-stable display module to allow the bi-stable display to utilize power-saving features.

Abstract: Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, portions of the rivet structures extend through the movable layer and contact underlying layers. In other embodiments, the material used to form the rigid support structures may also be used to passivate otherwise exposed electrical leads in electrical connection with the MEMS devices, protecting the electrical leads from damage or other interference.

Abstract: A system and method for an optical component that masks non-active portions of a display and provides an electrical path for one or more display circuits. In one embodiment an optical device includes a substrate, a plurality of optical elements on the substrate, each optical element having an optical characteristic which changes in response to a voltage applied to the optical element, and a light-absorbing, electrically-conductive optical mask disposed on the substrate and offset from the plurality of optical elements, the optical mask electrically coupled to one or more of the optical elements to provide electrical paths for applying voltages to the optical elements. In another embodiment, a method of providing an electrical signal to optical elements of a display comprises electrically coupling an electrically-conductive light-absorbing mask to one or more optical elements, and applying a voltage to the mask to activate the one or more optical elements.

Abstract: Disclosed are apparatus and methods for fabricating a static interferometric display device. A plurality of sputtering modules is used to form static interferometric elements on a substrate. These elements each have a plurality of interferometric sub-elements that each has an interferometric stack. A first sub-element of each element is formed so that an interferometric modulation of light due to the first element's stack transmits at a first color, and a second sub-element of each element is formed so that a second color is transmitted. The sub-elements of each element are arranged with respect to each other so that all of the elements appear as a third color to a user if all the sub-elements of each element are left unmasked. A printing system is then used to mask one or more sub-elements of one or more elements so as to form, with the elements, a static image having multiple colors.

Abstract: A transmissive micromechanical device includes a substrate, an optical stack over the substrate and a moveable membrane over the optical stack. The moveable membrane may include a partially reflective mirror and be configured to move from a first position to a second position. When the movable membrane is in the first position the transmissive micromechanical device is configured to pass light of a predetermined color and when the movable membrane is in the second position, the micromechanical device is configured to block substantially all of light incident on the substrate.

Abstract: An ornamental display device having an interferometric modulator for displaying an ornamental image. The ornamental device may also have a signal receiver configured to receive an external signal. The ornamental device may further have a processor configured to control an image on the display based on the external signal. The external signal is emitted from a controller configured to control a plurality of ornamental devices to display coordinated images. The ornamental device may have a patterned diffuser formed on a transparent substrate to provide an ornamental image or information. The ornamental device may be a piece of jewelry or an article that may be worn. The image displayed may have an iridescent appearance. A controller may also be used to control images displayed on multiple ornamental device to provide coordinated images based on externals received or pre-programmed images.

Abstract: A microelectromechanical device (MEMS) utilizing a porous electrode surface for reducing stiction is disclosed. In one embodiment, a microelectromechanical device is an interferometric modulator that includes a transparent electrode having a first surface; and a movable reflective electrode with a second surface facing the first surface. The movable reflective electrode is movable between a relaxed and actuated (collapsed) position. An aluminum layer is provided on either the first or second surface. The aluminum layer is then anodized to provide an aluminum oxide layer which has a porous surface. The porous surface, in the actuated position, decreases contact area between the electrodes, thus reducing stiction.

Abstract: Various embodiments include interferometric optical modulators comprising a substrate layer having a thickness between about 0.1 mm to about 0.45 mm thick and a method for manufacturing the same. The interferometric modulator can be integrated together with a diffuser in a display device. The thin substrate permits use of a thicker diffuser. The thinner substrate may increase resolution and reduce overall thickness of the interferometric modulator. The thicker diffuser may provide increased diffusion and durability.

Abstract: A microelectromechanical (MEMS) device includes a substrate, a movable element over the substrate, and an actuation electrode above the movable element. The movable element includes a deformable layer and a reflective element. The deformable layer is spaced from the reflective element.

Abstract: A method of writing a display image to a display having an array of pixels according to a selected driving sequence. One driving sequence includes addressing each color row in a line of the array in a sequence before addressing a second line. Another driving sequence includes addressing a first color row of each line in the array before addressing a second color row of each line in the array.

Abstract: Some implementations of the invention provide hidden static images. Some such images can only be perceived when viewed from an angle to the normal to a surface. Such images may appear as a solid color when viewed along an axis perpendicular to a surface, but may reveal a hidden image when viewed from an angle relative to that axis. The hidden image may be defined according to interfaces between areas that pass substantially the same wavelength when viewed along the axis, but which pass noticeably different wavelengths when viewed from an angle relative to that axis. The hidden images may or may not be discernable to a human observer. The hidden image may comprise a code that is not readable by an optical scanner positioned to read along an axis normal to a surface, but that is readable by an optical scanner positioned to read along another axis.

Abstract: An environmental condition sensing device includes an interferometric modulator with optical properties, which change in response to being exposed to a predetermined environmental threshold or condition. The device includes an environmental reactive layer, which alters composition, in an optically-detectable manner, in response to being exposed to a predetermined environmental threshold or condition.

Abstract: A method of sealing a microelectromechanical system (MEMS) device from ambient conditions is described. The MEMS device is formed on a substrate and a substantially hermetic seal is formed as part of the MEMS device manufacturing process. The method may include forming a metal seal on the substrate proximate to a perimeter of the MEMS device using a method such as photolithography. The metal seal is formed on the substrate while the MEMS device retains a sacrificial layer between conductive members of MEMS elements, and the sacrificial layer is removed after formation of the seal and prior to attachment of a backplane.

Abstract: Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, both rivets and posts may be used. In certain embodiments, these support structures are formed from rigid inorganic materials, such as metals or oxides. In certain embodiments, etch barriers may also be deposited to facilitate the use of materials in the formation of support structures which are not selectively etchable with respect to other components within the MEMS device.

Abstract: An iterferometric modulator array is integrated with collapsible cavity MEMS electrical switches. The electrical switches may have similar physical geometry as the display elements. The switches may form row or column select functions for the display.

Abstract: Systems and methods for manufacturing and packaging electronic devices with light absorptive thin film stacks are provided. In one embodiment, a light is applied to a light absorptive thin film stack disposed between a substrate and a backplate to seal the substrate to the backplate. In another embodiment, the light absorptive thin film stack includes a plurality of thin film layers. In yet another embodiment, the light absorptive thin film stack includes a spacer layer over a reflective layer and an absorber layer over the spacer layer. In still another embodiment, the light absorptive thin film stack is less than 200 nanometers thick. In yet a further embodiment, a light absorptive thin film stack is used to seal a substrate having glass, plastic, metal, or silicon to a backplate having glass, plastic, metal, or silicon. Thus, the light absorptive thin film stack is used to seal similar or dissimilar materials through a bonding process.

Abstract: Embodiments of exemplary MEMS interferometric modulators are arranged at intersections of rows and columns of electrodes. In certain embodiments, the column electrode has a lower electrical resistance than the row electrode. A driving circuit applies a potential difference of a first polarity across electrodes during a first phase and then quickly transition to applying a bias voltage having a polarity opposite to the first polarity during a second phase. In certain embodiments, an absolute value of the difference between the voltages applied to the row electrode is less than an absolute value of the difference between the voltages applied to the column electrode during the first and second phases.