Patents Assigned to Quantum Chemical Technologies (Singapore) Pte Ltd
  • Methods of purifying nanostructures
    Patent number: 10843273
    Abstract: The present invention relates to methods of purifying nanostructures. The nanostructures may be silver nanowires.
    Type: Grant
    Filed: November 11, 2016
    Date of Patent: November 24, 2020
    Assignee: QUANTUM CHEMICAL TECHNOLOGIES (SINGAPORE) PTE. LTD.
    Inventors: Kai Hwa Chew, Meng Kiong Lim, Yong Ling Wu, Hui Huang
  • Solders
    Patent number: 7472817
    Abstract: A substantially lead-free solder, comprising: from around 96.8% to around 99.3% tin; from around 0.2% to around 3.0% copper; and from around 0.02% to around 0.12% silicon.
    Type: Grant
    Filed: February 12, 2007
    Date of Patent: January 6, 2009
    Assignees: Quantum Chemical Technologies (Singapore) Pte. Ltd, Singapore Asahi Chemical & Solder Industries Pte.
    Inventors: Kai Hwa Chew, Vincent Yue Sern Kho
  • Solders
    Publication number: 20070125834
    Abstract: A substantially lead-free solder, comprising: from around 96.8% to around 99.3% tin; from around 0.2 % to around 3.0% copper; and from around 0.02% to around 0.12% silicon.
    Type: Application
    Filed: February 12, 2007
    Publication date: June 7, 2007
    Applicants: Quantum Chemical Technologies (Singapore) Pte. Ltd., Singapore Asahi Chemical & Solder Industries Pte. Ltd.
    Inventors: Kai CHEW, Vincent KHO
  • Solders
    Publication number: 20060088439
    Abstract: A substantially lead-free solder, comprising: from around 96.8% to around 99.3% tin; from around 0.2% to around 3.0% copper; and from around 0.02% to around 0.12% silicon.
    Type: Application
    Filed: January 28, 2005
    Publication date: April 27, 2006
    Applicant: Quantum Chemical Technologies (Singapore) Pte. Ltd
    Inventors: Kai Chew, Vincent Kho
  • Solders
    Patent number: 6843862
    Abstract: A substantially lead-free solder with enhanced properties comprises from 88.5% to 93.5% tin; from 3.5% to 4.5% silver; from 2.0% to 6.0% indium; and from 0.3% to 1.0% copper. The solder may also comprise up to 0.5% of an anti-oxidant or anti-skinning additive. A solder embodying the invention finds particular utility in wave-soldering processes where it may be used as a direct replacement for conventional tin/lead solder.
    Type: Grant
    Filed: August 17, 2001
    Date of Patent: January 18, 2005
    Assignees: Quantum Chemical Technologies (Singapore) Pte Ltd, Singapore Asahi Chemical and Solder Industries Pte Ltd
    Inventors: Kai Hwa Chew, Wei Chih Pan
  • Solders
    Publication number: 20030007886
    Abstract: A substantially lead-free solder with enhanced properties comprises from 88.5% to 93.5% tin; from 3.5% to 4.5% silver; from 2.0% to 6.0% indium; and from 0.3% to 1.0% copper. The solder may also comprise up to 0.5% of an anti-oxidant or anti-skinning additive. A solder embodying the invention finds particular utility in wave-soldering processes where it may be used as a direct replacement for conventional tin/lead solder.
    Type: Application
    Filed: August 17, 2001
    Publication date: January 9, 2003
    Applicant: Quantum Chemical Technologies ( Singapore) Pte Ltd.
    Inventors: Chew Kai Hwa, Chih Pan Wei
  • Solders
    Publication number: 20020057986
    Abstract: A solder comprising: between 87.2% and 89.5% tin; between 4.0% and 4.8% bismuth; between 3.5% and 4.5% indium; and between 3.0% and 3.5% silver.
    Type: Application
    Filed: August 17, 2001
    Publication date: May 16, 2002
    Applicant: Quantum Chemical Technologies (Singapore) Pte Ltd.
    Inventors: Kai Hwa Chew, Wei Chih Pan